Transmissive liquid crystal panel

ABSTRACT

A transmissive liquid crystal panel includes a pixel region where a plurality of pixels are arrayed, a liquid crystal layer configured to modulate light for each of the pixels, an incident section configured to make the light incident on the liquid crystal layer, an emission section configured to emit, as image light, the light modulated by the liquid crystal layer, and a vapor chamber including an opening section corresponding to the pixel region, a heat receiving section around the opening section, and a heat radiating section configured to radiate heat received by heat receiving section, the vapor chamber vaporizing, with the heat received, a coolant in a liquid phase encapsulated on an inside of the vapor chamber and radiating, with the heat radiating section, heat of the coolant in a gas phase to thereby condense the coolant in the gas phase into the coolant in the liquid phase.

The present application is based on, and claims priority from JPApplication Serial Number 2021-123692, filed Jul. 28, 2021, thedisclosure of which is hereby incorporated by reference herein in itsentirety.

BACKGROUND 1. Technical Field

The present disclosure relates to a transmissive liquid crystal panel.

2. Related Art

There has been known a projector including a cooling device that cools aliquid crystal panel (see, for example, JP-A-2019-74695 (PatentLiterature 1)). In the projector described in Patent Literature 1, theliquid crystal panel is housed in a frame body. A channel for a liquidcoolant circulated by the cooling device is provided in the frame body.The frame body is a cooling section that cools the liquid crystal panelby transferring, to the liquid coolant, heat transferred from the liquidcrystal panel. The liquid crystal panel and the frame body are housed ina first sealed housing. A heat exchanger and a blower fan are providedin the first sealed housing. The liquid coolant circulated by thecooling device flows to the heat exchanger. The heat exchanger transfersthe heat of gas in the first sealed housing to the liquid coolant tothereby cool the gas in the first sealed housing. The gas in the firstsealed housing is circulated in the first sealed housing by the blowerfan and cools the liquid crystal panel.

The cooling device includes a pump that pressure-feeds the liquidcoolant, a radiator that cools the liquid coolant, and a plurality ofpipes in which the liquid coolant circulates. In a part of the pluralityof pipes, couplers are provided to make it possible to replacecomponents to which the liquid coolant is circulated by the part of thepipes.

However, in the projector described in Patent Literature 1, since theliquid coolant flows to the frame body that houses the liquid crystalpanel, a pipe is provided in the frame body. When such a pipe isprovided, if necessity for replacing the liquid crystal panel arises, itis necessary to detach the liquid crystal panel while preventing theliquid coolant from leaking. Therefore, replacement work for the liquidcrystal panel is complicated. Such a problem also occurs when the liquidcrystal panel is built in the projector.

A pump and a tank are necessary to circulate the liquid coolant thatflows to the frame body. Therefore, the cooling device and the projectorincrease in size.

Accordingly, there have been demands for a configuration that canachieve simplification of a replacing process and an incorporatingprocess for a liquid crystal panel and a reduction in the size of adevice on which the liquid crystal panel is mounted.

SUMMARY

A transmissive liquid crystal panel according to a first aspect of thepresent disclosure includes: a pixel region where a plurality of pixelsare arrayed; a liquid crystal layer configured to modulate light foreach of the plurality of pixels; an incident section configured to makethe light incident on the liquid crystal layer; an emission sectionconfigured to emit, as image light, the light modulated by the liquidcrystal layer; and a vapor chamber including an opening sectioncorresponding to the pixel region, a heat receiving section providedaround the opening section, and a heat radiating section configured toradiate heat received by the heat receiving section, the vapor chambervaporizing, with the heat received by the heat receiving section, acoolant in a liquid phase encapsulated on an inside of the vapor chamberand radiating, with the heat radiating section, heat of the coolant in agas phase to thereby condense the coolant in the gas phase into thecoolant in the liquid phase.

A transmissive liquid crystal panel according to a second aspect of thepresent disclosure includes: a pixel region where a plurality of pixelsare arrayed; a liquid crystal layer configured to modulate light foreach of the plurality of pixels; a counter substrate including a commonelectrode provided to correspond to the pixel region; a pixel substrateincluding a plurality of pixel electrodes provided to respectivelycorrespond to the plurality of pixels, the pixel substrate carrying theliquid crystal layer between the pixel substrate and the countersubstrate; a first dustproof substrate provided on a surface on anopposite side of the pixel substrate in the counter substrate; a seconddustproof substrate provided on a surface on an opposite side of thecounter substrate in the pixel substrate; a first vapor chamberincluding a first opening section corresponding to the pixel region, afirst heat receiving section provided around the first opening sectionand coupled to at least one of the counter substrate and the firstdustproof substrate in a heat transferable manner, and a first heatradiating section configured to radiate heat received by the first heatreceiving section, the first vapor chamber vaporizing, with the heatreceived by the first heat receiving section, a first coolant in aliquid phase encapsulated on an inside of the first vapor chamber andradiating, with the first heat radiating section, heat of the firstcoolant in a gas phase to thereby condense the first coolant in the gasphase into the first coolant in the liquid phase; and a second vaporchamber including a second opening section corresponding to the pixelregion, a second heat receiving section provided around the secondopening section and coupled to at least one of the pixel substrate andthe second dustproof substrate in a heat transferable manner, and asecond heat radiating section configured to radiate heat received by thesecond heat receiving section, the second vapor chamber vaporizing, withthe heat received by the second heat receiving section, a second coolantin the liquid phase encapsulated on an inside of the second vaporchamber and radiating, with the second heat radiating section, heat ofthe second coolant in the gas phase to thereby condense the secondcoolant in the gas phase into the second coolant in the liquid phase.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic diagram showing the configuration of a projectoraccording to a first embodiment.

FIG. 2 is a perspective view showing an image forming unit according tothe first embodiment.

FIG. 3 is an exploded perspective view showing a liquid crystal paneland a holding member according to the first embodiment.

FIG. 4 is an exploded perspective view showing the liquid crystal paneland the holding member according to the first embodiment.

FIG. 5 is a sectional view showing the liquid crystal panel according tothe first embodiment.

FIG. 6 is a perspective view showing a main body section of an emissionside cooling member according to the first embodiment.

FIG. 7 is a perspective view showing a first heat radiating memberattached to the main body section according to the first embodiment.

FIG. 8 is a schematic diagram showing a cross section of the liquidcrystal panel according to the first embodiment.

FIG. 9 is a schematic diagram showing a cross section of a modificationof the liquid crystal panel according to the first embodiment.

FIG. 10 is a schematic diagram showing a cross section of a modificationof the liquid crystal panel according to the first embodiment.

FIG. 11 is a schematic diagram showing a cross section of a liquidcrystal panel included in a projector according to a second embodiment.

FIG. 12 is a schematic diagram showing a cross section of a modificationof the liquid crystal panel according to the second embodiment.

FIG. 13 is a schematic diagram showing a cross section of a modificationof the liquid crystal panel according to the second embodiment.

FIG. 14 is a schematic diagram showing a cross section of a liquidcrystal panel included in a projector according to a third embodiment.

FIG. 15 is a schematic diagram showing a cross section of a modificationof the liquid crystal panel according to the third embodiment.

FIG. 16 is a schematic diagram showing a cross section of a modificationof the liquid crystal panel according to the third embodiment.

FIG. 17 is a schematic diagram showing a cross section of a liquidcrystal panel included in a projector according to a fourth embodiment.

FIG. 18 is a schematic diagram showing a cross section of a modificationof the liquid crystal panel according to the fourth embodiment.

FIG. 19 is a schematic diagram showing a cross section of a modificationof the liquid crystal panel according to the fourth embodiment.

FIG. 20 is a schematic diagram showing a cross section of a liquidcrystal panel included in a projector according to a fifth embodiment.

FIG. 21 is a schematic diagram showing a cross section of a modificationof the liquid crystal panel according to the fifth embodiment.

FIG. 22 is a schematic diagram showing a cross section of a modificationof the liquid crystal panel according to the fifth embodiment.

FIG. 23 is a schematic diagram showing a cross section of a liquidcrystal panel included in a projector according to a sixth embodiment.

FIG. 24 is a schematic diagram showing a cross section of a modificationof the liquid crystal panel according to the sixth embodiment.

FIG. 25 is a schematic diagram showing a cross section of a modificationof the liquid crystal panel according to the sixth embodiment.

FIG. 26 is a schematic diagram showing a cross section of a liquidcrystal panel included in a projector according to a seventh embodiment.

FIG. 27 is a schematic diagram showing a cross section of a modificationof the liquid crystal panel according to the seventh embodiment.

FIG. 28 is a schematic diagram showing a cross section of a modificationof the liquid crystal panel according to the seventh embodiment.

FIG. 29 is a schematic diagram showing a cross section of a modificationof the liquid crystal panel according to the seventh embodiment.

FIG. 30 is a schematic diagram showing a cross section of a modificationof the liquid crystal panel according to the seventh embodiment.

FIG. 31 is a schematic diagram showing a cross section of a modificationof the liquid crystal panel according to the seventh embodiment.

FIG. 32 is a schematic diagram showing a cross section of a liquidcrystal panel included in a projector according to the seventhembodiment.

FIG. 33 is a schematic diagram showing a cross section of a modificationof the liquid crystal panel according to the seventh embodiment.

FIG. 34 is a schematic diagram showing a cross section of a modificationof the liquid crystal panel according to the seventh embodiment.

FIG. 35 is a schematic diagram showing a cross section of a modificationof the liquid crystal panel according to the seventh embodiment.

FIG. 36 is a schematic diagram showing a cross section of a modificationof the liquid crystal panels according to the embodiments.

DESCRIPTION OF EXEMPLARY EMBODIMENTS First Embodiment

A first embodiment of the present disclosure is explained below withreference to the drawings.

Schematic Configuration of a Projector

FIG. 1 is a schematic diagram showing the configuration of a projector 1according to this embodiment.

The projector 1 according to this embodiment modulates light emittedfrom a light source to form an image corresponding to image informationand enlarges and projects the formed image onto a projection surfacesuch as a screen. The projector 1 includes, as shown in FIG. 1 , anexterior housing 2 and an image projection device 3. Besides, althoughnot illustrated, the projector 1 includes a cooling device that coolscooling targets configuring the projector 1, a power supply device thatsupplies electric power to electronic components configuring theprojector 1, and a control device that controls the operation of theprojector 1.

Configuration of the Exterior Housing

The exterior housing 2 configures the exterior of the projector 1 andhouses the image projection device 3, the cooling device, the powersupply device, and the control device on the inside.

The exterior housing 2 includes a front surface section 21, a rearsurface section 22, and a left side surface section 23 and a right sidesurface section 24 provided on the left side and the right side of thefront surface section 21. Although not illustrated, the exterior housing2 includes a top surface section that couples one end portions in thesurface sections 21 to 24 and a bottom surface section that couples theother end portions in the surface sections 21 to 24. The exteriorhousing 2 is formed in, for example, a substantially rectangularparallelepiped shape.

The right side surface section 24 includes an air intake port 241. Theair intake port 241 introduces air on the outside of the exteriorhousing 2 into the inside of the exterior housing 2 as a cooling gas. Afilter that collects dust included in the air passing through the airintake port 241 may be provided in the air intake port 241.

The front surface section 21 includes a passage port 211 locatedsubstantially in the center in the front surface section 21. Lightprojected from a projection optical device 37 explained below passesthrough the passage port 211.

The front surface section 21 includes an exhaust port 212 located on theleft side surface section 23 side in the front surface section 21. Theexhaust port 212 discharges the cooling gas having cooled the coolingtargets provided in the exterior housing 2 to the outside of theexterior housing 2.

Configuration of the Image Projection Device

The image projection device 3 forms an image corresponding to imageinformation input from the control device and projects the formed image.The image projection device 3 includes a light source 31, a uniformizingsection 32, a color separating section 33, a relay section 34, an imageforming section 35, a housing for optical components 36, and aprojection optical device 37.

The light source 31 emits illumination light to the uniformizing section32. As the configuration of the light source 31, for example, aconfiguration including a solid-state light source that emits bluelight, which is excitation light, and a wavelength conversion elementthat converts a part of the blue light emitted from the solid-statelight source into fluorescent light including green light and red lightcan be illustrated. As other configurations of the light source 31, aconfiguration including a light source lamp such as an ultrahighpressure mercury lamp as a light source can be illustrated and aconfiguration including solid-state light sources includingsemiconductor lasers or light emitting elements that individually emitthe blue light, the green light, and the red light can be illustrated.

The uniformizing section 32 uniformizes light emitted from the lightsource 31. The uniformized light illuminates a modulation region ofliquid crystal panels 4A explained below through the color separatingsection 33 and the relay section 34. The uniformizing section 32includes two lens arrays 321 and 322, a polarization conversion element323, and a superimposing lens 324.

The color separating section 33 separates light made incident from theuniformizing section 32 into color lights of red, green, and blue. Thecolor separating section 33 includes two dichroic mirrors 331 and 332and a reflection mirror 333 that reflects the blue light separated bythe dichroic mirror 331.

The relay section 34 is provided in an optical path of the red lightlonger than optical paths of the other color lights and suppresses aloss of the red light. The relay section 34 includes an incident sidelens 341, a relay lens 343, and reflection mirrors 342 and 344. In thisembodiment, the relay section 34 is provided on the optical path of thered light. However, not only this, but, for example, color light havingan optical path longer than the optical paths of the other color lightsmay be the blue light and the relay section 34 may be provided on theoptical path of the blue light.

The image forming section 35 modulates the color lights of red, green,and blue made incident thereon, combines the modulated color lights, andforms an image. The image forming section 35 includes three field lenses351 and three incident side polarizing plates 352 provided to correspondto the color lights made incident thereon and an image forming unit353A.

The image forming unit 353A includes three liquid crystal panels 4A,three viewing angle compensation plates 354, three emission sidepolarizing plates 355, and one color combining section 356 and isobtained by integrating the liquid crystal panels 4A, the viewing anglecompensation plates 354, the emission side polarizing plates 355, andthe color combining section 356.

The liquid crystal panels 4A modulate, according to an image signalinput from the control device, light emitted from the light source 31.Specifically, the liquid crystal panels 4A modulate, based on the inputimage signal, lights emitted from the incident side polarizing plates352 and emit the modulated lights as image lights. The liquid crystalpanels 4A include a liquid crystal panel 4AR that modulates the redlight, a liquid crystal panel 4AG that modulates the green light, and aliquid crystal panel 4AB that modulates the blue light. The liquidcrystal panels 4A are transmissive liquid crystal panels that emitmodulated lights along light incident directions with respect to theliquid crystal panels 4A. Liquid crystal light valves are configured bythe incident side polarizing plates 352, the liquid crystal panels 4A,and the emission side polarizing plates 355.

A detailed configuration of the liquid crystal panels 4A is explained indetail below.

The color combining section 356 combines the three color lightsmodulated by the liquid crystal panels 4AB, 4AG, and 4AR. Image lightcombined by the color combining section 356 is made incident on theprojection optical device 37. In this embodiment, the color combiningsection 356 is configured by a cross dichroic prism having asubstantially rectangular parallelepiped shape. The cross dichroic prismis, for example, a prism having a substantially rectangularparallelepiped shape obtained by sticking together four prisms having aright angled triangular prism shape. Two dielectric multilayer filmscrossing each other are provided on interfaces of the four prisms.

FIG. 2 is a perspective view showing the image forming unit 353A.

The color combining section 356 includes, as shown in FIG. 2 , threeincident surfaces 356R, 356G, and 356B that are opposed to the liquidcrystal panels 4AR, 4AG, and 4AB and on which the color lights havingpassed through the liquid crystal panels 4AR, 4AG, and 4AB are madeincident and one emission surface 356S. Among the three color lightsmade incident on the incident surfaces 356R, 356G, and 356B, the bluelight and the red light are reflected toward the projection opticaldevice 37 by the two dielectric multilayer films and the green lightpasses through the two dielectric multilayer films toward the projectionoptical device 37. Consequently, the three color lights are combined.The combined image light is emitted from the emission surface 356Stoward the projection optical device 37.

As shown in FIG. 2 , the image forming unit 353A includes three holdingmembers 357 besides the components explained above.

Each of the three holding members 357 holds the liquid crystal panel 4Aand the emission side polarizing plate 355 explained below and is fixedto an incident surface corresponding thereto among the incident surfaces356R, 356G, and 356R.

FIG. 3 is an exploded perspective view of the liquid crystal panel 4Aand the holding member 357 viewed from a light incident side of theliquid crystal panel 4A. FIG. 4 is an exploded perspective view of theliquid crystal panel 4A and the holding member 357 viewed from a lightemission side of the liquid crystal panel 4A.

As shown in FIGS. 3 and 4 , the holding member 357 includes an attachingsection 358 and four inserting sections 359 for protrusions.

The attaching section 358 is formed in a rectangular frame shape andattached to the corresponding incident surface by bonding or the like.The attaching section 358 includes an opening section 3581 and a holdingsection 3582.

The opening section 3581 is formed in a rectangular shape substantiallyin the center of the attaching section 358. Light having passed throughthe emission side polarizing plate 355 passes through the openingsection 3581 toward the color combining section 356.

The holding section 3582 holds the emission side polarizing plate 355.

The four inserting sections 359 project to the liquid crystal panel 4Aside from portions corresponding to four corners in the attachingsection 358. The four inserting sections 359 are inserted into positionadjusting sections 483 of the liquid crystal panel 4A and, thereafter,bonded and fixed to the liquid crystal panel 4A by an adhesive such asan ultraviolet curing adhesive.

The liquid crystal panel 4A is integrated with the color combiningsection 356 by such a holding member 357. However, the color combiningsection 356 may be configured by, for example, a plurality of dichroicmirrors without being limited to be configured by the cross dichroicprism having the substantially rectangular parallelepiped shape.

As shown in FIG. 1 , the housing for optical components 36 houses thesections 32 to 34 and the field lenses 351 explained above on theinside. In the image projection device 3, an illumination light axis Ax,which is an optical axis in design, is set. The housing for opticalcomponents 36 holds the sections 32 to 34 and the field lenses 351 inpredetermined positions on the illumination light axis Ax. The lightsource 31, the image forming unit 353A, and the projection opticaldevice 37 are disposed in predetermined positions on the illuminationlight axis Ax.

The projection optical device 37 is a projection lens that enlarges andprojects an image made incident from the image forming section 35 ontothe projection surface. That is, the projection optical device 37projects image light modulated by the liquid crystal panel 4A. As theprojection optical device 37, a group lens including a plurality oflenses and a tubular lens barrel in which the plurality of lenses arehoused can be illustrated.

Configuration of the Liquid Crystal Panel

As explained above, the liquid crystal panel 4A is the transmissiveliquid crystal panel that modulates light made incident from theincident side polarizing plate 352 and is disposed in the positioncorresponding to each of the incident surfaces of the color combiningsection 356 by the holding member 357. The liquid crystal panel 4Aincludes, as shown in FIGS. 3 and 4 , a panel main body 41, a wire 49configured by a flat cable, a holding housing 50, and an emission sidecooling member 6A.

In the following explanation, three directions orthogonal to one anotherare represented as a +X direction, a +Y direction, and a +Z direction.In this embodiment, the +Z direction is a traveling direction of lightmade incident on the liquid crystal panel 4A. A right direction in thecase in which the liquid crystal panel 4A is viewed along the +Zdirection such that the +Y direction coincides with the upward directionis the +X direction. Although not illustrated, the opposite direction ofthe +X direction is represented as a −X direction, the oppositedirection of the +Y direction is represented as a −Y direction, and theopposite direction of the +Z direction is represented as a −Z direction.That is, the +Z direction with respect to the liquid crystal panel 4A isthe light emission side with respect to the liquid crystal panel 4A andthe −Z direction with respect to the liquid crystal panel 4A is thelight incident side with respect to the liquid crystal panel 4A.

Configuration of the Panel Main Body

FIG. 5 is a sectional view showing the liquid crystal panel 4A.

The panel main body 41 modulates light made incident thereon. The panelmain body 41 includes a pixel region 41A in which a plurality of pixelsare arrayed. The pixel region 41A is a region where a plurality ofpixels are arrayed in the liquid crystal panel 4A and light madeincident thereon is modulated based on an input image signal. Each ofthe plurality of pixels is capable of individually modulating light.

The panel main body 41 includes, as shown in FIG. 5 , a liquid crystallayer 42, an incident section 43, and an emission section 46. That is,the liquid crystal panel 4A is a transmissive liquid crystal panelincluding the pixel region 41A.

Configuration of the Liquid Crystal Layer

The liquid crystal layer 42 is formed by liquid crystal encapsulatedbetween the incident section 43 and the emission section 46.Specifically, the liquid crystal layer 42 is formed by liquid crystalencapsulated between a counter substrate 44 configuring the incidentsection 43 and a pixel substrate 47 configuring the emission section 46.

The liquid crystal layer 42 modulates, according to an input imagesignal, light made incident via the incident section 43. That is, theliquid crystal layer 42 is a modulating section that modulates lightmade incident thereon in the pixel region 41A. The liquid crystal layer42 configures a main portion of the pixel region 41A.

Light is made incident on the liquid crystal layer 42, whereby heat isgenerated by the liquid crystal layer 42. The heat generated by theliquid crystal layer 42 is transferred to the incident section 43 andthe emission section 46 that sandwich the liquid crystal layer 42.

Configuration of the Incident Section

The incident section 43 is provided on the light incident side withrespect to the liquid crystal layer 42 and transmits light to be madeincident on the liquid crystal layer 42 to thereby make the lightincident on the liquid crystal layer 42. The incident section 43includes the counter substrate 44 that sandwiches the liquid crystallayer 42 in conjunction with the pixel substrate 47 and an incident sidedustproof substrate 45 provided on the counter substrate 44.

Configuration of the Counter Substrate

The counter substrate 44 is a light transmissive incident side electrodesubstrate disposed on the light incident side with respect to the liquidcrystal layer 42 and coupled to the liquid crystal layer 42 in a heattransferable manner. Although not illustrated, the counter substrate 44includes a counter electrode functioning as a common electrodeelectrically coupled to the liquid crystal layer 42 and a supportingsubstrate that supports the counter electrode. The counter electrode isequivalent to the incident side electrode and configures the pixelregion 41A. When viewed along a traveling direction of light madeincident on the pixel region 41A, the area of the counter substrate 44is larger than the area of the pixel region 41A. That is, when viewedfrom the −Z direction, the area of the counter substrate 44 is largerthan the area of the pixel region 41A.

The counter substrate 44 includes a light incident surface 441 that is asurface on the light incident side and on which light is made incidentand a light emission surface 442 that is a surface on the light emissionside and from which light having passed through the counter substrate 44is emitted.

The heat generated by the liquid crystal layer 42 is transferred to thecounter substrate 44.

Configuration of the Incident Side Dustproof Substrate

The incident side dustproof substrate 45 is a light transmissivesubstrate provided in a portion corresponding to the pixel region 41A onthe light incident surface 441 of the counter substrate 44. That is,when the liquid crystal panel 4A is viewed from the −Z direction, theincident side dustproof substrate 45 is provided on the light incidentsurface 441 in a heat transferable manner to cover the pixel region 41A.

The incident side dustproof substrate 45 prevents a situation in whichdust and the like adhere to a region corresponding to the pixel region41A on the light incident surface 441 and shadows of the dust and thelike penetrate into image light. When viewed along the travelingdirection of the light made incident on the pixel region 41A, the areaof the incident side dustproof substrate 45 is larger than the area ofthe pixel region 41A. Specifically, when viewed from the −Z direction,the area of the incident side dustproof substrate 45 is larger than thearea of the pixel region 41A and is smaller than the area of the countersubstrate 44.

The incident side dustproof substrate 45 includes a light incidentsurface 451, a light emission surface 452, and a side surface 453 and isformed in a substantially rectangular parallelepiped shape.

The light incident surface 451 is a surface on the light incident sidein the incident side dustproof substrate 45 and is a surface on whichlight emitted from the incident side polarizing plate 352 is madeincident.

The light emission surface 452 is a surface on the light emission sidein the incident side dustproof substrate 45 and is a surface from whichlight passing through the incident side dustproof substrate 45 isemitted. The light emission surface 452 is coupled to the light incidentsurface 441 of the counter substrate 44.

The side surface 453 is a surface that couples the light incidentsurface 451 and the light emission surface 452.

The heat of the liquid crystal layer 42 is transferred to the incidentside dustproof substrate 45 via the counter substrate 44. That is, theincident side dustproof substrate 45 is coupled to the liquid crystallayer 42 via the counter substrate 44 in a heat transferable manner.

Configuration of the Emission Section

The emission section 46 is provided on the light emission side withrespect to the liquid crystal layer 42 and emits, as image light, lightmodulated by the liquid crystal layer 42. The emission section 46includes the pixel substrate 47 that sandwiches the liquid crystal layer42 in conjunction with the counter substrate 44 and an emission sidedustproof substrate 48 provided on the pixel substrate 47.

Configuration of the Pixel Substrate

The pixel substrate 47 is a light transmissive emission side electrodesubstrate disposed on the light emission side with respect to the liquidcrystal layer 42 and coupled to the liquid crystal layer 42 in a heattransferable manner. Although not illustrated, the pixel substrate 47includes a plurality of switching elements such as TFTs (Thin FilmTransistors), a plurality of pixel electrodes electrically coupled tothe liquid crystal layer 42, and a supporting substrate that supportsthe plurality of switching elements and the plurality of pixelelectrodes.

The plurality of pixel electrodes are equivalent to the emission sideelectrode and configure the pixel region 41A. Specifically, each of theplurality of pixel electrodes is provided to correspond to each of theplurality of pixels arrayed in the pixel region 41A and is electricallycoupled to the plurality of switching elements and portionscorresponding to the plurality of pixels in the liquid crystal layer 42.In other words, the plurality of pixel electrodes define the pluralityof pixels arrayed in the pixel region 41A. When viewed from an emittingdirection of image light emitted from the pixel substrate 47, the areaof the pixel substrate 47 is larger than the area of the pixel region41A.

The pixel substrate 47 is a surface on the light incident side andincludes a light incident surface 471 on which light modulated by theliquid crystal layer 42 is made incident and a light emission surface472 that is disposed on the light emission side and from which lighthaving passed through the pixel substrate 47 is emitted.

The heat generated by the liquid crystal layer 42 is transferred to thepixel substrate 47.

Configuration of the Emission Side Dustproof Substrate

The emission side dustproof substrate 48 is a light transmissivesubstrate provided in a portion corresponding to the pixel region 41A onthe light emission surface 472 of the pixel substrate 47. That is, whenthe liquid crystal panel 4A is viewed from the light emission side, theemission side dustproof substrate 48 is provided on the light emissionsurface 472 in a heat transferable manner to cover the pixel region 41A.

The emission side dustproof substrate 48 prevents a situation in whichdust and the like directly adhere to the pixel substrate 47 and shadowsof the dust and the like penetrate into image light. When viewed from anemitting direction of image light emitted from the liquid crystal layer42, the area of the emission side dustproof substrate 48 is larger thanthe area of the pixel region 41A. Specifically, when viewed from the +Zdirection, the area of the emission side dustproof substrate 48 islarger than the area of the pixel region 41A and smaller than the areaof the pixel substrate 47.

The emission side dustproof substrate 48 includes a light incidentsurface 481, a light emission surface 482, and a side surface 483 and isformed in a substantially rectangular parallelepiped shape.

The light incident surface 481 is a surface on the light incident sidein the emission side dustproof substrate 48 and is a surface that iscoupled to the light emission surface 472 of the pixel substrate 47 andon which light emitted from the light emission surface 472 is madeincident.

The light emission surface 482 is a surface on the light emission sidein the emission side dustproof substrate 48 and is a surface from whichlight having passed through the emission side dustproof substrate 48 isemitted.

The side surface 483 is a surface that couples the light incidentsurface 481 and the light emission surface 482.

The heat of the liquid crystal layer 42 is transferred to the emissionside dustproof substrate 48 via the pixel substrate 47. That is, theemission side dustproof substrate 48 is coupled to the liquid crystallayer 42 via the pixel substrate 47 in a heat transferable manner.

Configuration of the Wire

The wire 49 applies an applied voltage corresponding to an image signalbetween the plurality of pixel electrodes provided on the pixelsubstrate 47 and the counter electrode of the counter substrate 44 in aregion corresponding to the plurality of pixels in the liquid crystallayer 42. That is, the wire 49 supplies an image signal for driving theliquid crystal layer 42.

The wire 49 is electrically coupled to the pixel substrate 47.Specifically, the wire 49 extends in the +Y direction from each of thecounter substrate 44 and the pixel substrate 47 and is coupled to anot-shown control device. In this embodiment, the wire 49 is configuredby an FPC (Flexible Printed Circuit).

A driver circuit 491 that controls the operation of the panel main body41 according to an image signal input from the control device isprovided on a surface in the +Z direction in the wire 49. The drivercircuit 491 is thermally coupled to a first member 62 of the emissionside cooling member 6A.

Configuration of the Holding Housing

The holding housing 50 covers the panel main body 41, the countersubstrate 44, and a part of the wire 49 in the −Z direction. The holdinghousing 50 is combined with the emission side cooling member 6A tothereby hold the panel main body 41 on the inside. That is, the holdinghousing 50 is separate from the emission side cooling member 6Aexplained below. As shown in FIG. 3 , the holding housing 50 includes anopening section 501 and heat radiation fins 502. Besides, as shown inFIGS. 3 and 4 , the holding housing 50 includes four position adjustingsections 503.

As shown in FIG. 3 , the opening section 501 is provided in asubstantially rectangular shape to correspond to the pixel region 41Awhen viewed from the −Z direction. The opening section 501 allows lightemitted from the incident side polarizing plate 352 to pass and makesthe light incident on the incident side dustproof substrate 45.

A plurality of heat radiation fins 502 are provided to project in the −Zdirection from portions in the +Y direction with respect to the openingsection 501. The heat radiation fins 502 radiate heat transferred fromthe incident section 43 to the holding housing 50.

As shown in FIGS. 3 and 4 , the four position adjusting sections 503 areprovided at four corners of the holding housing 50 when viewed from the−Z direction. The position adjusting sections 503 are hole sections intowhich inserting sections 359 corresponding thereto are inserted from the+Z direction. The position of the holding housing 50 with respect to theincident surfaces of the color combining section 356 to which theholding member 357 is attached and the position of the liquid crystalpanel 4A are adjusted according to an insertion amount of the insertingsections 359 into the position adjusting sections 503. After theposition of the liquid crystal panel 4A is adjusted, as explained above,the inserting sections 359 and the position adjusting sections 503 arefixed by an adhesive.

Configuration of the Emission Side Cooling Member

The emission side cooling member 6A is disposed on the opposite side ofthe counter substrate 44 with respect to the pixel substrate 47 andthermally coupled to the pixel substrate 47. As shown in FIG. 5 , theemission side cooling member 6A includes a hollow encapsulating space SPin which a coolant is encapsulated. The emission side cooling member 6Avaporizes the coolant in a liquid phase with heat transferred from aheat generating body to thereby consume the heat transferred from theheat generating body and cool the heat generating body.

In this embodiment, the emission side cooling member 6A vaporizes thecoolant in the liquid phase into the coolant in a gas phase with theheat of the liquid crystal layer 42 transferred via the pixel substrate47 and the emission side dustproof substrate 48 to thereby cool theliquid crystal layer 42. That is, the emission side cooling member 6Acools the liquid crystal layer 42 with the vaporization of the coolantin the liquid phase.

The emission side cooling member 6A includes a main body section 61A anda first heat radiating member 68.

Configuration of the Main Body Section

FIG. 6 is a perspective view showing the main body section 61A.Specifically, FIG. 6 is a perspective view of the main body section 61Aviewed from a second member 63 side.

As shown in FIG. 6 , the main body section 61A includes the first member62 and the second member 63 and is configured by combining the firstmember 62 and the second member 63. In this embodiment, the main bodysection 61A is a vapor chamber. The encapsulating space SP (see FIG. 5 )is formed on the inside of the main body section 61A by combining thefirst member 62 and the second member 63. The coolant is encapsulated inthe encapsulating space SP. The main body section 61A extends further tothe outer side than the pixel substrate 47 and the emission sidedustproof substrate 48 when viewed from an emission side of lightemitted from the liquid crystal layer 42 (the +Z direction).

The first member 62 is a substrate formed in a flat shape and can bereferred to as first substrate as well. The first member 62 is acoupling portion coupled to the heat generating body in the main bodysection 61A and is configured to be capable of coming into contact withthe coolant in the liquid phase encapsulated in the encapsulating spaceSP. In the first member 62, a portion to which heat is transferred fromthe outside changes the coolant in the liquid phase in the encapsulatingspace SP into the coolant in a gas phase. That is, the first member 62vaporizes the coolant in the liquid phase with the transferred heat. Afirst surface 62A on the opposite side of the second member 63 in thefirst member 62 is a surface that is in contact with the heat generatingbody. In this embodiment, the first surface 62A is a flat surface.

The first member 62 includes a heat receiving section 621 that receivesthe heat of the heat generating body. That is, the main body section61A, which is the vapor chamber according to this embodiment, includesthe heat receiving section 621. The heat receiving section 621 isexplained in detail below.

The second member 63 is a substrate formed in a flat shape and can bereferred to as second substrate as well. The second member 63 is joinedto the first member 62 to form the encapsulating space SP in conjunctionwith the first member 62. The second member 63 is configured to becapable of coming into contact with the coolant in the gas phase in theencapsulating space SP.

The second member 63 includes a second surface 63A and a first heatradiating section 631.

The second surface 63A is a surface on the opposite side of the firstmember 62 in the second member 63.

The first heat radiating section 631 receives heat from the coolant inthe gas phase in the encapsulating space SP, condenses the coolant inthe gas phase into the coolant in the liquid phase, and radiates thereceived heat to the outside. That is, the first heat radiating section631 can be referred to as first condensing section as well. The positionof the first heat radiating section 631 is explained in detail below.

Such a second member 63 is disposed on the opposite side of the liquidcrystal layer 42 with respect to the first member 62 in the liquidcrystal panel 4A.

The main body section 61A includes an opening section 64.

The opening section 64 is a substantially rectangular opening sectionprovided to correspond to the pixel region 41A in the main body section61A. The opening section 64 pierces through the main body section 61Aalong a direction in which the first member 62 and the second member 63are opposed to each other (the +Z direction). Light passing through theliquid crystal panel 4A passes through the opening section 64. That is,the opening section 64 is a through-hole having an inner circumferentialsurface.

The inner circumferential surface of the opening section 64 is formed bya joining portion of the first member 62 and the second member 63.Accordingly, heat transferred to the inner edge of the opening section64 is transferred to the first member 62.

The main body section 61A extends from the opening section 64 in the +Ydirection. Specifically, the main body section 61A extends from theopening section 64 in an extending direction of the wire 49 from thepixel substrate 47 coupled to the liquid crystal layer 42 (the +Ydirection). In other words, the main body section 61A extends from theopening section 64 in an extending direction of the wire 49 from theliquid crystal layer 42 (the +Y direction).

Configuration of the Heat Receiving Section

The heat receiving section 621 is a portion that receives the heat ofthe heat generating body in the main body section 61A. Accordingly, inthis embodiment, a part of the heat receiving section 621 is providedaround the opening section 64 in the first member 62. In thisembodiment, the main body section 61A is provided such that the firstmember 62 is in contact with the pixel substrate 47 and theemission-side dustproof substrate 48. Therefore, the heat receivingsection 621 is a portion around the opening section 64 and is a portionthat is in contact with the pixel substrate 47 and the emission sidedustproof substrate 48 in the first member 62. In other words, the mainbody section 61A includes the heat receiving section 621 that isprovided around the opening section 64 in the first member 62 andreceives heat from the light emission surface 472 of the pixel substrate47, which is a heat generating body, and the side surface 483 of theemission side dustproof substrate 48, which is a heat generating body.

Although not illustrated, a portion corresponding to the heat receivingsection 621 on the inner surface of the encapsulating space SP can bereferred to as vaporizing section that vaporizes the coolant in theliquid phase with the heat received by the heat receiving section 621.

Specifically, in a portion coming into contact with the coolant in theliquid phase on the inner surface of the encapsulating space SP, aportion that receives transfer of the heat received by the heatreceiving section 621 and vaporizes the coolant in the liquid phase withthe heat is the vaporizing section.

Configuration of the First Heat Radiating Section

The first heat radiating section 631 is a portion that radiates the heatof the coolant in the gas phase flowing in the encapsulating space SP inthe main body section 61A.

Although not illustrated, a portion corresponding to the first heatradiating section 631 on the inner surface of the encapsulating space SPcan be referred to as a first condensing section that receives heat fromthe coolant in the gas phase and condenses the coolant in the gas phaseinto the coolant in the liquid phase. Specifically, in a portion cominginto contact with the coolant in the gas phase on the inner surface ofthe encapsulating space SP, a portion that receives the heat of thecoolant in the gas phase and condenses the coolant in the gas phase intothe coolant in the liquid phase is the first condensing section. Theheat received from the coolant in the gas phase by such a firstcondensing section is radiated by the first heat radiating section 631.

The first heat radiating section 631 is provided in the extendingdirection of the wire 49 from the liquid crystal layer 42 with respectto the opening section 64. The first heat radiating member 68 (see FIG.5 ) is provided in a position corresponding to the first heat radiatingsection 631 on the second surface 63A. Since the first heat radiatingmember 68 is provided in the first heat radiating section 631, the firstheat radiating section 631 is a portion that easily radiates the heatreceived from the coolant in the gas phase to the outside of the mainbody section 61A in the second member 63. Accordingly, in the emissionside cooling member 6A, a portion where the first heat radiating member68 is provided is configured as the first heat radiating section 631.

Configuration of the First Heat Radiating Member

FIG. 7 is a perspective view showing the first heat radiating member 68attached to the main body section 61A.

The first heat radiating member 68 radiates heat transferred from thefirst heat radiating section 631. As shown in FIG. 7 , the first heatradiating member 68 includes a plurality of fins 681.

The plurality of fins 681 are formed in a square cylinder shape anddisposed side by side in the +X direction. The plurality of fins 681include, on the insides, channels in which a cooling gas is capable offlowing along the +Y direction. A part of the cooling gas flowing to theliquid crystal panel 4A flows in the +Y direction along the secondsurface 63A and flows along the channels provided on the insides of thefins 681. Heat is transferred from the fins 681 to the cooling gasflowing in the channels.

The shape of the fin 681 may be another shape. For example, the fin 681may be a pin projecting to the opposite side of the first member 62. Inthis case, the shape of the pin may be one of a columnar shape, a prismshape, a truncated cone shape, and a truncated pyramid shape.

Disposition of the Emission Side Cooling Member with Respect to thePanel Main Body

FIG. 8 is a diagram schematically showing a cross section along a YZplane of the liquid crystal panel 4A.

As shown in FIG. 8 , the emission side cooling member 6A is provided onthe light emission side with respect to the liquid crystal layer 42.Specifically, the emission side cooling member 6A is provided on thelight emission surface 472 of the pixel substrate 47. That is, the firstsurface 62A of the first member 62 is coupled to the light emissionsurface 472 of the pixel substrate 47 in a heat transferable manner. Inthis embodiment, the pixel substrate 47 is equivalent to the emissionside substrate.

The emission side dustproof substrate 48 is disposed in the openingsection 64. The side surface 483 of the emission side dustproofsubstrate 48 is coupled to the inner circumferential surface of theopening section 64 via a thermally conductive adhesive in a heattransferable manner. That is, the inner circumferential surface of theopening section 64 is a part of the heat receiving section 621.

Transfer Route of Heat Generated by the Liquid Crystal Layer

A part of the heat generated by the liquid crystal layer 42 istransferred to the counter substrate 44 and the other heat istransferred to the pixel substrate 47. The heat transferred to thecounter substrate 44 is transferred to the incident side dustproofsubstrate 45 and the holding housing 50 and radiated.

A part of the heat transferred to the pixel substrate 47 is transferredto the heat receiving section 621. Another part of the heat istransferred to the heat receiving section 621 via the emission sidedustproof substrate 48. More specifically, in the emission side coolingmember 6A shown in FIG. 8 , the heat transferred from the liquid crystallayer 42 to the pixel substrate 47 is transferred to the heat receivingsection 621 that is in contact with the light emission surface 472 ofthe pixel substrate 47. On the other hand, the heat transferred to theemission side dustproof substrate 48 is transferred to the innercircumferential surface of the opening section 64 coupled to the sidesurface 483 of the emission side dustproof substrate 48 in a heattransferable manner.

The first member 62 including the heat receiving section 621 vaporizesthe coolant in the liquid phase in the encapsulating space SP with thetransferred heat of the liquid crystal layer 42 to thereby consume theheat of the liquid crystal layer 42 transferred to the first member 62.Consequently, the pixel substrate 47 and the emission side dustproofsubstrate 48 are cooled and the liquid crystal layer 42 is cooled.

The coolant in the gas phase flowing in the encapsulating space SP andreaching the first condensing section is condensed into the coolant inthe liquid phase by the first condensing section. Heat received from thecoolant in the gas phase by the first condensing section is transferredfrom the first heat radiating section 631 to the first heat radiatingmember 68 and radiated by the first heat radiating member 68.

Flow of the Cooling Gas Flowing to the Liquid Crystal Panel

The cooling gas circulated by a fan of the cooling device disposed inthe exterior housing 2 flows in the +Y direction with respect to theliquid crystal panel 4A. Specifically, the cooling gas flowing to theliquid crystal panel 4A is divided, at the end portion in the −Ydirection in the liquid crystal panel 4A, into the cooling gas flowingin a space on the light incident side with respect to the liquid crystalpanel 4A and the cooling gas flowing in a space on the light emissionside with respect to the liquid crystal panel 4A.

The cooling gas flowing in the space on the light incident side withrespect to the liquid crystal panel 4A flows in the +Y direction andcools the incident side dustproof substrate 45 and the holding housing50 in order. That is, the heat of the liquid crystal layer 42transferred to the incident side dustproof substrate 45 and the holdinghousing 50 is transferred to the cooling gas. A part of the heat ofelectronic components such as the driver circuit 491 provided in thewire 49 is transferred to the holding housing 50. Since the cooling gasflowing in the space on the light emission side with respect to theliquid crystal panel 4A flows to the heat radiation fins 502 of theholding housing 50, a part of the heat of the electronic components istransferred to the cooling gas by the heat radiation fins 502.Consequently, the electronic components are also cooled.

The cooling gas flowing in the space on the light emission side withrespect to the liquid crystal panel 4A flows in the +Y direction andcools the emission side dustproof substrate 48 and the first heatradiating member 68 in order. That is, the heat of the liquid crystallayer 42 transferred to the emission side dustproof substrate 48 and thefirst heat radiating member 68 is transferred to the cooling gas.

In this way, the cooling gas flows to the incident side dustproofsubstrate 45, the holding housing 50, the emission side dustproofsubstrate 48, and the first heat radiating member 68 to which the heatof the liquid crystal layer 42 is transferred, whereby the heat of theliquid crystal layer 42 is transferred to the cooling gas and the liquidcrystal layer 42 is cooled. In this embodiment, since the driver circuit491 is thermally coupled to the first member 62 of the emission sidecooling member 6A, a part of the heat of the driver circuit 491 istransferred to the first member 62 and, thereafter, transferred to thefirst heat radiating member 68 by the first heat radiating section 631of the second member 63 and transferred to the cooling gas flowing tothe first heat radiating member 68. Consequently, the driver circuit 491is cooled.

In the liquid crystal panel 4A, the first heat radiating section 631 isprovided further in the +Y direction than a coupling portion to thepixel substrate 47 and a coupling portion to the emission side dustproofsubstrate 48 in the first member 62. In other words, the first heatradiating section 631 is provided in the +Y direction with respect tothe opening section 64.

For this reason, the first condensing section that condenses the coolantin the gas phase into the coolant in the liquid phase is provided in the+Y direction with respect to the opening section 64.

Accordingly, when the liquid crystal panel 4A is disposed such that the+Y direction is the vertical direction upper side, the coolant in theliquid phase condensed by the first condensing section can betransported to, by not only the capillarity but also the gravity, thevaporizing section that receives transfer of the heat received by theheat receiving section 621 and vaporizes the coolant in the liquid phasewith the heat. Consequently, the change from the coolant in the liquidphase to the coolant in the gas phase in the vaporizing section can beaccelerated by the heat transferred from the liquid crystal layer 42 viathe pixel substrate 47 and the emission side dustproof substrate 48.That is, it is possible to improve heat radiation efficiency of the heatof the liquid crystal layer 42 and cooling efficiency of the liquidcrystal layer 42.

Effects of the First Embodiment

The projector 1 according to this embodiment explained above achievesthe following effects.

The projector 1 includes the liquid crystal panel 4A functioning as alight modulation device that modulates light emitted from the lightsource. The liquid crystal panel 4A is a transmissive liquid crystalpanel that emits modulated light along a traveling direction of lightmade incident on the liquid crystal panel.

The liquid crystal panel 4A includes the pixel region 41A, the liquidcrystal layer 42, the incident section 43, the emission section 46, andthe main body section 61A. The plurality of pixels are arrayed in thepixel region 41A. The liquid crystal layer 42 modulates light for eachof the plurality of pixels. The incident section 43 makes the lightincident on the liquid crystal layer 42. The emission section 46 emits,as image light, the light modulated by the liquid crystal layer 42. Themain body section 61A is the vapor chamber configuring the emission sidecooling member 6A. The main body section 61A includes the openingsection 64, the heat receiving section 621, and the first heat radiatingsection 631. The opening section 64 is provided in the main body section61A to correspond to the pixel region 41A. The heat receiving section621 is provided around the opening section 64. The first heat radiatingsection 631 is equivalent to the heat radiating section and radiatesheat received by the heat receiving section 621. The main body section61A vaporizes, with the heat received by the heat receiving section 621,the coolant in the liquid phase encapsulated in the encapsulating spaceSP provided on the inside of the main body section 61A and radiates theheat of the coolant in the gas phase with the first heat radiatingsection 631 to thereby condense the coolant in the gas phase into thecoolant in the liquid phase.

In the vapor chamber, a pipe for circulating the coolant and a wire forsupplying driving power are unnecessary. With the configurationexplained above, compared with when a cooling device in which thecoolant flows is provided and when a thermoelectric conversion elementsuch as a Peltier element for moving heat with electric power isprovided, it is possible to simplify the configuration of the liquidcrystal panel 4A. Therefore, it is possible to achieve a reduction inthe size of the projector 1 functioning as the device on which theliquid crystal panel 4A is mounted. Since it is possible to attach anddetach the liquid crystal panel 4A to and from the projector 1 withoutattaching and detaching the pipe and the wire, it is possible to easilycarry out replacement of the liquid crystal panel 4A. Further, since theheat receiving section 621 provided around the opening section 64corresponding to the pixel region 41A receives heat, it is possible toimprove uniformity of the temperature in the pixel region 41A.

In the liquid crystal panel 4A, the emission section 46 includes thepixel substrate 47 that is coupled to the liquid crystal layer 42 in aheat transferable manner and through which image light passes. The pixelsubstrate 47 is the light transmissive emission side substrate. Whenviewed from the emitting direction of the image light emitted from theliquid crystal layer 42, the area of the pixel substrate 47 is largerthan the area of the pixel region 41A. The main body section 61A, whichis the vapor chamber, is provided on the pixel substrate 47 in a heattransferable manner.

With such a configuration, since the main body section 61A is provided,in a heat transferable manner, on the pixel substrate 47 coupled to theliquid crystal layer 42 in a heat transferable manner, the heatreceiving section 821 easily receives the heat of the liquid crystallayer 42 via the pixel substrate 47. Therefore, it is possible to easilycool the liquid crystal layer 42.

In the liquid crystal panel 4A, the emission section 46 includes thepixel substrate 47. The pixel substrate 47 includes the emission sideelectrode electrically coupled to the liquid crystal layer 42. The pixelsubstrate 47 is the light transmissive emission side electrode substratedisposed on the light emission side with respect to the liquid crystallayer 42. The emission side substrate on which the main body section 61Aof the emission side cooling member 6A is provided is the pixelsubstrate 47.

With such a configuration, since the pixel substrate 47 is the lighttransmissive substrate directly coupled to the liquid crystal layer 42susceptible to heat, the heat receiving section 621 is coupled to thepixel substrate 47, whereby the heat generated by the liquid crystallayer 42 can be efficiently transferred to the heat receiving section621. Therefore, it is possible to improve the cooling efficiency of theliquid crystal layer 42.

In the liquid crystal panel 4A, the emission section 46 includes theemission side dustproof substrate 48 provided on the light emissionsurface 472 of the pixel substrate 47. The light emission surface 472 isequivalent to the surface on the light emission side in the pixelsubstrate 47. The emission side dustproof substrate 48 includes thelight incident surface 481, the light emission surface 482, and the sidesurface 483. The side surface 483 couples the light incident surface 481and the light emission surface 482. The light incident surface 481 isequivalent to the surface on the light incident side in the emissionside dustproof substrate 48. The light emission surface 482 isequivalent to the surface on the light emission side in the emissionside dustproof substrate 48. The heat receiving section 621 receivesheat from the light emission surface 472 in the pixel substrate 47 andthe side surface 483 in the emission side dustproof substrate 48.

With such a configuration, since the heat receiving section 621 iscoupled to each of the pixel substrate 47 and the emission sidedustproof substrate 48, the heat of the liquid crystal layer 42 can betransferred to the heat receiving section 621 via each of the pixelsubstrate 47 and the emission side dustproof substrate 48. Therefore,since the heat of the liquid crystal layer 42 can be efficientlytransferred to the heat receiving section 621, it is possible to improvethe cooling efficiency of the liquid crystal layer 42.

In the liquid crystal panel 4A, the pixel substrate 47 includes, as theemission side electrode, the plurality of pixel electrodes provided torespectively correspond to the plurality of pixels. The pixel substrate47 is the emission side electrode substrate disposed on the lightemission side with respect to the liquid crystal layer 42.

In a general transmissive liquid crystal panel, a counter substrate isdisposed on a light incident side with respect to a liquid crystal layerand a pixel substrate is disposed on a light emission side with respectto the liquid crystal layer.

Accordingly, since the emission side electrode substrate is the pixelsubstrate 47, by providing the main body section 61A having theconfiguration explained above in the general transmissive liquid crystalpanel, it is possible to configure the liquid crystal panel 4A that canachieve the effects explained above. Therefore, it is possible to simplyconfigure the liquid crystal panel 4A.

The liquid crystal panel 4A includes the wire 49 that supplies an imagesignal for driving the liquid crystal layer 42. The main body section61A, which is the vapor chamber, extends from the opening section 64 inthe extending direction of the wire 49 from the liquid crystal layer 42.

With such a configuration, compared with when the main body section 61Aextends from the opening section 64 in the −Y direction, which is theopposite direction of the extending direction of the wire 49, it ispossible to prevent an increase in the size of the liquid crystal panel4A.

In the liquid crystal panel 4A, the emission side cooling member 6Aincludes the first heat radiating member 68 that is provided in the mainbody section 61A, which is the vapor chamber, and emits heat transferredfrom the first heat radiating section 631.

The first heat radiating member 68 is equivalent to the heat radiatingmember. The first heat radiating member 68 is provided, with respect tothe opening section 64, in the +Y direction in which the main bodysection 61A extends from the opening section 64.

With such a configuration, it is possible to separate the pixelsubstrate 47 and the emission side dustproof substrate 48, which are theheat generating bodies coupled to the heat receiving section 621, andthe first heat radiating member 68. Consequently, it is possible toprevent the heat transferred to the first heat radiating member 68 fromaffecting the pixel substrate 47 and the emission side dustproofsubstrate 48.

First Modification Of The First Embodiment

In the liquid crystal panel 4A, the side surface 483 of the emissionside dustproof substrate 48 is coupled to the inner circumferentialsurface of the opening section 64, which is a part of the heat receivingsection 621, via a thermally conductive adhesive in a heat transferablemanner. However, not only this, but the side surface 483 and the innercircumferential surface of the opening section 64 may not be coupled ina heat transferable manner. The side surface 483 and the innercircumferential surface of the opening section 64 may be coupled by aheat transfer member such as a leaf spring in a heat transferablemanner. Besides, the entire side surface 483 is not always coupled tothe inner circumferential surface of the opening section 64 in a heattransferable manner. A part of the side surface 483 may be coupled tothe inner circumferential surface of the opening section 64 in a heattransferable manner.

Second Modification of the First Embodiment

In the liquid crystal panel 4A, the heat receiving section 621 of theemission side cooling member 6A is directly coupled to the lightemission surface 472 of the pixel substrate 47 and coupled to the sidesurface 483 of the emission side dustproof substrate 48 via thethermally conductive adhesive or the like in a heat transferable manner.However, not only this, but the heat receiving section 621 may bedirectly coupled to the emission side dustproof substrate 48 and may notbe directly coupled to the pixel substrate 47. For example, a heattransfer member capable of transferring heat from the pixel substrate 47to the heat receiving section 621 may be provided between the pixelsubstrate 47 and the heat receiving section 621.

FIG. 9 is a diagram schematically showing a cross section along a YZplane of a liquid crystal panel 4B, which is a modification of theliquid crystal panel 4A.

For example, the liquid crystal panel 4B shown in FIG. 9 may be adoptedinstead of the liquid crystal panel 4A.

The liquid crystal panel 4B includes the same components and the samefunctions as the components and the functions of the liquid crystalpanel 4A except that the liquid crystal panel 4B includes an emissionside cooling member 6B and a clamping member 51 instead of the emissionside cooling member 6A. That is, the liquid crystal panel 4B includesthe panel main body 41, the wire 49, the holding housing 50, theclamping member 51, and the emission side cooling member 6B.

The clamping member 51 is combined with the holding housing 50 andclamps the panel main body 41 in the +Z direction in conjunction withthe holding housing 50. That is, the clamping member 51 is disposed onthe light emission side with respect to the liquid crystal layer 42.Specifically, a part of the clamping member 51 is disposed between thepixel substrate 47 and the heat receiving section 621. The clampingmember 51 is formed by, for example, metal having satisfactory thermalconductivity.

The emission side cooling member 6B includes the same components and thesame functions as the components and the functions of the emission sidecooling member 6A except that the emission side cooling member 6Bincludes a main body section 61B instead of the main body section 61A.That is, the emission side cooling member 6B includes the main bodysection 61B and the first heat radiating member 68.

The main body section 61B includes the first member 62, the secondmember 63, and the opening section 64. The first member 62 includes thefirst surface 62A and the heat receiving section 621. The second member63 includes the second surface 63A and the first heat radiating section631.

In the emission side cooling member 6B, the first surface 62A of thefirst member 62 is not directly coupled to the pixel substrate 47 and iscoupled to the pixel substrate 47 via the clamping member 51 in a heattransferable manner. The first surface 62A is coupled to the lightemission surface 482 of the emission side dustproof substrate 48. Thatis, in the liquid crystal panel 4B, when viewed from a travelingdirection of light made incident on the liquid crystal layer 42 (the +Zdirection), the area of the emission side dustproof substrate 48 islarger than the area of the opening section 64 of the emission sidecooling member 6B. Accordingly, the emission side dustproof substrate 48is not disposed on the inner side of the opening section 64 and the mainbody section 61B is provided on the emission side dustproof substrate48.

Heat transferred to the emission side dustproof substrate 48 istransferred to the first member 62 on the first surface 62A.

That is, the heat receiving section 621 of the main body section 61B isa portion coupled to the light emission surface 482 of the emission sidedustproof substrate 48 in the first member 62 and is a portion coupledto the pixel substrate 47 via the clamping member 51 in a heattransferable manner.

In a heat quantity generated by the liquid crystal layer 42, a heatquantity transferred to the emission side dustproof substrate 48 via thepixel substrate 47 is larger than a heat quantity transferred to theclamping member 51 via the pixel substrate 47. Therefore, the heatreceiving section 621 may not be coupled to the clamping member 51 in aheat transferable manner.

Effects of the Second Modification of the First Embodiment

Such a liquid crystal panel 4B achieves the following effects besidesachieving the same effects as the effects of the liquid crystal panel 4Aexplained above.

In the liquid crystal panel 4B, the emission section 46 includes thepixel substrate 47 that includes the plurality of pixel electrodeselectrically coupled to the liquid crystal layer 42 and is disposed onthe light emission side with respect to the liquid crystal layer 42 andthe emission side dustproof substrate 48 provided on the light emissionsurface 472 in the pixel substrate 47. The emission side substrate onwhich the main body section 61B of the emission side cooling member 6Bis provided is the emission side dustproof substrate 48. The pixelsubstrate 47 is equivalent to the light transmissive emission sideelectrode substrate and the plurality of pixel electrodes are equivalentto the emission side electrode.

With such a configuration, the main body section 61B, which is the vaporchamber, is provided, in a heat transferable manner, on the emissionside dustproof substrate 48 provided further on the light emission sidethan the pixel substrate 47. Therefore, compared with when the main bodysection 61B is provided on the pixel substrate 47 to avoid the emissionside dustproof substrate 48, the main body section 61B can be easilycoupled to the emission section 46.

Since heat generated by the liquid crystal layer 42 is transferred tothe emission side dustproof substrate 48 via the pixel substrate 47, theheat of the liquid crystal layer 42 diffuses. In contrast, since thefirst member 62 of the main body section 61B is coupled to the lightemission surface 482 of the emission side dustproof substrate 48, it ispossible to make it easy to transfer the heat of the liquid crystallayer 42 to the heat receiving section 621 in the first member 62.

In the liquid crystal panel 4B, the main body section 61B, which is thevapor chamber, is provided on the light emission surface 482 of theemission side dustproof substrate 48. The light emission surface 482 isequivalent to the surface on the light emission side of the emissionside dustproof substrate 48.

With such a configuration, for example, compared with when the emissionside dustproof substrate 48 is disposed in the opening section 64corresponding to the pixel region 41A, even when tolerance occurs in themain body section 61B, which is the vapor chamber, the main body section61B can be easily attached to the emission section 46.

Third Modification of the First Embodiment

In the liquid crystal panel 4A, the heat receiving section 621 of theemission side cooling member 6A is coupled to the light emission surface472 of the pixel substrate 47 and the side surface 483 of the emissionside dustproof substrate 48 in a heat transferable manner. In the liquidcrystal panel 4B, the heat receiving section 621 is coupled to the lightemission surface 482 of the emission side dustproof substrate 48.However, the coupling portions to the pixel substrate 47 and theemission side dustproof substrate 48 in the heat receiving section 621are not limited to the above.

FIG. 10 is a diagram schematically showing a cross section along a YZplane of a liquid crystal panel 4C, which is a modification of theliquid crystal panel 4A.

For example, the liquid crystal panel 4C shown in FIG. 10 may be adoptedinstead of the liquid crystal panel 4A.

The liquid crystal panel 4C includes the same components and the samefunctions as the components and the functions of the liquid crystalpanel 4A except that the liquid crystal panel 4C includes the clampingmember 51 and an emission side cooling member 6C instead of the emissionside cooling member 6A. That is, the liquid crystal panel 4C includesthe panel main body 41, the wire 49, the holding housing 50, theclamping member 51, and the emission side cooling member 6C.

Like the emission side cooling member 6A, the emission side coolingmember 6C vaporizes the coolant in the liquid phase into the coolant inthe gas phase with heat transferred from the pixel substrate 47 and theemission side dustproof substrate 48 and radiates heat received from thecoolant in the gas phase to the outside. The emission side coolingmember 6C includes the same components and the same functions as thecomponents and the functions of the emission side cooling member 6Aexcept that the emission side cooling member 6C includes a main bodysection 61C instead of the main body section 61A. That is, the emissionside cooling member 6C includes the main body section 61C and the firstheat radiating member 68.

Like the main body section 61A, the main body section 61C includes thefirst member 62 and the second member 63 and is configured by combiningthe first member 62 and the second member 63. The main body section 61Cis provided in the pixel substrate 47 such that the first surface 62A ofthe first member 62 is in contact with the light emission surface 472 ofthe pixel substrate 47. That is, a part of the heat receiving section621 of the main body section 61C is coupled to the pixel substrate 47 ina heat transferable manner.

The main body section 61C includes an opening section 64C.

The opening section 64C is a two tier hole including a first openingsection 64C1 provided on the light incident side (in the −Z direction)and a second opening section 64C2 provided on the light emission side(in the +Z direction).

The inner diameter of the first opening section 64C1 is larger than theinner diameter of the second opening section 64C2. The emission sidedustproof substrate 48 is disposed on the inside of the first openingsection 64C1. The side surface 483 of the emission side dustproofsubstrate 48 is coupled to the inner circumferential surface of thefirst opening section 64C1 via a thermally conductive adhesive or thelike in a heat transferable manner.

A coupling section 64C3 coupling the inner circumferential surface ofthe first opening section 64C1 and the inner circumferential surface ofthe second opening section 64C2 is substantially parallel to a surfaceorthogonal to a traveling direction of light passing through theemission side dustproof substrate 48 (the +Z direction). A part of thelight emission surface 482 is coupled to the coupling section 64C3 in aheat transferable manner. In other words, the main body section 61Cincludes a step section formed by the first opening section 64C1, thecoupling section 64C3, and the second opening section 64C2. The innercircumferential surface of the first opening section 64C1 is equivalentto the inner circumferential surface of the step section. The couplingsection 64C3 is equivalent to the bottom surface of the step section.

In the main body section 61C, the coupling portions to the pixelsubstrate 47 and the emission side dustproof substrate 48 are the heatreceiving section 621. Accordingly, the inner circumferential surface ofthe first opening section 64C1 and the coupling section 64C3 are partsof the heat receiving section 621.

Effects of the Third Modification of the First Embodiment

Such a liquid crystal panel 4C achieves the following effects besidesachieving the same effects as the effects of the liquid crystal panels4A and 4B explained above.

In the liquid crystal panel 4C, the emission side dustproof substrate 48includes the side surface 483 that couples the light incident surface481 and the light emission surface 482. The light incident surface 481is equivalent to the surface on the light incident side in the emissionside dustproof substrate 48. The light emission surface 482 isequivalent to the surface on the light emission side in the emissionside dustproof substrate 48.

The inner circumferential surface of the first opening section 64C1 ofthe main body section 61C is coupled to at least a part of the sidesurface 483 in the emission side dustproof substrate 48 in a heattransferable manner. The coupling section 64C3 of the main body section61C is coupled to the light emission surface 482 of the emission sidedustproof substrate 48 in a heat transferable manner. That is, the innercircumferential surface of the first opening section 64C1 and thecoupling section 64C3 are parts of the heat receiving section 621.

With such a configuration, the heat of the liquid crystal layer 42transferred to the emission side dustproof substrate 48 can be receivedby the inner circumferential surface of the first opening section 64C1and the coupling section 64C3. Accordingly, compared with when a mainbody section, which is a vapor chamber, is provided on the lightemission surface 482 in the emission side dustproof substrate 48, it ispossible to prevent the dimension of the liquid crystal panel 4C in alight passing direction (the +Z direction) from increasing.

In the liquid crystal panel 4C, the heat receiving section 621 iscoupled to the pixel substrate 47 in a heat transferable manner.

With such a configuration, not only heat is transferred to the heatreceiving section 621 from the side surface 483 of the emission sidedustproof substrate 48 but also heat is transferred to the heatreceiving section 621 from the pixel substrate 47. Accordingly, it ispossible to make it easy to transfer the heat of the liquid crystallayer 42 to the heat receiving section 621. Therefore, it is possible toimprove the cooling efficiency of the liquid crystal layer 42.

In the liquid crystal panel 4C, the first member 62 including the heatreceiving section 621 and the pixel substrate 47 may not be coupled in aheat transferable manner. In this case, the main body section 61C may befixed to the emission side dustproof substrate 48.

Second Embodiment

A second embodiment of the present disclosure is explained.

A projector according to this embodiment has the same configuration asthe configuration of the projector 1 according to the first embodimentbut is different in the position of a first heat radiating member in anemission side cooling member configuring a liquid crystal panel. In thefollowing explanation, the same or substantially the same portions asthe portions explained above are denoted by the same reference numeralsand signs and explanation of the portions is omitted.

FIG. 11 is a diagram schematically showing a cross section along a YZplane of a liquid crystal panel 4D included in the projector accordingto this embodiment.

The projector according to this embodiment includes the same componentsand the same functions as the components and the functions of theprojector 1 according to the first embodiment except that the projectoraccording to this embodiment includes the liquid crystal panel 4D shownin FIG. 11 instead of the liquid crystal panel 4A according to the firstembodiment. The liquid crystal panel 4D includes the same components andthe same functions as the components and the functions of the liquidcrystal panel 4A except that the liquid crystal panel 4D includes anemission side cooling member 6D instead of the emission side coolingmember 6A.

The emission side cooling member 6D includes the same components and thesame functions as the components and the functions of the emission sidecooling member 6A according to the first embodiment except that theemission side cooling member 6D includes a main body section 61D insteadof the main body section 61A according to the first embodiment. That is,the emission side cooling member 6D includes the main body section 61Dand the first heat radiating member 68.

The main body section 61D includes the first member 62 and the secondmember 63 and is configured by combining the first member 62 and thesecond member 63 in the +Z direction.

The main body section 61D includes the opening section 64. The main bodysection 61D extends from the opening section 64 in the −Y direction,which is the opposite direction of an extending direction of the wire 49from the liquid crystal layer 42. Accordingly, in the second member 63of the main body section 61D, the first heat radiating section 631 isdisposed in the −Y direction with respect to the opening section 64. Thefirst heat radiating member 68 is provided in a position correspondingto the first heat radiating section 631 on the second surface 63A of thesecond member 63.

The emission side dustproof substrate 48 is disposed on the inside ofthe opening section 64. The inner circumferential surface of the openingsection 64 and the side surface 483 of the emission side dustproofsubstrate 48 are coupled by a thermally conductive adhesive or the likein a heat transferable manner. That is, in the main body section 61D,the heat receiving section 621 is coupled to the light emission surface472 of the pixel substrate 47 and is coupled to the side surface 483 ofthe emission side dustproof substrate 48 in a heat transferable manner.

Flow of a Cooling Gas Flowing to the Liquid Crystal Panel

A cooling gas circulated by a fan of a cooling device disposed in theexterior housing 2 flows in the +Y direction with respect to the liquidcrystal panel 4D. Although not illustrated, like the cooling gas flowingto the liquid crystal panel 4A, the cooling gas flowing to the liquidcrystal panel 4D is divided, at the end portion in the −Y direction inthe liquid crystal panel 4D, the cooling gas flowing in a space on alight incident side with respect to the liquid crystal panel 4D and thecooling gas flowing in a space on a light emission side with respect tothe liquid crystal panel 4D.

The cooling gas flowing in the space on the light incident side withrespect to the liquid crystal panel 4D flows in the +Y direction andcools the incident side dustproof substrate 45 and, thereafter, coolsthe holding housing 50.

The cooling gas flowing in the space on the light emission side withrespect to the liquid crystal panel 4D flows in the +Y direction andcools the first heat radiating member 68 and, thereafter, cools theemission side dustproof substrate 48.

In this way, in the liquid crystal panel 4D, the cooling gas flows tothe incident side dustproof substrate 45, the emission side dustproofsubstrate 48, the holding housing 50, and the emission side coolingmember 6D. Consequently, the heat of the liquid crystal layer 42 istransferred to the cooling gas, the liquid crystal layer 42 is cooled,and the driver circuit 491 is cooled.

In the liquid crystal panel 4D, the first heat radiating section 631 andthe first heat radiating member 68 are provided in the −Y direction withrespect to the opening section 64. Accordingly, when the liquid crystalpanel 4D is disposed such that the −Y direction is the verticaldirection upper side, a coolant in a liquid phase condensed by the firstcondensing section corresponding to the first heat radiating section 631can be transported to, by not only the capillarity but also the gravity,vaporizing sections corresponding to a coupling portion to the pixelsubstrate 47 and a coupling portion to the emission side dustproofsubstrate 48 in the heat receiving section 621.

Consequently, the change from the coolant in the liquid phase to thecoolant in a gas phase in the vaporizing sections can be accelerated bythe heat transferred from the liquid crystal layer 42 via the pixelsubstrate 47 and the emission side dustproof substrate 48. That is, itis possible to improve heat radiation efficiency of the heat of theliquid crystal layer 42 and cooling efficiency of the liquid crystallayer 42.

Effects of the Second Embodiment

The projector according to this embodiment explained above achieves thefollowing effects besides achieving the same effects as the effects ofthe projector 1 according to the first embodiment. That is, the liquidcrystal panel 4D according to this embodiment achieves the followingeffects besides achieving the same effects as the effects of the liquidcrystal panel 4A according to the first embodiment.

The liquid crystal panel 4D includes the wire 49 that supplies an imagesignal to the liquid crystal layer 42. The main body section 61D, whichis a vapor chamber, extends from the opening section 64 in the −Ydirection, which is the opposite direction of the extending direction ofthe wire 49 from the liquid crystal layer 42.

With such a configuration, since it is possible to prevent the wire 49and the main body section 61D from interfering with each other, it ispossible to prevent the heat radiation by the main body section 61D frombeing hindered by the wire 49.

First Modification of the Second Embodiment

In the liquid crystal panel 4D, the side surface 483 of the emissionside dustproof substrate 48 is coupled to the inner circumferentialsurface of the opening section 64, which is a part of the heat receivingsection 621, via the thermally conducive adhesive in a heat transferablemanner. However, not only this, but the side surface 483 and the innercircumferential surface of the opening section 64 may not be coupled ina heat transferable manner. The side surface 483 and the innercircumferential surface of the opening section 64 may be coupled by aheat transfer member such as a leaf spring in a heat transferablemanner. Besides, the entire side surface 483 is not always coupled tothe inner circumferential surface of the opening section 64 in a heattransferable manner. A part of the side surface 483 may be coupled tothe inner circumferential surface of the opening section 64 in a heattransferable manner.

Second Modification of the Second Embodiment

In the liquid crystal panel 4D, the heat receiving section 621 isdirectly coupled to the light emission surface 472 of the pixelsubstrate 47 and is coupled to the side surface 483 of the emission sidedustproof substrate 48 via the thermally conductive adhesive or the likein a heat transferable manner. However, not only this, but the heatreceiving section 621 may be directly coupled to the emission sidedustproof substrate 48 and may not be directly coupled to the pixelsubstrate 47. For example, a heat transfer member capable oftransferring heat from the pixel substrate 47 to the heat receivingsection 621 may be provided between the pixel substrate 47 and the heatreceiving section 621.

FIG. 12 is a diagram schematically showing a cross section along a YZplane of a liquid crystal panel 4E, which is a modification of theliquid crystal panel 4D.

For example, the liquid crystal panel 4E shown in FIG. 12 may be adoptedinstead of the liquid crystal panel 4D.

The liquid crystal panel 4E includes the same components and the samefunctions as the components and the functions of the liquid crystalpanel 4D except that the liquid crystal panel 4E includes an emissionside cooling member 6E and the clamping member 51 instead of theemission side cooling member 6D. That is, the liquid crystal panel 4Eincludes the panel main body 41, the wire 49, the holding housing 50,the clamping member 51, and the emission side cooling member 6E.

The emission side cooling member 6E includes the same components and thesame functions as the components and the functions of the emission sidecooling member 6D except that the emission side cooling member 6Eincludes a main body section 61E instead of the main body section 61D.That is, the emission side cooling member 6E includes the main bodysection 61E and the first heat radiating member 68.

The main body section 61E includes the first member 62 and the secondmember 63 and is configured by combining the first member 62 and thesecond member 63. The main body section 61E includes the opening section64, the first member 62 includes the first surface 62A and the heatreceiving section 621, and the second member 63 includes the secondsurface 63A and the first heat radiating section 631. Like the main bodysection 61D, the main body section 61E extends from the opening section64 in the −Y direction, which is the opposite direction of the extendingdirection of the wire 49.

In the emission side cooling member 6E, the first surface 62A of thefirst member 62 is not directly coupled to the pixel substrate 47 and iscoupled to the pixel substrate 47 via the clamping member 51 in a heattransferable manner. The main body section 61E is provided on theemission side dustproof substrate 48. The first surface 62A is coupledto the light emission surface 482 of the emission side dustproofsubstrate 48. That is, the emission side cooling member 6E is providedon the emission side dustproof substrate 48 such that a circumferentialportion of the opening section 64 on the first surface 62A is coupled tothe light emission surface 482. In other words, a part of the heatreceiving section 621 provided around the opening section 64 is coupledto the light emission surface 482 of the emission side dustproofsubstrate 48 in a heat transferable manner. Another part of the heatreceiving section 621 is coupled to the pixel substrate 47 via theclamping member 51 in a heat transferable manner.

In a heat quantity generated by the liquid crystal layer 42, a heatquantity transferred to the emission side dustproof substrate 48 via thepixel substrate 47 is larger than a heat quantity transferred to theclamping member 51 via the pixel substrate 47. Accordingly, the heatreceiving section 621 may not be coupled to the clamping member 51 in aheat transferable manner.

Such a liquid crystal panel 4E achieves the same effects as the effectsof the liquid crystal panels 4B and 4D explained above.

Third Modification of the Second Embodiment

In the liquid crystal panel 4D, the heat receiving section 621 of theemission side cooling member 6D is coupled to the light emission surface472 of the pixel substrate 47 and the side surface 483 of the emissionside dustproof substrate 48 in a heat transferable manner. In the liquidcrystal panel 4E, the heat receiving section 621 is directly coupled tothe light emission surface 482 of the emission side dustproof substrate48. However, the coupling portions to the pixel substrate 47 and theemission side dustproof substrate 48 in the heat receiving section 621are not limited to the above.

FIG. 13 is a diagram schematically showing a cross section along a YZplane of a liquid crystal panel 4F, which is a modification of theliquid crystal panel 4D.

For example, the liquid crystal panel 4F shown in FIG. 13 may be adoptedinstead of the liquid crystal panel 4D.

The liquid crystal panel 4F includes the same components and the samefunctions as the components and the functions of the liquid crystalpanel 4D except that the liquid crystal panel 4F includes an emissionside cooling member 6F instead of the emission side cooling member 6D.That is, the liquid crystal panel 4F includes the panel main body 41,the wire 49, the holding housing 50, the clamping member 51 and theemission side cooling member 6F.

Like the emission side cooling member 6D, the emission side coolingmember 6F vaporizes the coolant in the liquid phase into the coolant inthe gas phase with heat transferred from the pixel substrate 47 and theemission side dustproof substrate 48 and radiates heat received from thecoolant in the gas phase to the outside. The emission side coolingmember 6F includes the same components and the same functions as thecomponents and the functions of the emission side cooling member 6Dexcept that the emission side cooling member 6F includes a main bodysection 61F instead of the main body section 61D. That is, the emissionside cooling member 6F includes the main body section 61F and the firstheat radiating member 68.

Like the main body section 61D, the main body section 61F includes thefirst member 62 and the second member 63 and is configured by combiningthe first member 62 and the second member 63. The main body section 61Fis provided on the pixel substrate 47 such that the first surface 62A ofthe first member 62 is in contact with the light emission surface 472 ofthe pixel substrate 47. That is, a part of the heat receiving section621 of the main body section 61F is coupled to the pixel substrate 47 ina heat transferable manner.

The main body section 61F includes the opening section 64C.

As explained above, the opening section 64C is the two tier holeincluding the first opening section 64C1 provided on the light incidentside and the second opening section 64C2 provided on the light emissionside. The emission side dustproof substrate 48 is disposed on the insideof the first opening section 64C1. The side surface 483 of the emissionside dustproof substrate 48 is coupled to the inner circumferentialsurface of the first opening section 64C1 via the thermally conductiveadhesive or the like in a heat transferable manner. A part of the lightemission surface 482 of the emission side dustproof substrate 48 iscoupled, in a heat transferable manner, to the coupling section 64C3that couples the inner circumferential surface of the first openingsection 64C1 and the inner circumferential surface of the second openingsection 64C2.

In other words, the main body section 61F includes a step section formedby the first opening section 64C1, the coupling section 64C3, and thesecond opening section 64C2. The inner circumferential surface of thefirst opening section 64C1 is equivalent to the inner circumferentialsurface of the step section. The coupling section 64C3 is equivalent tothe bottom surface of the step section.

In the main body section 61F, the coupling portions to the pixelsubstrate 47 and the emission side dustproof substrate 48 are parts ofthe heat receiving section 621. Accordingly, the inner circumferentialsurface of the first opening section 64C1 and the coupling section 64C3are parts of the heat receiving section 621.

Such a liquid crystal panel 4F can achieve the same effects as theeffects of the liquid crystal panels 4C and 4D explained above.

In the liquid crystal panel 4F, as in the liquid crystal panel 4C, thefirst member 62 including the heat receiving section 621 and the pixelsubstrate 47 may not be coupled in a heat transferable manner. In thiscase, the main body section 61F may be fixed to the emission sidedustproof substrate 48.

Third Embodiment

A third embodiment of the present disclosure is explained.

A projector according to this embodiment has the same configuration asthe configuration of the projector 1 according to the first embodimentbut is different in that a main body section of an emission side coolingmember included in a liquid crystal panel extends from an openingsection in an extending direction of the wire 49 and extends from theopening section in the opposite direction of the extending direction ofthe wire 49. In the following explanation, the same or substantially thesame portions as the portions explained above are denoted by the samereference numerals and signs and explanation of the portions is omitted.

FIG. 14 is a diagram schematically showing a cross section along a YZplane of a liquid crystal panel 4G included in the projector accordingto this embodiment.

The projector according to this embodiment includes the same componentsand the same functions as the components and the functions of theprojector 1 according to the first embodiment except that the projectoraccording to this embodiment includes the liquid crystal panel 4G shownin FIG. 14 instead of the liquid crystal panel 4A according to the firstembodiment.

The liquid crystal panel 4G includes the same components and the samefunctions as the components and the functions of the liquid crystalpanel 4A except that the liquid crystal panel 4G includes an emissionside cooling member 6G instead of the emission side cooling member 6A.That is, the liquid crystal panel 4G includes the panel main body 41,the wire 49, the holding housing 50, and the emission side coolingmember 6G. The panel main body 41 includes the liquid crystal layer 42,the incident section 43, and the emission section 46. The incidentsection 43 includes the counter substrate 44 and the incident sidedustproof substrate 45. The emission section 46 includes the pixelsubstrate 47 and the emission side dustproof substrate 48. The panelmain body 41 includes the pixel region 41A configured by the liquidcrystal layer 42, the counter substrate 44, and the pixel substrate 47.A plurality of pixels are arrayed in the pixel region 41A.

The emission side cooling member 6G includes the same components as thecomponents of the emission side cooling member 6A except that theemission side cooling member 6G further includes a second heat radiatingmember 69 and is formed larger in the +Y direction than the emissionside cooling member 6A. That is, the emission side cooling member 6Gincludes a main body section 61G, the first heat radiating member 68,and the second heat radiating member 69.

The main body section 61G includes the first member 62, the secondmember 63, and the opening section 64. The first member 62 includes thefirst surface 62A and the heat receiving section 621. The second member63 includes the second surface 63A, the first heat radiating section631, and a second heat radiating section 632.

The main body section 61G is configured by combining the first member 62and the second member 63. The main body section 61G extends from theopening section 64 along the +Y direction, which is the extendingdirection of the wire 49 from the liquid crystal layer 42, and extendsfrom the opening section 64 along the −Y direction, which is theopposite direction of the extending direction of the wire 49 from theliquid crystal layer 42.

As explained above, the first heat radiating section 631 is disposed inthe +Y direction with respect to the opening section 64 in the secondmember 63. The first heat radiating member 68 is provided in a positioncorresponding to the first heat radiating section 631 on the secondsurface 63A of the second member 63.

The second heat radiating section 632 is disposed in the −Y directionwith respect to the opening section 64 in the second member 63. Thesecond heat radiating member 69 is provided in a position correspondingto the second heat radiating section 632 on the second surface 63A ofthe second member 63.

The second heat radiating member 69 radiates heat transferred from thesecond heat radiating section 632 to a cooling gas flowing to the secondheat radiating member 69. The second heat radiating member 69 mayinclude the same plurality of fins as the plurality of fins 681 or mayinclude a plurality of fins formed in another shape.

Flow of the Cooling Gas Flowing to the Liquid Crystal Panel

The cooling gas circulated by a fan of a cooling device disposed in theexterior housing 2 flows in the +Y direction with respect to the liquidcrystal panel 4G. Although not illustrated, the cooling gas flowing tothe liquid crystal panel 4G is divided, at the end portion in the −Ydirection in the liquid crystal panel 4G, into the cooling gas flowingin a space on a light incident side with respect to the liquid crystalpanel 4G and the cooling gas that flows in a space on a light emissionside with respect to the liquid crystal panel 4G.

The cooling gas flowing in the space on the light incident side withrespect to the liquid crystal panel 4G flows in the +Y direction andcools the incident side dustproof substrate 45 and, thereafter, coolsthe holding housing 50.

The cooling gas flowing in the space on the light emission side withrespect to the liquid crystal panel 4G flows in the +Y direction andcools the second heat radiating member 69, the emission side dustproofsubstrate 48, and the first heat radiating member 68 in order.

In this way, the cooling gas flows to the incident side dustproofsubstrate 45, the holding housing 50, the emission side dustproofsubstrate 48, the first heat radiating member 68, and the second heatradiating member 69, whereby the heat of the liquid crystal layer 42 istransferred to the cooling gas, the liquid crystal layer 42 is cooled,and the driver circuit 491 is cooled.

In the liquid crystal panel 4G, the first heat radiating section 631 andthe first heat radiating member 68 are provided in the +Y direction withrespect to the opening section 64. The second heat radiating section 632and the second heat radiating member 69 are provided in the −Y directionwith respect to the opening section 64.

Accordingly, when the liquid crystal panel 4G is disposed such that the+Y direction is the vertical direction upper side, a coolant in a liquidphase condensed by the first condensing section corresponding to thefirst heat radiating section 631 can be transported to, by not only thecapillarity but also the gravity, vaporizing sections corresponding to acoupling portion to the pixel substrate 47 and a coupling portion to theemission side dustproof substrate 48 in the heat receiving section 621.

When the liquid crystal panel 4G is disposed such that the −Y directionis the vertical direction upper side, the coolant in the liquid phasecondensed by the second condensing section corresponding to the secondheat radiating section 632 can be transported to, by not only thecapillarity but also the gravity, the vaporizing sections correspondingto the coupling portion to the pixel substrate 47 and the couplingportion to the emission side dustproof substrate 48 in the heatreceiving section 621.

Consequently, a change from the coolant in the liquid phase to thecoolant in a gas phase in the vaporizing sections can be accelerated bythe heat transferred from the liquid crystal layer 42 via the pixelsubstrate 47 and the emission side dustproof substrate 48. That is, itis possible to improve heat radiation efficiency of the heat of theliquid crystal layer 42 and cooling efficiency of the liquid crystallayer 42.

Effects of the Third Embodiment

The projector according to this embodiment explained above achieves thefollowing effects besides achieving the same effects as the effects ofthe projector according to the first embodiment and the projectoraccording to the second embodiment.

That is, the liquid crystal panel 4G according to this embodimentachieves the following effects besides achieving the same effects as theeffects of the liquid crystal panel 4A according to the first embodimentand the liquid crystal panel 4D according to the second embodiment.

The liquid crystal panel 4G includes the wire 49 that supplies an imagesignal to the liquid crystal layer 42. The main body section 61G, whichis a vapor chamber, extends from the opening section 64 in each of the+Y direction and the −Y direction. The +Y direction is equivalent to theextending direction of the wire 49 from the liquid crystal layer 42. The−Y direction is equivalent to the opposite direction of the extendingdirection of the wire 49 from the liquid crystal layer 42.

With such a configuration, since a heat radiation area of heat receivedfrom the coolant in the gas phase can be increased in the main bodysection 61G, it is possible to make it easy to condense the coolant inthe gas phase into the coolant in the liquid phase. Therefore, it ispossible to circulate the coolant in the liquid phase to the vaporizingsections without delay and accelerate the vaporization of the coolant inthe liquid phase by the heat of the liquid crystal layer 42.

The liquid crystal panel 4G is disposed such that one direction of the+Y direction and the −Y direction is the vertical direction upper side,whereby the condensed coolant in the liquid phase can be transported to,by not only the capillarity but also the gravity, the vaporizingsections that vaporize the coolant in the liquid phase.

Consequently, the change from the coolant in the liquid phase to thecoolant in the gas phase by the use of the heat received by the heatreceiving section 621 can be accelerated. Therefore, it is possible toimprove the heat radiation efficiency of the heat of the liquid crystallayer 42 and the cooling efficiency of the liquid crystal layer 42.

First Modification of the Third Embodiment

In the liquid crystal panel 4G, the side surface 483 of the emissionside dustproof substrate 48 is coupled to the inner circumferentialsurface of the opening section 64, which is a part of the heat receivingsection 621, via the thermally conductive adhesive in a heattransferable manner.

However, not only this, but the side surface 483 and the innercircumferential surface of the opening section 64 may not be coupled ina heat transferable manner. The side surface 483 and the innercircumferential surface of the opening section 64 may be coupled by aheat transfer member such as a leaf spring in a heat transferablemanner. Besides, the entire side surface 483 is not always coupled tothe inner circumferential surface of the opening section 64 in a heattransferable manner. A part of the side surface 483 may be coupled tothe inner circumferential surface of the opening section 64 in a heattransferable manner.

Second Modification of the Third Embodiment

In the liquid crystal panel 4G, the heat receiving section 621 of theemission side cooling member 6G is directly coupled to the lightemission surface 472 of the pixel substrate 47 and is coupled to theside surface 483 of the emission side dustproof substrate 48 via thethermally conductive adhesive or the like in a heat transferable manner.

However, not only this, but the heat receiving section 621 may bedirectly coupled to the emission side dustproof substrate 48 and may notbe directly coupled to the pixel substrate 47. For example, a heattransfer member capable of transferring heat from the pixel substrate 47to the heat receiving section 621 may be provided between the pixelsubstrate 47 and the heat receiving section 621.

FIG. 15 is a diagram schematically showing a cross section along a YZplane of a liquid crystal panel 4H, which is a modification of theliquid crystal panel 4G.

For example, the liquid crystal panel 4H shown in FIG. 15 may be adoptedinstead of the liquid crystal panel 4G.

The liquid crystal panel 4H includes the same components and the samefunctions as the components and the functions of the liquid crystalpanel 4G except that the liquid crystal panel 4H includes an emissionside cooling member 6H and the clamping member 51 instead of theemission side cooling member 6G.

That is, the liquid crystal panel 4H includes the panel main body 41,the wire 49, the holding housing 50, the clamping member 51, and theemission side cooling member 6H.

The emission side cooling member 6H includes the same components and thesame functions as the components and the functions of the emission sidecooling member 6G except that the emission side cooling member 6Hincludes a main body section 61H instead of the main body section 61G.That is, the emission side cooling member 6H includes the main bodysection 61H, the first heat radiating member 68, and the second heatradiating member 69.

The main body section 61H includes the first member 62, the secondmember 63, and the opening section 64. The first member 62 includes thefirst surface 62A and the heat receiving section 621. The second member63 includes the second surface 63A, the first heat radiating section631, and the second heat radiating section 632. Like the main bodysection 61A, the main body section 61H extends from the opening section64 in the +Y direction, which is the extending direction of the wire 49from the liquid crystal layer 42. Like the main body section 61D, themain body section 61H extends from the opening section 64 in the −Ydirection, which is the opposite direction of the extending direction ofthe wire 49 from the liquid crystal layer 42.

In the emission side cooling member 6H, the first surface 62A of thefirst member 62 is not directly coupled to the pixel substrate 47 and iscoupled to the pixel substrate 47 via the clamping member 51 in a heattransferable manner and is coupled to the counter substrate 44 via theholding housing 50 in a heat transferable manner.

The first surface 62A is coupled to the light emission surface 482 ofthe emission side dustproof substrate 48. When viewed from an emittingdirection of image light by the liquid crystal panel 4H, the area of theemission side dustproof substrate 48 is larger than the area of theopening section 64 of the emission side cooling member 6H. The emissionside dustproof substrate 48 is not disposed on the inner side of theopening section 64. The first surface 62A is coupled to the lightemission surface 482 of the emission side dustproof substrate 48 in aportion around the opening section 64.

That is, the emission side cooling member 6H is provided on the emissionside dustproof substrate 48 such that a circumferential portion of theopening section 64 on the first surface 62A is coupled to the lightemission surface 482.

In other words, a part of the heat receiving section 621 provided aroundthe opening section 64 is coupled to the light emission surface 482 ofthe emission side dustproof substrate 48 in a heat transferable manner,another part of the heat receiving section 621 is coupled to the pixelsubstrate 47 via the clamping member 51 in a heat transferable manner,and still another part of the heat receiving section 621 is coupled tothe counter substrate 44 via the holding housing 50 in a heattransferable manner. Heat transferred from the liquid crystal layer 42to the emission side dustproof substrate 48 via the pixel substrate 47is transferred to the heat receiving section 621.

As explained above, in a heat quantity generated by the liquid crystallayer 42, a heat quantity transferred to the emission side dustproofsubstrate 48 via the pixel substrate 47 is larger than a heat quantitytransferred to the clamping member 51 via the pixel substrate 47.Accordingly, the heat receiving section 621 may not be coupled to theclamping member 51 in a heat transferable manner.

Such a liquid crystal panel 4H achieves the same effects as the effectsof the liquid crystal panels 4B, 4E, and 4G explained above.

Third Modification of the Third Embodiment

In the liquid crystal panel 4G, the heat receiving section 621 of theemission side cooling member 6G is directly coupled to the lightemission surface 472 of the pixel substrate 47 and the side surface 483of the emission side dustproof substrate 48. In the liquid crystal panel4H, the heat receiving section 621 is directly coupled to the lightemission surface 482 of the emission side dustproof substrate 48.

However, the coupling portions to the pixel substrate 47 and theemission side dustproof substrate 48 in the heat receiving section 621are not limited to the above.

FIG. 16 is a diagram schematically showing a cross section along a YZplane of a liquid crystal panel 41, which is a modification of theliquid crystal panel 4G.

For example, the liquid crystal panel 41 shown in FIG. 16 may be adoptedinstead of the liquid crystal panel 4G.

The liquid crystal panel 41 includes the same components and the samefunctions as the components and the functions of the liquid crystalpanel 4G except that the liquid crystal panel 41 includes an emissionside cooling member 61 instead of the emission side cooling member 6G.That is, the liquid crystal panel 41 includes the panel main body 41,the wire 49, the holding housing 50, the clamping member 51, and theemission side cooling member 61.

Like the emission side cooling member 6G, the emission side coolingmember 61 vaporizes the coolant in the liquid phase into the coolant inthe gas phase with heat transferred from the pixel substrate 47 and theemission side dustproof substrate 48 and radiates heat received from thecoolant in the gas phase to the outside. The emission side coolingmember 61 includes the same components and the same functions as thecomponents and the functions of the emission side cooling member 6Gexcept that the emission side cooling member 61 includes a main bodysection 611 instead of the main body section 61G. That is, the emissionside cooling member 61 includes the main body section 611, the firstheat radiating member 68, and the second heat radiating member 69.

Like the main body section 61G, the main body section 611 includes thefirst member 62 and the second member 63 and is configured by combiningthe first member 62 and the second member 63. The main body section 611is provided on the pixel substrate 47 such that the first surface 62A ofthe first member 62 is in contact with the light emission surface 472 ofthe pixel substrate 47. That is, a part of the heat receiving section621 of the main body section 611 is coupled to the pixel substrate 47 ina heat transferable manner.

The main body section 611 includes the opening section 64C.

As explained above, the opening section 64C is the two tier holeincluding the first opening section 64C1 provided on the light incidentside and the second opening section 64C2 provided on the light emissionside. The emission side dustproof substrate 48 is disposed on the insideof the first opening section 64C1. The side surface 483 of the emissionside dustproof substrate 48 is coupled to the inner circumferentialsurface of the first opening section 64C1 via the thermally conductiveadhesive or the like in a heat transferable manner. A part of the lightemission surface 482 of the emission side dustproof substrate 48 iscoupled, in a heat transferable manner, to the coupling section 64C3that couples the inner circumferential surface of the first openingsection 64C1 and the inner circumferential surface of the second openingsection 64C2.

In other words, the main body section 61I includes a step section formedby the first opening section 64C1, the coupling section 64C3, and thesecond opening section 64C2. The inner circumferential surface of thefirst opening section 64C1 is equivalent to the inner circumferentialsurface of the step section. The coupling section 64C3 is equivalent tothe bottom surface of the step section.

In the main body section 611, the coupling portions to the pixelsubstrate 47 and the emission side dustproof substrate 48 are parts ofthe heat receiving section 621. Accordingly, the inner circumferentialsurface of the first opening section 64C1 and the coupling section 64C3are parts of the heat receiving section 621.

Like the main body section 61G, the main body section 611 extends fromthe opening section 64C in the +Y direction, which is the extendingdirection of the wire 49 from the liquid crystal layer 42, and extendsfrom the opening section 64C in the −Y direction, which is the oppositedirection of the extending direction of the wire 49 from the liquidcrystal layer 42. The first heat radiating section 631 and the firstheat radiating member 68 are provided in a portion in the +Y directionwith respect to the opening section 64C on the second surface 63A. Thesecond heat radiating section 632 and the second heat radiating member69 are provided in a portion in the −Y direction with respect to theopening section 64C on the second surface 63A.

Such a liquid crystal panel 41 can achieve the same effects as theeffects of the liquid crystal panels 4C, 4F, and 4G explained above.

In the liquid crystal panel 41, as in the liquid crystal panels 4C and4F, the first member 62 including the heat receiving section 621 and thepixel substrate 47 may not be coupled in a heat transferable manner. Inthis case, the main body section 611 may be fixed to the emission sidedustproof substrate 48.

Fourth Embodiment

A fourth embodiment of the present disclosure is explained.

A projector according to this embodiment has the same configuration asthe configuration of the projector 1 according to the first embodimentbut is different in disposition of a cooling member in a liquid crystalpanel. In the following explanation, the same or substantially the sameportions as the portions explained above are denoted by the samereference numerals and signs and explanation of the components isomitted.

FIG. 17 is a diagram schematically showing a cross section along a YZplane of a liquid crystal panel 7A included in the projector accordingto this embodiment.

The projector according to this embodiment includes the same componentsand the same functions as the components and the functions of theprojector 1 according to the first embodiment except that the projectoraccording to this embodiment includes the liquid crystal panel 7A shownin FIG. 17 instead of the liquid crystal panel 4A according to the firstembodiment.

The liquid crystal panel 7A includes the same components as thecomponents of the liquid crystal panel 4A except that the liquid crystalpanel 7A includes the clamping member 51 and an incident side coolingmember 8A instead of the emission side cooling member 6A. That is, theliquid crystal panel 7A includes the panel main body 41, the wire 49,the holding housing 50, the clamping member 51, and the incident sidecooling member 8A. The panel main body 41 includes the liquid crystallayer 42, the incident section 43, and the emission section 46. Theincident section 43 includes the counter substrate 44 and the incidentside dustproof substrate 45. The emission section 46 includes the pixelsubstrate 47 and the emission side dustproof substrate 48. The panelmain body 41 includes the pixel region 41A configured by the liquidcrystal layer 42, the counter substrate 44, and the pixel substrate 47.A plurality of pixels are arrayed in the pixel region 41A.

As explained in the second modification of the first embodiment, theclamping member 51 clamps the panel main body 41 in conjunction with theholding housing 50. In this embodiment, the holding housing 50 does notinclude the heat radiation fins 502. The incident side cooling member 8Ais provided on a surface 50A on a light incident side in the holdinghousing 50.

Configuration of the Incident Side Cooling Member

Like the emission side cooling member 6A, the incident side coolingmember 8A vaporizes a coolant in a liquid phase encapsulated on theinside into the coolant in a gas phase with heat transferred from theliquid crystal layer 42 to thereby consume the heat transferred from theliquid crystal layer 42 and cool the liquid crystal layer 42, receivesthe heat of the coolant in the gas phase to condense the coolant in thegas phase into the coolant in the liquid phase, and radiates thereceived heat to the outside.

The incident side cooling member 8A includes a main body section 81A anda first heat radiating member 88. The main body section 81A includes afirst member 82 and a second member 83 combined with each other andincludes an opening section 84.

When viewed from an incident side of light made incident on the liquidcrystal layer 42 (the −Z direction), the main body section 81A extendsfurther to the outer side than the counter substrate 44 and the incidentside dustproof substrate 45.

The first member 82 is a substrate formed in a flat shape and can bereferred to as first substrate as well. The first member 82 has the sameconfiguration as the configuration of the first member 62. The firstmember 82 includes a first surface 82A, which is a surface on theopposite side of the second member 83. The first surface 82A is asurface that is in contact with a heat generating body. In thisembodiment, the first surface 82A is a flat surface.

The first member 82 includes a heat receiving section 821 that receivesthe heat of the heat generating body. That is, the main body section81A, which is a vapor chamber according to this embodiment, includes theheat receiving section 821. The heat receiving section 821 is explainedin detail below.

The second member 83 is a substrate formed in a flat shape and can bereferred to as second substrate as well. The second member 83 has thesame configuration as the configuration of the second member 63. Thesecond member 83 is joined to the first member 82 and forms theencapsulating space SP in conjunction with the first member 82. Thesecond member 83 includes a second surface 83A, which is a surface onthe opposite side of the first member 82, and includes a first heatradiating section 831 provided on the second surface 83A.

The second member 83 receives heat from the coolant in the gas phase inthe encapsulating space SP in the first heat radiating section 831 andradiates the heat of the coolant in the gas phase to the outside.

Although not illustrated, a first condensing section, which is a portioncorresponding to the first heat radiating section 831 on the innersurface of the encapsulating space SP, condenses the coolant in the gasphase, the heat of which is received, into the coolant in the liquidphase.

The opening section 84 is a through-hole piercing through the main bodysection 81A along a direction in which the first member 82 and thesecond member 83 are opposed to each other (the +Z direction). Theopening section 84 is a substantially rectangular opening section whenviewed from the +Z direction. The inner circumferential surface of theopening section 84 is formed by a joining portion of the first member 82and the second member 83.

The main body section 81A extends from the opening section 84 along the+Y direction, which is an extending direction of the wire 49 from theliquid crystal layer 42. That is, the first member 82 and the secondmember 83 extend from the opening section 84 in the extending directionof the wire 49 (the +Y direction).

Configuration of the Heat Receiving Section

The heat receiving section 821 is a portion that is coupled to the heatgenerating body and receives the heat of the heat generating body in thefirst member 82. That is, the heat receiving section 821 can be definedas a coupling portion coupled to the heat generating body in the firstmember 82. The heat receiving section 821 is provided around the openingsection 84 in the first member 82.

In this embodiment, the heat receiving section 821 is coupled to thelight incident surface 441 of the counter substrate 44 and the sidesurface 453 of the incident side dustproof substrate 45 and receives theheat of the counter substrate 44 and the heat of the incident sidedustproof substrate 45.

Although not illustrated, a portion corresponding to the heat receivingsection 821 on the inner surface of the encapsulating space SP can bereferred to as a vaporizing section that vaporizes the coolant in theliquid phase with the heat received by the heat receiving section 821.

Specifically, in a portion coming into contact with the coolant in theliquid phase on the inner surface of the encapsulating space SP, aportion that receives transfer of the heat received by the heatreceiving section 821 and vaporizes the coolant in the liquid phase withthe heat is the vaporizing section.

Configuration of the First Heat Radiating Section

The first heat radiating section 831 is provided on the second surface83A on the opposite side of the first member 82 in the second member 83.The first heat radiating section 831 radiates the heat of the coolant inthe gas phase flowing in the encapsulating space SP.

Although not illustrated, a portion corresponding to the first heatradiating section 831 on the inner surface of the encapsulating space SPcan be referred to as first condensing section that receives heat fromthe coolant in the gas phase and condenses the coolant in the gas phaseinto the coolant in the liquid phase.

Specifically, in a portion coming into contact with the coolant in thegas phase on the inner surface of the encapsulating space SP, a portionthat receives the heat of the coolant in the gas phase and condenses thecoolant in the gas phase into the coolant in the liquid phase is thefirst condensing section. The heat received from the coolant in the gasphase by such a first condensing section is radiated by the first heatradiating section 831.

The first heat radiating section 831 is provided in the extendingdirection of the wire 49 from the liquid crystal layer 42 with respectto the opening section 64. The first heat radiating member 88 isprovided in a position corresponding to the first heat radiating section831 on the second surface 83A. The first heat radiating member 88 isprovided in the first heat radiating section 831, whereby the first heatradiating section 831 becomes a portion that easily radiates, to theoutside of the main body section 81A, the heat received from the coolantin the gas phase in the second member 83.

Accordingly, in the incident side cooling member 8A, a portion where thefirst heat radiating member 88 is provided is configured as the firstheat radiating section 831.

Disposition of the Incident Side Cooling Member with Respect to thePanel Main Body

The incident side cooling member 8A is provided on the light incidentside with respect to the liquid crystal layer 42. Specifically, theincident side cooling member 8A is provided on the light incidentsurface 441 of the counter substrate 44, which is an incident sidesubstrate. The first surface 82A of the first member 82 is coupled tothe light incident surface 441 of the counter substrate 44 in a heattransferable manner.

The incident side dustproof substrate 45 is disposed in the openingsection 84. The side surface 453 of the incident side dustproofsubstrate 45 is coupled to the inner circumferential surface of theopening section 84 via the thermally conductive adhesive in a heattransferable manner.

That is, the inner circumferential surface of the opening section 84 isa part of the heat receiving section 821.

Transfer Route of Heat Generated by the Liquid Crystal Layer

A part of the heat transferred from the liquid crystal layer 42 to thecounter substrate 44 is transferred to the heat receiving section 821via the counter substrate 44. Another part of the heat is transferredfrom the counter substrate 44 to the heat receiving section 821 via theincident side dustproof substrate 45.

More specifically, in the incident side cooling member 8A shown in FIG.17 , the heat transferred from the liquid crystal layer 42 to thecounter substrate 44 is transferred to the heat receiving section 821that is in contact with the light incident surface 441 of the countersubstrate 44. On the other hand, the heat transferred to the incidentside dustproof substrate 45 is transferred to the inner circumferentialsurface of the opening section 84 coupled to the side surface 453 of theincident side dustproof substrate 45 in a heat transferable manner.

The first member 82 including the heat receiving section 821 vaporizesthe coolant in the liquid phase in the encapsulating space SP with thetransferred heat of the liquid crystal layer 42 to thereby consume theheat transferred to the first member 82. Consequently, the countersubstrate 44 and the incident side dustproof substrate 45 are cooled andthe liquid crystal layer 42 is cooled.

The coolant in the gas phase flowing in the encapsulating space SP andreaching the first condensing section is condensed into the coolant inthe liquid phase by the first condensing section. Heat received from thecoolant in the gas phase by the first condensing section is transferredfrom the first heat radiating section 831 to the first heat radiatingmember 88 and radiated by the first heat radiating member 88.

Flow of a Cooling Gas Flowing to the Liquid Crystal Panel

A cooling gas circulated by a fan of a cooling device disposed in theexterior housing 2 flows in the +Y direction with respect to the liquidcrystal panel 7A. Although not illustrated, like the cooling gas flowingto the liquid crystal panel 4A is divided into, at the end portion inthe −Y direction in the liquid crystal panel 7A, the cooling gas flowingin a space on the light incident side with respect to the liquid crystalpanel 7A and the cooling gas flowing in a space on a light emission sidewith respect to the liquid crystal panel 7A.

The cooling gas flowing in the space on the light incident side withrespect to the liquid crystal panel 7A flows in the +Y direction andcools the incident side dustproof substrate 45 and, thereafter, flows inthe +Y direction along the second surface 83A and flows to the firstheat radiating member 88. The first heat radiating member 88 transfers,to the cooling gas, heat transferred from the first heat radiatingsection 831.

The cooling gas flowing in the space on the light emission side withrespect to the liquid crystal panel 7A flows in the +Y direction andcools the emission side dustproof substrate 48 and, thereafter, coolsthe clamping member 51 and cools circuit elements such as the drivercircuit 491.

The cooling gas flows to the incident side dustproof substrate 45, theemission side dustproof substrate 48, the clamping member 51, and thefirst heat radiating member 88 to which the heat of the liquid crystallayer 42 is transferred in this way, whereby the heat of the liquidcrystal layer 42 is transferred to the cooling gas and the liquidcrystal layer 42 is cooled.

In the liquid crystal panel 7A as well, the first heat radiating section831 is provided in the +Y direction with respect to the opening section84. Accordingly, when the liquid crystal panel 7A is disposed such thatthe +Y direction is the vertical direction upper side, the coolant inthe liquid phase condensed by the first condensing section can betransported to, by not only the capillarity but also the gravity, thevaporizing section that receives transfer of the heat received by theheat receiving section 821 and vaporizes the coolant in the liquidphase.

Consequently, the change from the coolant in the liquid phase to thecoolant in the gas phase in the vaporizing section can be accelerated bythe heat transferred from the liquid crystal layer 42 via the countersubstrate 44 and the incident side dustproof substrate 45.

That is, it is possible to improve heat radiation efficiency of the heatof the liquid crystal layer 42 and cooling efficiency of the liquidcrystal layer 42.

Effects of the Fourth Embodiment

The projector according to this embodiment explained above achieves thefollowing effects besides achieving the same effects as the effects ofthe projector 1 according to the first embodiment. That is, the liquidcrystal panel 7A according to this embodiment achieves the followingeffects besides achieving the same effects as the effects of the liquidcrystal panel 4A according to the first embodiment.

The projector according to this embodiment includes the liquid crystalpanel 7A functioning as a light modulation device that modulates lightemitted from a light source. The liquid crystal panel 7A is atransmissive liquid crystal panel that emits modulated light along atraveling direction of light made incident on the liquid crystal panel.

The liquid crystal panel 7A includes the pixel region 41A, the liquidcrystal layer 42, the incident section 43, the emission section 46, andthe main body section 81A. The plurality of pixels are arrayed in thepixel region 41A. The liquid crystal layer 42 modulates light for eachof the plurality of pixels. The incident section 43 makes the lightincident on the liquid crystal layer 42. The emission section 46 emits,as image light, the light modulated by the liquid crystal layer 42. Themain body section 81A is the vapor chamber configuring the incident sidecooling member 8A. The main body section 81A includes the openingsection 84, the heat receiving section 821, and the first heat radiatingsection 831. The opening section 84 is provided in the main body section81A to correspond to the pixel region 41A. The heat receiving section821 is provided around the opening section 64. The first heat radiatingsection 831 radiates heat received by the heat receiving section 821.

The main body section 81A vaporizes, with the heat received by the heatreceiving section 821, the coolant in the liquid phase encapsulated inthe encapsulating space SP provided on the inside of the main bodysection 81A and radiates the heat of the coolant in the gas phase withthe first heat radiating section 831 to thereby condense the coolant inthe gas phase into the coolant in the liquid phase.

In the vapor chamber, a pipe for circulating the coolant and a wire forsupplying driving power are unnecessary.

With the configuration explained above, compared with when a coolingdevice in which the coolant flows is provided and when a thermoelectricconversion element such as a Peltier element for moving heat withelectric power is provided, it is possible to simplify the configurationof the liquid crystal panel 7A.

Therefore, it is possible to achieve a reduction in the size of theprojector functioning as the device on which the liquid crystal panel 7Ais mounted. Since it is possible to attach and detach the liquid crystalpanel 7A to and from the projector without attaching and detaching thepipe and the wire, it is possible to easily carry out replacement of theliquid crystal panel 7A.

Further, since the heat receiving section 821 provided around theopening section 84 corresponding to the pixel region 41A receives heat,it is possible to improve uniformity of the temperature in the pixelregion 41A.

In the liquid crystal panel 7A, the incident section 43 includes thecounter substrate 44 that is coupled to the liquid crystal layer 42 in aheat transferable manner and through which light made incident on theliquid crystal layer 42 passes. In this embodiment, the countersubstrate 44 is equivalent to a light transmissive incident sidesubstrate. The area of the counter substrate 44 is larger than the areaof the pixel region 41A when viewed from the −Z direction. The −Zdirection is equivalent to the opposite direction of a travelingdirection of light made incident on the liquid crystal layer 42. Themain body section 81A, which is the vapor chamber, is provided on thecounter substrate 44 in a heat transferable manner.

With such a configuration, since the main body section 81A is provided,in a heat transferable manner, on the counter substrate 44 coupled tothe liquid crystal layer 42 in a heat transferable manner, the heatreceiving section 821 easily receives the heat of the liquid crystallayer 42 via the counter substrate 44.

Therefore, it is possible to make it easy to cool the liquid crystallayer 42.

In the liquid crystal panel 7A, the incident section 43 includes thecounter substrate 44 that includes a common electrode electricallycoupled to the liquid crystal layer 42 and is disposed on the lightincident side with respect to the liquid crystal layer 42. The commonelectrode is equivalent to an incident side electrode. The countersubstrate 44 is equivalent to a light transmissive incident sideelectrode substrate. The counter substrate 44 is the incident sidesubstrate on which the main body section 81A, which is the vaporchamber, is provided.

With such a configuration, the counter substrate 44 is a lighttransmissive substrate directly coupled to the liquid crystal layer 42susceptible to heat. Since the main body section 81A is provided on sucha counter substrate 44, heat generated by the liquid crystal layer 42can be efficiently transferred to the main body section 81A. Therefore,it is possible to improve cooling efficiency of the liquid crystal layer42.

In the liquid crystal panel 7A, the incident section 43 includes theincident side dustproof substrate 45 provided on the light incidentsurface 441 in the counter substrate 44. The light incident surface 441in the counter substrate 44 is equivalent to a surface on the lightincident side. The incident side dustproof substrate 45 includes thelight incident surface 451, the light emission surface 452, and the sidesurface 453. The light incident surface 451 is equivalent to a surfaceon the light incident side in the incident side dustproof substrate 45.The light emission surface 452 is equivalent to a surface on the lightemission side in the incident side dustproof substrate 45. The sidesurface 453 couples the light incident surface 451 and the lightemission surface 452.

The heat receiving section 821 receives heat from the light incidentsurface 441 in the counter substrate 44 and the side surface 453 in theincident side dustproof substrate 45.

With such a configuration, since the heat receiving section 821 receivesheat from the counter substrate 44 and the incident side dustproofsubstrate 45, the heat of the liquid crystal layer 42 can be transferredto the heat receiving section 821 via each of the counter substrate 44and the incident side dustproof substrate 45.

Therefore, since the heat of the liquid crystal layer 42 can beefficiently transferred to the heat receiving section 821, it ispossible to improve the cooling efficiency of the liquid crystal layer42.

In the liquid crystal panel 7A, the counter substrate 44 includes, asthe incident side electrode, the common electrode provided to correspondto the pixel region 41A.

As explained above, in the general transmissive liquid crystal panel,the counter substrate is disposed on the light incident side withrespect to the liquid crystal layer and the pixel substrate is disposedon the light emission side with respect to the liquid crystal layer.

Accordingly, the liquid crystal panel 7A that achieves the effectsexplained above can be configured by providing, in the generaltransmissive liquid crystal panel, the main body section 81A having theconfiguration explained above, that is, the main body section 81A, whichis the vapor chamber.

The liquid crystal panel 7A includes the wire 49 that supplies an imagesignal for driving the liquid crystal layer 42. The main body section81A, which is the vapor chamber, extends from the opening section 84 inthe extending direction of the wire 49 from the liquid crystal layer 42.

With such a configuration, for example, compared with when the main bodysection extends in the opposite direction of the extending direction ofthe wire 49 from the opening section 84, it is possible to prevent anincrease in the size of the liquid crystal panel 7A in the extendingdirection of the wire 49.

First Modification of the Fourth Embodiment

In the liquid crystal panel 7A, the side surface 453 of the incidentside dustproof substrate 45 is coupled to the inner circumferentialsurface of the opening section 84, which is a part of the heat receivingsection 821, via the thermally conductive adhesive in a heattransferable manner.

However, not only this, but the side surface 453 and the innercircumferential surface of the opening section 84 may not be coupled ina heat transferable manner. As explained above, the side surface 453 andthe inner circumferential surface of the opening section 84 may becoupled by a component other than the thermally conductive adhesive, forexample, a heat transfer member such as a leaf spring.

Besides, the entire side surface 453 is not always coupled to the innercircumferential surface of the opening section 84 in a heat transferablemanner. A part of the side surface 453 may be coupled to the innercircumferential surface of the opening section 84 in a heat transferablemanner.

Second Modification of the Fourth Embodiment

In the liquid crystal panel 7A, the heat receiving section 821 of theincident side cooling member 8A is directly coupled to the lightincident surface 441 of the counter substrate 44 and is coupled to theside surface 453 of the incident side dustproof substrate 45 via thethermally conductive adhesive or the like in a heat transferable manner.

However, not only this, but the heat receiving section 821 may bedirectly coupled to the incident side dustproof substrate 45 and may notbe directly coupled to the counter substrate 44. For example, a heattransfer member capable of transferring heat from the counter substrate44 to the heat receiving section 821 may be provided between the countersubstrate 44 and the heat receiving section 821.

FIG. 18 is a diagram schematically showing a cross section along a YZplane of a liquid crystal panel 7B, which is a modification of theliquid crystal panel 7A.

For example, the liquid crystal panel 7B shown in FIG. 18 may be adoptedinstead of the liquid crystal panel 7A.

The liquid crystal panel 7B includes the same components and the samefunctions as the components and the functions of the liquid crystalpanel 7A except that the liquid crystal panel 7B includes an incidentside cooling member 8B instead of the incident side cooling member 8A.

That is, the liquid crystal panel 7B includes the panel main body 41,the wire 49, the holding housing 50, the clamping member 51, and theincident side cooling member 8B.

The incident side cooling member 8B includes a main body section 81B andthe first heat radiating member 88. The main body section 81B includesthe first member 82, the second member 83, and the opening section 84.The first member 82 includes the first surface 82A and the heatreceiving section 821. The second member 83 includes the second surface83A and the first heat radiating section 831.

In the incident side cooling member 8B, the first surface 82A of thefirst member 82 is not directly coupled to the counter substrate 44 andis coupled to the counter substrate 44 via the holding housing 50 in aheat transferable manner. The first surface 82A is coupled to the lightincident surface 451 of the incident side dustproof substrate 45.

That is, in the liquid crystal panel 7B, when viewed from the oppositedirection of the traveling direction of the light made incident on theliquid crystal layer 42 (the −Z direction), the area of the incidentside dustproof substrate 45 is larger than the area of the openingsection 84 of the incident side cooling member 8B.

Accordingly, the incident side dustproof substrate 45 is not disposed onthe inner side of the opening section 84. The main body section 81B isprovided on the incident side dustproof substrate 45.

Heat transferred to the incident side dustproof substrate 45 istransferred to the first member 82 on the first surface 82A.

That is, a part of the heat receiving section 821 of a main body section81B is a portion coupled to the light incident surface 451 of theincident side dustproof substrate 45 in the first member 82. Besides,since heat transferred from the liquid crystal layer 42 to the holdinghousing 50 is transferred via the counter substrate 44 as well, anotherpart of the heat receiving section 821 is a portion coupled to thecounter substrate 44 via the holding housing 50 in a heat transferablemanner.

In a heat quantity generated by the liquid crystal layer 42, a heatquantity transferred to the incident side dustproof substrate 45 via thecounter substrate 44 is larger than a heat quantity transferred to theholding housing 50 via the counter substrate 44. Therefore, the heatreceiving section 821 may not be coupled to the holding housing 50 in aheat transferable manner.

Effects of the Second Modification of the Fourth Embodiment

Such a liquid crystal panel 7B achieves the following effects besidesachieving the same effects as the effects of the liquid crystal panel 7Aexplained above.

In the liquid crystal panel 7B, the incident section 43 includes thecounter substrate 44 and the incident side dustproof substrate 45.

The counter substrate 44 is a light transmissive incident side electrodesubstrate that includes a common electrode electrically coupled to theliquid crystal layer 42 and is disposed on the light incident side withrespect to the liquid crystal layer 42. The common electrode isequivalent to the incident side electrode. The incident side dustproofsubstrate 45 is provided on the light incident surface 441 in thecounter substrate 44. The light incident surface 441 is equivalent to asurface on the light incident side in the counter substrate 44. Theincident side dustproof substrate 45 is an incident side substrate onwhich the main body section 81B, which is a vapor chamber, is provided.

With such a configuration, the main body section 81B is provided, in aheat transferable manner, on the incident side dustproof substrate 45provided further on the light incident side than the counter substrate44. Accordingly, compared with when the main body section 81B isprovided on the counter substrate 44 to avoid the incident sidedustproof substrate 45, the main body section 81B can be easily coupledto the emission section 46.

Since heat generated by the liquid crystal layer 42 is transferred tothe incident side dustproof substrate 45 via the counter substrate 44,the heat of the liquid crystal layer 42 diffuses.

In contrast, since the first member 82 of the main body section 81B iscoupled to the light incident surface 451 of the incident side dustproofsubstrate 45, it is possible to make it easy to transfer the heat of theliquid crystal layer 42 to the heat receiving section 821 in the firstmember 82.

In the liquid crystal panel 7B, the main body section 81B, which is thevapor chamber, is provided on the light incident surface 451 of theincident side dustproof substrate 45. The light incident surface 451 isequivalent to the surface on the light incident side of the incidentside dustproof substrate 45.

With such a configuration, for example, compared with when the incidentside dustproof substrate 45 is disposed in the opening section 84corresponding to the pixel region 41A, even when tolerance occurs in themain body section 81B, which is the vapor chamber, the main body section81B can be easily attached to the incident section 43.

Third Modification of the Fourth Embodiment

In the liquid crystal panel 7A, the heat receiving section 821 of theincident side cooling member 8A is coupled to the light incident surface441 of the counter substrate 44 and the side surface 453 of the incidentside dustproof substrate 45 in a heat transferable manner. In the liquidcrystal panel 7B, the heat receiving section 821 is directly coupled tothe light incident surface 451 of the incident side dustproof substrate45. However, the coupling portions to the counter substrate 44 and theincident side dustproof substrate 45 in the heat receiving section 821are not limited to the above.

FIG. 19 is a diagram schematically showing a cross section along a YZplane of a liquid crystal panel 7C, which is a modification of theliquid crystal panel 7A.

For example, the liquid crystal panel 7C shown in FIG. 19 may be adoptedinstead of the liquid crystal panel 7A.

The liquid crystal panel 7C includes the same components and the samefunctions as the components and the functions of the liquid crystalpanel 7A except that the liquid crystal panel 7C includes an incidentside cooling member 8C instead of the incident side cooling member 8A.That is, the liquid crystal panel 7C includes the panel main body 41,the wire 49, the holding housing 50, the clamping member 51, and theincident side cooling member 8C.

Like the incident side cooling member 8A, the incident side coolingmember 8C vaporizes the coolant in the liquid phase into the coolant inthe gas phase with heat transferred from the counter substrate 44 andthe incident side dustproof substrate 45 and radiates heat received fromthe coolant in the gas phase to the outside. The incident side coolingmember 8C includes the same components and the same functions as thecomponents and the functions of the incident side cooling member 8Aexcept that the incident side cooling member 8C includes a main bodysection 81C instead of the main body section 81A. That is, the incidentside cooling member 8C includes the main body section 81C and the firstheat radiating member 88.

Like the main body section 81A, the main body section 81C includes thefirst member 82 and the second member 83 and is configured by combiningthe first member 82 and the second member 83. The first member 82includes the first surface 82A and the heat receiving section 821. Thesecond member 83 includes the second surface 83A and the first heatradiating section 831.

The main body section 81C includes an opening section 84C.

The opening section 84C is a two tier hole like the opening section 64Cand includes a first opening section 84C1 provided on the light emissionside (in the +Z direction) and a second opening section 84C2 provided onthe light incident side (in the −Z direction).

The inner diameter of the first opening section 84C1 is larger than theinner diameter of the second opening section 84C2. The incident sidedustproof substrate 45 is disposed on the inside of the first openingsection 84C1. The side surface 453 of the incident side dustproofsubstrate 45 is coupled to the inner circumferential surface of thefirst opening section 84C1 via a thermally conductive adhesive or thelike in a heat transferable manner.

A coupling section 84C3 coupling the inner circumferential surface ofthe first opening section 84C1 and the inner circumferential surface ofthe second opening section 84C2 is substantially parallel to a surfaceorthogonal to a traveling direction of light passing through theincident side dustproof substrate 45 (the +Z direction). A part of thelight incident surface 451 of the incident side dustproof substrate 45is coupled to the coupling section 84C3 in a heat transferable manner.In other words, the main body section 81C includes a step section formedby the first opening section 84C1, the coupling section 84C3, and thesecond opening section 84C2. The inner circumferential surface of thefirst opening section 84C1 is equivalent to the inner circumferentialsurface of the step section. The coupling section 84C3 is equivalent tothe bottom surface of the step section.

In the main body section 81C, coupling portions to the counter substrate44 and the incident side dustproof substrate 45 are parts of the heatreceiving section 821. Accordingly, the inner circumferential surface ofthe first opening section 84C1 and the coupling section 84C3 are partsof the heat receiving section 821.

Effects of the Third Modification of the Fourth Embodiment

Such a liquid crystal panel 7C achieves the following effects besidesachieving the same effects as the effects of the liquid crystal panels7A and 7B explained above.

In the liquid crystal panel 7C, the incident side dustproof substrate 45includes the side surface 453 that couples the light incident surface451 and the light emission surface 452. The light incident surface 451is equivalent to the surface on the light incident side in the incidentside dustproof substrate 45. The light emission surface 452 isequivalent to the surface on the light emission side in the incidentside dustproof substrate 45.

The inner circumferential surface of the first opening section 84C1 ofthe main body section 81C is coupled to at least a part of the sidesurface 453 in the incident side dustproof substrate 45 in a heattransferable manner. The coupling section 84C3 of the main body section81C is coupled to the light incident surface 451 of the incident sidedustproof substrate 45 in a heat transferable manner. That is, the innercircumferential surface of the first opening section 84C1 and thecoupling section 84C3 are parts of the heat receiving section 821.

With such a configuration, the heat of the liquid crystal layer 42transferred to the incident side dustproof substrate 45 can be receivedby the inner circumferential surface of the first opening section 84C1and the coupling section 84C3.

Accordingly, compared with when a main body section, which is a vaporchamber, is provided on the light incident surface 451 in the incidentside dustproof substrate 45, it is possible to prevent the dimension ofthe liquid crystal panel 7C in a light passing direction (the +Zdirection) from increasing.

In the liquid crystal panel 7C, the heat receiving section 821 iscoupled to the counter substrate 44 in a heat transferable manner.

With such a configuration, not only heat is transferred from the sidesurface 453 of the incident side dustproof substrate 45 but also heat istransferred from the counter substrate 44 to the heat receiving section821. Accordingly, it is possible to make it easy to transfer the heat ofthe liquid crystal layer 42 to the heat receiving section 821.Therefore, it is possible to improve cooling efficiency of the liquidcrystal layer 42.

In the liquid crystal panel 7C, the first member 82 including the heatreceiving section 821 and the counter substrate 44 may not be coupled ina heat transferable manner. In this case, the main body section 81C maybe fixed to the incident side dustproof substrate 45.

Fifth Embodiment

A fifth embodiment of the present disclosure is explained.

A projector according to this embodiment has the same configuration asthe configuration of the projector according to the fourth embodimentbut is different in the position of a first heat radiating member in anincident side cooling member of a liquid crystal panel. In the followingexplanation, the same or substantially the same portions as the portionsexplained above are denoted by the same reference numerals and signs andexplanation of the portions is omitted.

FIG. 20 is a schematic diagram schematically showing a cross sectionalong a YZ plane of a liquid crystal panel 7D included in the projectoraccording to this embodiment.

The projector according to this embodiment includes the same componentsand the same functions as the components and the functions of theprojector according to this embodiment except that the projectoraccording to this embodiment includes the liquid crystal panel 7D shownin FIG. 20 instead of the liquid crystal panel 7A according to thefourth embodiment.

The liquid crystal panel 7D includes the same components as thecomponents of the liquid crystal panel 7A according to the fourthembodiment except that the liquid crystal panel 7D includes an incidentside cooling member 8D instead of the incident side cooling member 8A.That is, the liquid crystal panel 7D includes the panel main body 41,the wire 49, the holding housing 50, the clamping member 51, and theincident side cooling member 8D.

Like the incident side cooling member 8A, the incident side coolingmember 8D vaporizes a coolant in a liquid phase encapsulated on theinside using the heat of the liquid crystal layer 42 transferred fromthe counter substrate 44 and the incident side dustproof substrate 45,cools the liquid crystal layer 42, and radiates heat received from thecoolant in a gas phase. The incident side cooling member 8D includes themain body section 81D and the first heat radiating member 88.

The main body section 81D includes the first member 82 and the secondmember 83 and is configured by combining the first member 82 and thesecond member 83. The main body section 81D includes the opening section84.

The main body section 81D extends from the opening section 84 in the −Ydirection, which is the opposite direction of an extending direction ofthe wire 49 from the liquid crystal layer 42. Accordingly, on the secondsurface 83A of the second member 83, the first heat radiating section831 is provided in the −Y direction with respect to the opening section84. The first heat radiating member 88 is provided in a positioncorresponding to the first heat radiating section 831 on the secondsurface 83A.

The incident side dustproof substrate 45 is disposed on the inside ofthe opening section 84. The inner circumferential surface of the openingsection 84 and the side surface 453 of the incident side dustproofsubstrate 45 are coupled by a thermally conductive adhesive or the likein a heat transferable manner.

That is, in the main body section 81D, the heat receiving section 821 iscoupled to the light incident surface 451 of the counter substrate 44and coupled to the side surface 453 of the incident side dustproofsubstrate 45 in a heat transferable manner.

Flow of a Cooling Gas Flowing to the Liquid Crystal Panel

A cooling gas circulated by a fan of a cooling device disposed in theexterior housing 2 flows in the +Y direction with respect to the liquidcrystal panel 7D.

The cooling gas flowing in a space on a light incident side with respectto the liquid crystal panel 7D flows in the +Y direction and cools thefirst heat radiating member 88 and the incident side dustproof substrate45 and, thereafter, cools the holding housing 50.

The cooling gas flowing in a space on a light emission side with respectto the liquid crystal panel 7D flows in the +Y direction and cools theemission side dustproof substrate 48 and, thereafter, cools the clampingmember 51.

In this way, in the liquid crystal panel 7D, the cooling gas flows tothe incident side dustproof substrate 45, the emission side dustproofsubstrate 48, the holding housing 50, the clamping member 51, and thefirst heat radiating member 88. Consequently, the heat of the liquidcrystal layer 42 is transferred to the cooling gas, the liquid crystallayer 42 is cooled, and the driver circuit 491 is cooled.

In the liquid crystal panel 7D, the first heat radiating section 831 andthe first heat radiating member 88 are provided in the −Y direction withrespect to the opening section 84. Accordingly, when the liquid crystalpanel 7D is disposed such that the −Y direction is the verticaldirection upper side, the coolant in the liquid phase condensed by thefirst condensing section corresponding to the first heat radiatingsection 831 can be transported to, by not only the capillarity but alsothe gravity, vaporizing sections corresponding to a coupling portion tothe counter substrate 44 and a coupling portion to the incident sidedustproof substrate 45 in the heat receiving section 821.

Consequently, the change from the coolant in the liquid phase to thecoolant in the gas phase in the vaporizing sections can be acceleratedby the heat transferred from the liquid crystal layer 42 via the countersubstrate 44 and the incident side dustproof substrate 45. That is, itis possible to improve heat radiation efficiency of the heat of theliquid crystal layer 42 and cooling efficiency of the liquid crystallayer 42.

Effects of the Fifth Embodiment

The projector according to this embodiment explained above achieves thefollowing effects besides achieving the same effects as the effects ofthe projector according to the fourth embodiment. That is, the liquidcrystal panel 7D according to this embodiment achieves the followingeffects besides achieving the same effects as the effects of the liquidcrystal panel 7A according to the fourth embodiment.

The liquid crystal panel 7D includes the wire 49 that supplies an imagesignal to the liquid crystal layer 42. The main body section 81D, whichis a vapor chamber, extends from the opening section 84 in the −Ydirection. The −Y direction is the opposite direction of the extendingdirection of the wire 49 from the liquid crystal layer 42.

With such a configuration, since it is possible to prevent the wire 49and the main body section 81D from interfering with each other, it ispossible to prevent heat radiation by the main body section 81D frombeing hindered by the wire 49.

First Modification of the Fifth Embodiment

In the liquid crystal panel 7D, the side surface 453 of the incidentside dustproof substrate 45 is coupled to the inner circumferentialsurface of the opening section 84, which is a part of the heat receivingsection 821, via the thermally conducive adhesive in a heat transferablemanner.

However, not only this, but the side surface 453 and the innercircumferential surface of the opening section 84 may not be coupled ina heat transferable manner. The side surface 453 and the innercircumferential surface of the opening section 84 may be coupled via aheat transfer member such as a leaf spring in a heat transferablemanner.

Besides, the entire side surface 453 is not always coupled to the innercircumferential surface of the opening section 84 in a heat transferablemanner. A part of the side surface 453 may be coupled to the innercircumferential surface of the opening section 84 in a heat transferablemanner.

Second Modification of the Fifth Embodiment

In the liquid crystal panel 7D, the heat receiving section 821 isdirectly coupled to the light incident surface 441 of the countersubstrate 44 and coupled to the side surface 453 of the incident sidedustproof substrate 45 via the thermally conductive adhesive or the likein a heat transferable manner.

However, not only this, but the heat receiving section 821 may bedirectly coupled to the incident side dustproof substrate 45 and may notbe directly coupled to the counter substrate 44. For example, a heattransfer member capable of transferring heat from the counter substrate44 to the heat receiving section 821 may be provided between the countersubstrate 44 and the heat receiving section 821.

FIG. 21 is a diagram schematically showing a cross section along a YZplane of a liquid crystal panel 7E, which is a modification of theliquid crystal panel 7D.

For example, the liquid crystal panel 7E shown in FIG. 21 may be adoptedinstead of the liquid crystal panel 7D.

The liquid crystal panel 7E includes the same components and the samefunctions as the components and the functions of the liquid crystalpanel 7D except that the liquid crystal panel 7E includes an incidentside cooling member 8E instead of the incident side cooling member 8D.That is, the liquid crystal panel 7E includes the panel main body 41,the wire 49, the holding housing 50, the clamping member 51, and theincident side cooling member 8E.

The incident side cooling member 8E includes a main body section 81E andthe first heat radiating member 88. Like the main body section 81D, themain body section 81E includes the first member 82, the second member83, and the opening section 84. The first member 82 includes the firstsurface 82A and the heat receiving section 821. The second member 83includes the second surface 83A and the first heat radiating section831. Like the main body section 81D, the main body section 81E extendsfrom the opening section 84 in the −Y direction, which is the oppositedirection of the extending direction of the wire 49 from the liquidcrystal layer 42.

In the incident side cooling member 8E, the first surface 82A of thefirst member 82 is not directly coupled to the counter substrate 44 andis coupled to the counter substrate 44 via the holding housing 50 in aheat transferable manner. The main body section 81E is provided on theincident side dustproof substrate 45. The first surface 82A is directlycoupled to the light incident surface 451 of the incident side dustproofsubstrate 45.

That is, the incident side cooling member 8E is provided on the incidentside dustproof substrate 45 such that a circumferential portion of theopening section 84 on the first surface 82A is coupled to the lightincident surface 451.

In other words, a part of the heat receiving section 821 provided aroundthe opening section 84 is coupled to the light incident surface 451 ofthe incident side dustproof substrate 45 in a heat transferable manner.Another part of the heat receiving section 821 is coupled to the countersubstrate 44 via the holding housing 50 in a heat transferable manner.Heat transferred from the liquid crystal layer 42 to the holding housing50 is transferred via the pixel substrate 47 as well.

In a heat quantity generated by the liquid crystal layer 42, a heatquantity transferred to the incident side dustproof substrate 45 via thecounter substrate 44 is larger than a heat quantity transferred to theholding housing 50 via the counter substrate 44 and the pixel substrate47.

Accordingly, the heat receiving section 821 may not be coupled to theholding housing 50 in a heat transferable manner.

Such a liquid crystal panel 7E achieves the same effects as the effectsof the liquid crystal panels 7B and 7D explained above.

Third Modification of the Fifth Embodiment

In the liquid crystal panel 7D, the heat receiving section 821 of theincident side cooling member 8D is coupled to the light incident surface441 of the counter substrate 44 and the side surface 453 of the incidentside dustproof substrate 45 in a heat transferable manner. In the liquidcrystal panel 7E, the heat receiving section 821 is directly coupled tothe light incident surface 451 of the incident side dustproof substrate45.

However, in the heat receiving section 821, the coupling portions to thecounter substrate 44 and the incident side dustproof substrate 45 arenot limited to the above.

FIG. 22 is a diagram schematically showing a cross section along a YZplane of a liquid crystal panel 7F, which is a modification of theliquid crystal panel 7D.

For example, the liquid crystal panel 7F shown in FIG. 22 may be adoptedinstead of the liquid crystal panel 7D.

The liquid crystal panel 7F includes the same components and the samefunctions as the components and the functions of the liquid crystalpanel 7D except that the liquid crystal panel 7F includes an incidentside cooling member 8F instead of the incident side cooling member 8D.That is, the liquid crystal panel 7F includes the panel main body 41,the wire 49, the holding housing 50, the clamping member 51, and theincident side cooling member 8F.

Like the incident side cooling member 8D, the incident side coolingmember 8F vaporizes the coolant in the liquid phase into the coolant inthe gas phase with heat transferred from the counter substrate 44 andthe incident side dustproof substrate 45 and radiates heat received fromthe coolant in the gas phase to the outside. The incident side coolingmember 8F includes the same components and the same functions as thecomponents and the functions of the incident side cooling member 8Dexcept that the incident side cooling member 8F includes a main bodysection 81F instead of the main body section 81D. That is, the incidentside cooling member 8F includes the main body section 81F and the firstheat radiating member 88.

The main body section 81F includes the first member 82, the secondmember 83, and the opening section 84C. Like the main body section 81D,the main body section 81F extends from the opening section 84C in the −Ydirection, which is the opposite direction of the extending direction ofthe wire 49 from the liquid crystal layer 42.

As explained in the third modification of the fourth embodiment, theopening section 84C is the two tier hole including the first openingsection 84C1 provided on the light emission side and the second openingsection 84C2 provided on the light incident side. The inner diameter ofthe first opening section 84C1 is larger than the inner diameter of thesecond opening section 84C2. The incident side dustproof substrate 45 isdisposed on the inside of the first opening section 84C1. The sidesurface 453 of the incident side dustproof substrate 45 is coupled tothe inner circumferential surface of the first opening section 84C1 viaa thermally conductive adhesive or the like in a heat transferablemanner. A part of the light incident surface 451 of the incident sidedustproof substrate 45 is coupled to the coupling section 84C3 in a heattransferable manner.

In other words, the main body section 81F includes a step section formedby the first opening section 84C1, the coupling section 84C3, and thesecond opening section 84C2. The inner circumferential surface of thefirst opening section 84C1 is equivalent to the inner circumferentialsurface of the step section. The coupling section 84C3 is equivalent tothe bottom surface of the step section.

In the main body section 81F, the coupling portions to the countersubstrate 44 and the incident side dustproof substrate 45 are parts ofthe heat receiving section 821. Accordingly, the inner circumferentialsurface of the first opening section 84C1 and the coupling section 84C3are parts of the heat receiving section 821.

Such a liquid crystal panel 7F achieves the same effects as the effectsof the liquid crystal panels 7C and 7D explained above.

In the liquid crystal panel 7F, as in the liquid crystal panel 7C, thefirst member 82 including the heat receiving section 821 and the countersubstrate 44 may not be coupled in a heat transferable manner. In thiscase, the main body section 81F may be fixed to the incident sidedustproof substrate 45.

Sixth Embodiment

A sixth embodiment of the present disclosure is explained.

A projector according to this embodiment has the same configuration asthe configuration of the projector according to the fourth embodimentbut is different in that a main body section of an incident side coolingmember included in a liquid crystal panel extends in an extendingdirection of the wire 49 from an opening section and extends in theopposite direction of the extending direction of the wire 49 from theopening section.

In the following explanation, the same or substantially the sameportions as the portions explained above are denoted by the samereference numerals and signs and explanation of the portions is omitted.

FIG. 23 is a diagram schematically showing a cross section along a YZplane of a liquid crystal panel 7G included in the projector accordingto this embodiment.

The projector according to this embodiment includes the same componentsand the same functions as the components and the functions of theprojector according to the fourth embodiment except that the projectoraccording to this embodiment includes the liquid crystal panel 7G shownin FIG. 23 instead of the liquid crystal panel 7A according to thefourth embodiment.

The liquid crystal panel 7G includes the same components as thecomponents of the liquid crystal panel 7A according to the fourthembodiment except that the liquid crystal panel 7G includes an incidentside cooling member 8G instead of the incident side cooling member 8A.That is, the liquid crystal panel 7G includes the panel main body 41,the wire 49, the holding housing 50, the clamping member 51, and theincident side cooling member 8G. The panel main body 41 includes theliquid crystal layer 42, the incident section 43, and the emissionsection 46. The incident section 43 includes the counter substrate 44and the incident side dustproof substrate 45. The emission section 46includes the pixel substrate 47 and the emission side dustproofsubstrate 48.

The panel main body 41 includes the pixel region 41A configured by theliquid crystal layer 42, the counter substrate 44, and the pixelsubstrate 47. A plurality of pixels are arrayed in the pixel region 41A.

The incident side cooling member 8G includes the same components as thecomponents of the incident side cooling member 8A except that theincident side cooling member 8G further includes a second heat radiatingmember 89 and is formed larger in the +Y direction than the incidentside cooling member 8A. That is, the incident side cooling member 8Gincludes a main body section 81G, the first heat radiating member 88,and the second heat radiating member 89.

The main body section 81G includes the first member 82, the secondmember 83, and the opening section 84. The first member 82 includes thefirst surface 82A and the heat receiving section 821. The second member83 includes the second surface 83A, the first heat radiating section831, and a second heat radiating section 832.

The main body section 81G is configured by combining the first member 82and the second member 83. The main body section 81G extends from theopening section 84 along the +Y direction, which is the extendingdirection of the wire 49 from the liquid crystal layer 42, and extendsfrom the opening section 84 along the -Y direction, which is theopposite direction of the extending direction of the wire 49 from theliquid crystal layer 42.

As explained above, the first heat radiating section 831 is disposed inthe +Y direction with respect to the opening section 84 in the secondmember 83. The first heat radiating member 88 is provided in a positioncorresponding to the first heat radiating section 831 on the secondsurface 83A of the second member 83.

The second heat radiating section 832 is disposed in the −Y directionwith respect to the opening section 84 in the second member 83. Thesecond heat radiating member 89 is provided in a position correspondingto the second heat radiating section 832 on the second surface 83A ofthe second member 83.

The second heat radiating member 89 radiates, to a cooling gas flowingto the second heat radiating member 89, heat transferred from the secondheat radiating section 832. For example, the second heat radiatingmember 89 may include the same plurality of fins as the plurality offins 681 or may include a plurality of fins formed in another shape.

Flow of the Cooling Gas Flowing to the Liquid Crystal Panel

The cooling gas circulated by a fan of a cooling device disposed in theexterior housing 2 flows in the +Y direction with respect to the liquidcrystal panel 7G.

The cooling gas flowing in a space on a light incident side with respectto the liquid crystal panel 7G flows in the +Y direction and cools thesecond heat radiating member 89, the incident side dustproof substrate45, and the first heat radiating member 88 in order.

The cooling gas flowing in a space on a light emission side with respectto the liquid crystal panel 7G flows in the +Y direction and cools theemission side dustproof substrate 48 and, thereafter, cools the clampingmember 51.

In this way, the cooling gas flows to the incident side dustproofsubstrate 45, the emission side dustproof substrate 48, the clampingmember 51, the first heat radiating member 88, and the second heatradiating member 89 to which the heat of the liquid crystal layer 42 istransferred. Consequently, the heat of the liquid crystal layer 42 istransferred to the cooling gas, the liquid crystal layer 42 is cooled,and the driver circuit 491 is cooled.

In the liquid crystal panel 7G, the first heat radiating section 831 andthe first heat radiating member 88 are provided in the +Y direction withrespect to the opening section 84 and the second heat radiating section832 and the second heat radiating member 89 are provided in the −Ydirection with respect to the opening section 84.

Accordingly, when the liquid crystal panel 7G is disposed such that the+Y direction is the vertical direction upper side, a coolant in a liquidphase condensed by the first condensing section corresponding to thefirst heat radiating section 831 can be transported to, by not only thecapillarity but also the gravity, vaporizing sections corresponding to acoupling portion to the counter substrate 44 and a coupling portion tothe incident side dustproof substrate 45 in the heat receiving section821.

When the liquid crystal panel 7G is disposed such that the −Y directionis the vertical direction upper side, the coolant in the liquid phasecondensed by the second condensing section corresponding to the secondheat radiating section 832 can be transported to, by not only thecapillarity but also the gravity, the vaporizing sections correspondingto the coupling portion to the counter substrate 44 and the couplingportion to the incident side dustproof substrate 45 in the heatreceiving section 821.

Consequently, a change from the coolant in the liquid phase to thecoolant in a gas phase in the vaporizing sections can be accelerated bythe heat transferred from the liquid crystal layer 42 via the countersubstrate 44 and the incident side dustproof substrate 45.

That is, it is possible to improve heat radiation efficiency of the heatof the liquid crystal layer 42 and cooling efficiency of the liquidcrystal layer 42.

Effects of the Sixth Embodiment

The projector according to this embodiment explained above achieves thefollowing effects besides achieving the same effects as the effects ofthe projector according to the fourth embodiment and the projectoraccording to the fifth embodiment.

That is, the liquid crystal panel 7G according to this embodimentachieves the following effects besides achieving the same effects as theeffects of the liquid crystal panel 7A according to the fourthembodiment and the liquid crystal panel 7D according to the fifthembodiment.

The liquid crystal panel 7G includes the wire 49 that supplies an imagesignal to the liquid crystal layer 42. The main body section 81G, whichis a vapor chamber, extends from the opening section 84 in each of the+Y direction and the −Y direction. The +Y direction is equivalent to theextending direction of the wire 49 from the liquid crystal layer 42. The−Y direction is equivalent to the opposite direction of the extendingdirection of the wire 49 from the liquid crystal layer 42.

With such a configuration, since a heat radiation area of heat receivedfrom the coolant in the gas phase can be increased in the main bodysection 81G, it is possible to make it easy to condense the coolant inthe gas phase into the coolant in the liquid phase. Therefore, it ispossible to circulate the coolant in the liquid phase to the vaporizingsections without delay and accelerate the vaporization of the coolant inthe liquid phase by the heat of the liquid crystal layer 42.

The liquid crystal panel 7G is disposed such that one direction of the+Y direction and the −Y direction is the vertical direction upper side,whereby the condensed coolant in the liquid phase can be transported to,by not only the capillarity but also the gravity, the vaporizingsections that vaporize the coolant in the liquid phase.

Consequently, the change from the coolant in the liquid phase to thecoolant in the gas phase by the use of the heat received by the heatreceiving section 821 can be accelerated. Therefore, it is possible toimprove the heat radiation efficiency of the heat of the liquid crystallayer 42 and the cooling efficiency of the liquid crystal layer 42.

First Modification of the Sixth Embodiment

In the liquid crystal panel 7G, the side surface 453 of the incidentside dustproof substrate 45 is coupled to the inner circumferentialsurface of the opening section 84, which is a part of the heat receivingsection 821, via the thermally conductive adhesive in a heattransferable manner.

However, not only this, but the side surface 453 and the innercircumferential surface of the opening section 84 may not be coupled ina heat transferable manner. The side surface 453 and the innercircumferential surface of the opening section 84 may be coupled via aheat transfer member such as a leaf spring in a heat transferablemanner.

Besides, the entire side surface 453 is not always coupled to the innercircumferential surface of the opening section 84 in a heat transferablemanner. A part of the side surface 453 may be coupled to the innercircumferential surface of the opening section 84 in a heat transferablemanner.

Second Modification of the Sixth Embodiment

In the liquid crystal panel 7G, the heat receiving section 821 of theincident side cooling member 8G is directly coupled to the lightincident surface 441 of the counter substrate 44 and is coupled to theside surface 453 of the incident side dustproof substrate 45 via thethermally conductive adhesive or the like in a heat transferable manner.

However, not only this, but the heat receiving section 821 may bedirectly coupled to the incident side dustproof substrate 45 and may notbe directly coupled to the counter substrate 44.

For example, a heat transfer member capable of transferring heat fromthe counter substrate 44 to the heat receiving section 821 may beprovided between the counter substrate 44 and the heat receiving section821.

FIG. 24 is a diagram schematically showing a cross section along a YZplane of a liquid crystal panel 7H, which is a modification of theliquid crystal panel 7G.

For example, the liquid crystal panel 7H shown in FIG. 24 may be adoptedinstead of the liquid crystal panel 7G.

The liquid crystal panel 7H includes the same components and the samefunctions as the components and the functions of the liquid crystalpanel 7G except that the liquid crystal panel 7H includes an incidentside cooling member 8H instead of the incident side cooling member 8G.That is, the liquid crystal panel 7H includes the panel main body 41,the wire 49, the holding housing 50, the clamping member 51, and theincident side cooling member 8H.

The incident side cooling member 8H includes a main body section 81H,the first heat radiating member 88, and the second heat radiating member89. The main body section 81H includes the first member 82, the secondmember 83, and the opening section 84. The first member 82 includes thefirst surface 82A and the heat receiving section 821. The second member83 includes the second surface 83A, the first heat radiating section831, and the second heat radiating section 832. Like the main bodysection 81A, the main body section 81H extends from the opening section84 in the +Y direction, which is the extending direction of the wire 49from the liquid crystal layer 42. Besides, like the main body section81D, the main body section 81H extends from the opening section 84 inthe −Y direction, which is the opposite direction of the extendingdirection of the wire 49.

In the incident side cooling member 8H, the first surface 82A of thefirst member 82 is not directly coupled to the counter substrate 44 andis coupled to the counter substrate 44 via the holding housing 50 in aheat transferable manner. The first surface 82A is coupled to the lightincident surface 451 of the incident side dustproof substrate 45.

That is, when viewed from the opposite direction of a travelingdirection of light made incident on the liquid crystal layer 42 (the −Zdirection), the area of the incident side dustproof substrate 45 islarger than the area of the opening section 84 of the incident sidecooling member 8H. Accordingly, the incident side dustproof substrate 45is not disposed on the inner side of the opening section 84. The firstsurface 82A is coupled to the light incident surface 451 of the incidentside dustproof substrate 45 in a portion around the opening section 84.

That is, the incident side cooling member 8H is provided on the incidentside dustproof substrate 45 such that a circumferential portion of theopening section 84 on the first surface 82A is coupled to the lightincident surface 451.

In other words, a part of the heat receiving section 821 provided aroundthe opening section 84 is coupled to the light incident surface 451 ofthe incident side dustproof substrate 45 in a heat transferable manner,another part of the heat receiving section 821 is coupled to the countersubstrate 44 via the holding housing 50 in a heat transferable manner,and still another part of the heat receiving section 821 is coupled tothe counter substrate 44 via the holding housing 50 in a heattransferable manner.

The heat transferred from the liquid crystal layer 42 to the incidentside dustproof substrate 45 via the counter substrate 44 is transferredto the heat receiving section 821.

As explained above, in a heat quantity generated by the liquid crystallayer 42, a heat quantity transferred to the incident side dustproofsubstrate 45 via the counter substrate 44 is larger than a heat quantitytransferred to the holding housing 50 via the counter substrate 44.Accordingly, the heat receiving section 821 may not be coupled to theholding housing 50 in a heat transferable manner.

Such a liquid crystal panel 7H achieves the same effects as the effectsof the liquid crystal panels 7B, 7E, and 7G explained above.

Third Modification of the Sixth Embodiment

In the liquid crystal panel 7G, the heat receiving section 821 of theincident side cooling member 8G is coupled to the light incident surface441 of the counter substrate 44 and the side surface 453 of the incidentside dustproof substrate 45 in a heat transferable manner. In the liquidcrystal panel 7H, the heat receiving section 821 is coupled to the lightincident surface 451 of the incident side dustproof substrate 45 in aheat transferable manner.

However, in the heat receiving section 821, the coupling portions to thecounter substrate 44 and the incident side dustproof substrate 45 arenot limited to the above.

FIG. 25 is a diagram schematically showing a cross section along a YZplane of a liquid crystal panel 7I, which is a modification of theliquid crystal panel 7G.

For example, the liquid crystal panel 7I shown in FIG. 25 may be adoptedinstead of the liquid crystal panel 7G.

The liquid crystal panel 7I includes the same components and the samefunctions as the components and the functions of the liquid crystalpanel 7G except that the liquid crystal panel 7I includes an incidentside cooling member 8I instead of the incident side cooling member 8G.That is, the liquid crystal panel 7I includes the panel main body 41,the wire 49, the holding housing 50, the clamping member 51, and theincident side cooling member 8I.

Like the incident side cooling member 8G, the incident side coolingmember 8I vaporizes the coolant in the liquid phase into the coolant inthe gas phase with heat transferred from the counter substrate 44 andthe incident side dustproof substrate 45 and radiates heat received fromthe coolant in the gas phase to the outside. The incident side coolingmember 8I includes the same components and the same functions as thecomponents and the functions of the incident side cooling member 8Gexcept that the incident side cooling member 8I includes a main bodysection 81I instead of the main body section 81G.

That is, the incident side cooling member 8I includes the main bodysection 81I, the first heat radiating member 88, and the second heatradiating member 89.

Like the main body section 81G, the main body section 81I includes thefirst member 82 and the second member 83 and is configured by combiningthe first member 82 and the second member 83. The main body section 81Iis provided on the counter substrate 44 such that the first surface 82Aof the first member 82 is in contact with the light incident surface 441of the counter substrate 44.

That is, a part of the heat receiving section 821 of the main bodysection 81I is coupled to the counter substrate 44 in a heattransferable manner.

The main body section 81I includes the opening section 84C.

As explained in the third modification of the fourth embodiment, theopening section 84C is the two tier hole including the first openingsection 84C1 provided on the light emission side and the second openingsection 84C2 provided on the light incident side. The incident sidedustproof substrate 45 is disposed on the inside of the first openingsection 84C1. The side surface 453 of the incident side dustproofsubstrate 45 is coupled to the inner circumferential surface of thefirst opening section 84C1 via the thermally conductive adhesive or thelike in a heat transferable manner. A part of the light incident surface451 of the incident side dustproof substrate 45 is coupled to thecoupling section 84C3 in a heat transferable manner.

In other words, the main body section 81I includes a step section formedby the first opening section 84C1, the coupling section 84C3, and thesecond opening section 84C2. The inner circumferential surface of thefirst opening section 84C1 is equivalent to the inner circumferentialsurface of the step section. The coupling section 84C3 is equivalent tothe bottom surface of the step section.

In the main body section 81I, the coupling portions to the countersubstrate 44 and the incident side dustproof substrate 45 are parts ofthe heat receiving section 821. Accordingly, the inner circumferentialsurface of the first opening section 84C1 and the coupling section 84C3are parts of the heat receiving section 821.

Like the main body section 81G, the main body section 81I extends fromthe opening section 84C in the +Y direction, which is the extendingdirection of the wire 49 from the liquid crystal layer 42, and extendsfrom the opening section 84C in the −Y direction, which is the oppositedirection of the extending direction of the wire 49 from the liquidcrystal layer 42. The first heat radiating section 831 and the firstheat radiating member 88 are provided in the +Y direction with respectto the opening section 84C on the second surface 83A. The second heatradiating section 832 and the second heat radiating member 89 areprovided in the −Y direction with respect to the opening section 84C onthe second surface 83A.

Such a liquid crystal panel 7I achieves the same effects as the effectsof the liquid crystal panels 7C, 7F, and 7G explained above.

In the liquid crystal panel 7I, as in the liquid crystal panels 7C and7F, the first member 82 including the heat receiving section 821 and thecounter substrate 44 may not be coupled in a heat transferable manner.In this case, the main body section 81I may be fixed to the incidentside dustproof substrate 45.

Seventh Embodiment

A seventh embodiment of the present disclosure is explained.

A projector according to this embodiment has the same configuration asthe configuration of the projector according to the first embodiment butis different in that a liquid crystal panel includes an incident sidecooling member and an emission side cooling member. In the followingexplanation, the same or substantially the same portions as the portionsexplained above are denoted by the same reference numerals and signs andexplanation of the portions is omitted.

FIG. 26 is a diagram schematically showing a cross section along a YZplane of a liquid crystal panel 9A included in the projector accordingto this embodiment.

The projector according to this embodiment includes the same componentsas the components of the projector 1 according to the first embodimentexcept that the projector according to this embodiment includes theliquid crystal panel 9A shown in FIG. 26 instead of the liquid crystalpanel 4A according to the first embodiment.

The liquid crystal panel 9A includes the incident side cooling member 8Ain addition to the components of the liquid crystal panel 4A accordingto the first embodiment. In other words, the liquid crystal panel 9Aincludes the emission side cooling member 6A in addition to thecomponents of the liquid crystal panel 7A according to the fourthembodiment.

That is, the liquid crystal panel 9A includes the panel main body 41,the wire 49, the holding housing 50, the emission side cooling member6A, and the incident side cooling member 8A. As explained in the firstembodiment, the panel main body 41 includes the liquid crystal layer 42,the incident section 43, and the emission section 46. The incidentsection 43 includes the counter substrate 44 and the incident sidedustproof substrate 45. The emission section 46 includes the pixelsubstrate 47 and the emission side dustproof substrate 48.

In this embodiment, the incident side dustproof substrate 45 isequivalent to the first dustproof substrate and the emission sidedustproof substrate 48 is equivalent to the second dustproof substrate.

The main body section 81A configuring the incident side cooling member8A is equivalent to the first vapor chamber. The first member 82, thesecond member 83, and the opening section 84 configuring the main bodysection 81A are equivalent to the first heat receiving section, thefirst heat radiating section, and the first opening section. When viewedfrom an incident side of light made incident on the liquid crystal layer42 (the −Z direction), the main body section 81A extends further to theouter side than the counter substrate 44 and the incident side dustproofsubstrate 45.

The main body section 61A configuring the emission side cooling member6A is equivalent to the second vapor chamber. The first member 62, thesecond member 63, and the opening section 64 configuring the main bodysection 61A are equivalent to the second heat receiving section, thesecond heat radiating section, and the second opening section. Whenviewed from an emission side of light emitted from the liquid crystallayer 42 (the +Z direction), the main body section 61A extends furtherto the outer side than the pixel substrate 47 and the emission sidedustproof substrate 48.

The main body section 81A and the main body section 61A are opposed toeach other in an incident direction of light on the liquid crystal layer42 (the +Z direction).

In the liquid crystal panel 9A, a part of the heat receiving section 621of the emission side cooling member 6A is coupled to, in a heattransferable manner, the light emission surface 472 of the pixelsubstrate 47 configuring the panel main body 41. The innercircumferential surface of the opening section 64 of the emission sidecooling member 6A is coupled to the side surface 483 of the emissionside dustproof substrate 48 via a thermally conductive adhesive or thelike in a heat transferable manner. The inner circumferential surface ofthe opening section 64 is a part of the heat receiving section 621.

The emission side cooling member 6A may be provided on the pixelsubstrate 47 or may be provided on the emission side dustproof substrate48.

In the liquid crystal panel 9A, a part of the heat receiving section 821of the incident side cooling member 8A is coupled to, in a heattransferable manner, the light incident surface 441 of the countersubstrate 44 configuring the panel main body 41. The innercircumferential surface of the opening section 84 of the incident sidecooling member 8A is coupled to the side surface 453 of the incidentside dustproof substrate 45 via a thermally conductive adhesive or thelike in a heat transferable manner. The inner circumferential surface ofthe opening section 84 is a part of the heat receiving section 821.

The incident side cooling member 8A may be provided on the countersubstrate 44 or may be provided on the incident side dustproof substrate45.

A cooling gas flows from a cooling device to such a liquid crystal panel9A along the +Y direction in the same manner as the cooling gas flows tothe liquid crystal panels 4A to 4I and 7A to 7I explained above.

The cooling gas flowing in a space on a light incident side with respectto the liquid crystal panel 9A flows in the +Y direction and cools theincident side dustproof substrate 45 and the first heat radiating member88.

The cooling gas flowing in a space on a light emission side with respectto the liquid crystal panel 9A flows in the +Y direction and cools theemission side dustproof substrate 48 and the first heat radiating member68.

In this way, in the liquid crystal panel 9A, the heat of the liquidcrystal layer 42 is radiated to the outside of the liquid crystal panel9A by the incident side dustproof substrate 45, the emission sidedustproof substrate 48, the emission side cooling member 6A, and theincident side cooling member 8A, the liquid crystal layer 42 is cooled,and the driver circuit 491 is cooled.

Effects of the Seventh Embodiment

The projector according to this embodiment explained above achieves thesame effects as the effects of the projector 1 according to the firstembodiment and the projector according to the fourth embodiment. Thatis, the liquid crystal panel 9A according to this embodiment can achievethe same effects as the effects of the liquid crystal panel 4A accordingto the first embodiment and the liquid crystal panel 7A according to thefourth embodiment.

Specifically, the liquid crystal panel 9A is a transmissive liquidcrystal panel that emits modulated light along a traveling direction oflight made incident on the liquid crystal panel. The liquid crystalpanel 9A includes the pixel region 41A, the liquid crystal layer 42, thecounter substrate 44, the incident side dustproof substrate 45, thepixel substrate 47, the emission side dustproof substrate 48, and themain body sections 61A and 81A. A plurality of pixels are arrayed in thepixel region 41A.

The liquid crystal layer 42 modulates light for each of the plurality ofpixels. The counter substrate 44 includes a common electrode provided tocorrespond to the pixel region 41A. The pixel substrate 47 includes aplurality of pixel electrodes provided to respectively correspond to theplurality of pixels and carries the liquid crystal layer 42 between thepixel substrate 47 and the counter substrate 44.

The incident side dustproof substrate 45 is equivalent to the firstdustproof substrate and is provided on a surface on the opposite side ofthe pixel substrate 47 in the counter substrate 44. The emission sidedustproof substrate 48 is equivalent to the second dustproof substrateand is provided on a surface on the opposite side of the countersubstrate 44 in the pixel electrode 47.

The main body section 81A is equivalent to the first vapor chamber andincludes the opening section 84 functioning as the first openingsection, the heat receiving section 821 functioning as the first heatreceiving section, and the first heat radiating section 831 functioningas the first heat radiating section. The opening section 84 is anopening section corresponding to the pixel region 41A. The heatreceiving section 821 is provided around the opening section 84 and iscoupled to at least one of the counter substrate 44 and the incidentside dustproof substrate 45 in a heat transferable manner. The firstheat radiating section 831 radiates heat received by the heat receivingsection 821. The main body section 81A vaporizes, with the heat receivedby the heat receiving section 821, the coolant in the liquid phaseencapsulated on the inside and radiates the heat of the coolant in thegas phase with the first heat radiating section 831 to thereby condensethe coolant in the gas phase into the coolant in the liquid phase. Thecoolant encapsulated in the encapsulating space SP of the main bodysection 81A is equivalent to the first coolant.

The main body section 61A is equivalent to the second vapor chamber andincludes the opening section 64 functioning as the second openingsection, the heat receiving section 621 functioning as the second heatreceiving section, and the first heat radiating section 631 functioningas the second heat radiating section. The opening section 64 is anopening section corresponding to the pixel region 41A. The heatreceiving section 621 is provided around the opening section 64 and iscoupled to at least one of the pixel substrate 47 and the emission sidedustproof substrate 48 in a heat transferable manner. The first heatradiating section 631 radiates heat received by the heat receivingsection 621. The main body section 61A vaporizes, with the heat receivedby the heat receiving section 621, the coolant in the liquid phaseencapsulated on the inside and radiates the heat of the coolant in thegas phase with the first heat radiating section 631 to thereby condensethe coolant in the gas phase into the coolant in the liquid phase. Thecoolant encapsulated in the encapsulating space SP of the main bodysection 61A is equivalent to the second coolant.

With such a configuration, the same effects as the effects of the liquidcrystal panels 4A and 7A can be achieved.

The liquid crystal panel 9A includes the main body section 81A coupledto at least one of the counter substrate 44 and the incident sidedustproof substrate 45 in a heat transferable manner and the main bodysection 61A coupled to at least one of the pixel substrate 47 and theemission side dustproof substrate 48 in a heat transferable manner.Consequently, it is possible to further improve cooling efficiency ofthe liquid crystal layer 42.

In the liquid crystal panel 9A, when viewed from an incident side oflight made incident on the liquid crystal layer 42, the main bodysection 81A functioning as the first vapor chamber extends further tothe outer side than the counter substrate 44 and the incident sidedustproof substrate 45. When viewed from an emission side of lightemitted from the liquid crystal layer 42, the main body section 61Afunctioning as the second vapor chamber extends further to the outerside than the pixel substrate 47 and the emission side dustproofsubstrate 48. The main body section 81A and the main body section 61Aare opposed to each other in an incident direction of light with respectto the liquid crystal layer 42.

With such a configuration, compared with when the main body section 81Aand the main body section 61A are not opposed to each other, it ispossible to prevent an increase in the size of the liquid crystal panel9A.

First Modification of the Seventh Embodiment

In the liquid crystal panel 9A, the side surface 453 of the incidentside dustproof substrate 45 is coupled to the inner circumferentialsurface of the opening section 84, which is a part of the heat receivingsection 821, in the main body section 81A of the incident side coolingmember 8A via the thermally conductive adhesive in a heat transferablemanner. The side surface 483 of the emission side dustproof substrate 48is coupled to the inner circumferential surface of the opening section64, which is a part of the heat receiving section 621, in the main bodysection 61A of the emission side cooling member 6A via the thermallyconductive adhesive in a heat transferable manner.

However, not only this, but at least one side surface of the sidesurface 453 of the incident side dustproof substrate 45 and the sidesurface 483 of the emission side dustproof substrate 48 may not becoupled to the inner circumferential surface of an opening sectioncorresponding thereto of the opening section 84 of the incident sidecooling member 8A and the opening section 64 of the emission sidecooling member 6A.

At least one side surface of the side surface 453 of the incident sidedustproof substrate 45 and the side surface 483 of the emission sidedustproof substrate 48 may be coupled to the inner circumferentialsurface of an opening section corresponding thereto of the openingsection 84 of the incident side cooling member 8A and the openingsection 64 of the emission side cooling member 6A via a heat transfermember such as a leaf spring in a heat transferable manner.

Besides, as explained above, a part of the side surface 453 may becoupled to the inner circumferential surface of the opening section 84in a heat transferable manner or a part of the side surface 483 may becoupled to the inner circumferential surface of the opening section 64in a heat transferable manner.

Second Modification of the Seventh Embodiment

In the liquid crystal panel 9A, the emission side cooling member 6A isadopted as the emission side cooling member and the incident sidecooling member 8A is adopted as the incident side cooling member.

However, not only this, but the configuration of the incident sidecooling member and the configuration of the emission side cooling memberare not limited to the above. For example, a liquid crystal panel mayinclude one of the emission side cooling members 6A to 61 as theemission side cooling member and include one of the incident sidecooling members 8A to 8I as the incident side cooling member.

In this case, the emission side cooling member may be configured suchthat, when viewed from an emission side of light emitted from the liquidcrystal layer 42 (the +Z direction), the main body section extendsfurther to the outer side than the pixel substrate 47 and the emissionside dustproof substrate 48.

The incident side cooling member may be configured such that, whenviewed from an incident side of light made incident on the liquidcrystal layer 42 (the −Z direction), the main body section extendsfurther to the outer side than the counter substrate 44 and the incidentside dustproof substrate 45.

The emission side cooling member and the incident side cooling membermay be disposed such that the main body section of the emission sidecooling member and the main body section of the incident side coolingmember are opposed to each other in an incident direction of light madeincident on the liquid crystal layer 42 (the +Z direction).

FIG. 27 is a diagram schematically showing a cross section along a YZplane of a liquid crystal panel 9B, which is a modification of theliquid crystal panel 9A.

For example, the liquid crystal panel 9B shown in FIG. 27 may be adoptedinstead of the liquid crystal panel 9A.

The liquid crystal panel 9B has a configuration in which the liquidcrystal panel 4B explained in the second modification of the firstembodiment and the liquid crystal panel 7B explained in the secondmodification of the fourth embodiment are combined. That is, the liquidcrystal panel 9B includes the panel main body 41, the wire 49, theholding housing 50, the clamping member 51, the emission side coolingmember 6B, and the incident side cooling member 8B.

In the liquid crystal panel 9B, the emission side cooling member 6B isprovided on the emission side dustproof substrate 48 such that the heatreceiving section 621 provided around the opening section 64 is coupledto the light emission surface 482. Another part of the heat receivingsection 621 is coupled to the pixel substrate 47 via the clamping member51 in a heat transferable manner.

In the liquid crystal panel 9B, the incident side cooling member 8B isprovided on the incident side dustproof substrate 45 such that the heatreceiving section 821 provided around the opening section 84 is coupledto the light incident surface 451. Another part of the heat receivingsection 821 is coupled to the counter substrate 44 via the holdinghousing 50 in a heat transferable manner.

The heat receiving section 621 may not be coupled to the clamping member51 in a heat transferable manner. The heat receiving section 821 may notbe coupled to the holding housing 50 in a heat transferable manner.

Such a liquid crystal panel 9B achieves the same effects as the effectsof the liquid crystal panels 4B, 7B, and 9A.

Third Modification of the Seventh Embodiment

FIG. 28 is a diagram schematically showing a cross section along a YZplane of a liquid crystal panel 9C, which is a modification of theliquid crystal panel 9A.

For example, the liquid crystal panel 9C shown in FIG. 28 may be adoptedinstead of the liquid crystal panel 9A.

The liquid crystal panel 9C has a configuration in which the liquidcrystal panel 4C explained in the third modification of the firstembodiment and the liquid crystal panel 7C explained in the thirdmodification of the fourth embodiment are combined.

That is, the liquid crystal panel 9C includes the panel main body 41,the wire 49, the holding housing 50, the clamping member 51, theemission side cooling member 6C, and the incident side cooling member8C.

In the liquid crystal panel 9C, the emission side dustproof substrate 48is disposed in the first opening section 64C1 of the emission sidecooling member 6C. The inner edge of the first opening section 64C1 iscoupled to the side surface 483 of the emission side dustproof substrate48. The coupling section 64C3 is coupled to a part of the light emissionsurface 482 of the emission side dustproof substrate 48.

The heat receiving section 621 of the first member 62 is coupled to thepixel substrate 47.

In the liquid crystal panel 9C, the incident side dustproof substrate 45is disposed in the first opening section 84C1 of the incident sidecooling member 8C. The inner edge of the first opening section 84C1 iscoupled to the side surface 453 of the incident side dustproof substrate45. The coupling section 84C3 is coupled to a part of the light incidentsurface 451 of the incident side dustproof substrate 45.

The heat receiving section 821 of the first member 82 is coupled to thecounter substrate 44 via the holding housing 50 in a heat transferablemanner.

The heat receiving section 621 may not be coupled to the clamping member51 in a heat transferable manner. The heat receiving section 821 may notbe coupled to the holding housing 50 in a heat transferable manner.

Such a liquid crystal panel 9C achieves the same effects as the effectsof the liquid crystal panels 4C, 7C, and 9A.

Fourth Modification of the Seventh Embodiment

FIG. 29 is a diagram schematically showing a cross section along a YZplane of a liquid crystal panel 9D, which is a modification of theliquid crystal panel 9A.

For example, the liquid crystal panel 9D shown in FIG. 29 may be adoptedinstead of the liquid crystal panel 9A.

The liquid crystal panel 9D has a configuration in which the liquidcrystal panel 4D explained in the second embodiment and the liquidcrystal panel 7D explained in the fifth embodiment are combined.

That is, the liquid crystal panel 9D includes the panel main body 41,the wire 49, the holding housing 50, the emission side cooling member6D, and the incident side cooling member 8D.

The main body section 61D of the emission side cooling member 6D extendsfrom the opening section 64 in the −Y direction, which is the oppositedirection of the extending direction of the wire 49 from the liquidcrystal layer 42. The main body section 81D of the incident side coolingmember 8D extends from the opening section 84 in the −Y direction, whichis the opposite direction of the extending direction of the wire 49 fromthe liquid crystal layer 42.

In the liquid crystal panel 9D, the heat receiving section 621 of theemission side cooling member 6D is coupled to the light emission surface472 of the pixel substrate 47. The emission side dustproof substrate 48is disposed on the inner side of the opening section 64. The sidesurface 483 of the emission side dustproof substrate 48 is coupled tothe inner circumferential surface of the opening section 64 of theemission side cooling member 6G via a thermally conductive adhesive orthe like in a heat transferable manner. The inner circumferentialsurface of the opening section 64 is a part of the heat receivingsection 621.

The main body section 61D of the emission side cooling member 6D may beprovided on the pixel substrate 47 or may be provided on the emissionside dustproof substrate 48.

In the liquid crystal panel 9D, the heat receiving section 821 of theincident side cooling member 8D is coupled to the light incident surface441 of the counter substrate 44. The incident side dustproof substrate45 is disposed on the inner side of the opening section 84. The sidesurface 453 of the incident side dustproof substrate 45 is coupled tothe inner circumferential surface of the opening section 84 of theincident side cooling member 8D via a thermally conductive adhesive orthe like in a heat transferable manner. The inner circumferentialsurface of the opening section 84 is a part of the heat receivingsection 821.

The main body section 81D of the incident side cooling member 8D may beprovided on the counter substrate 44 or may be provided on the incidentside dustproof substrate 45.

A cooling gas flows from a cooling device to such a liquid crystal panel9D along the +Y direction in the same manner as the cooling gas flows tothe liquid crystal panels 4A to 4I and 7A to 7I.

The cooling gas flowing in a space on the light incident side withrespect to the liquid crystal panel 9D flows in the +Y direction andcools the first heat radiating member 88 and the incident side dustproofsubstrate 45 in order and, thereafter, cools the holding housing 50.

The cooling gas flowing in a space on the light emission side withrespect to the liquid crystal panel 9D flows in the +Y direction andcools the first heat radiating member 68 and the emission side dustproofsubstrate 48 in order and, thereafter, cools the clamping member 51.

In this way, in the liquid crystal panel 9D, the heat of the liquidcrystal layer 42 is radiated to the outside of the liquid crystal panel9D by the incident side dustproof substrate 45, the emission sidedustproof substrate 48, the emission side cooling member 6D, and theincident side cooling member 8D, the liquid crystal layer 42 is cooled,and the driver circuit 491 is cooled.

Such a liquid crystal panel 9D achieves the same effects as the effectsof the liquid crystal panels 4D, 7D, and 9A.

Fifth Modification of the Seventh Embodiment

FIG. 30 is a diagram schematically showing a cross section along a YZplane of a liquid crystal panel 9E, which is a modification of theliquid crystal panel 9A.

For example, the liquid crystal panel 9E shown in FIG. 30 may be adoptedinstead of the liquid crystal panel 9A.

The liquid crystal panel 9E has a configuration in which the liquidcrystal panel 4E explained in the second modification of the secondembodiment and the liquid crystal panel 7E explained in the secondmodification of the fifth embodiment are combined.

That is, the liquid crystal panel 9E includes the panel main body 41,the wire 49, the holding housing 50, the clamping member 51, theemission side cooling member 6E, and the incident side cooling member8E.

In the liquid crystal panel 9E, the main body section 61E of theemission side cooling member 6E is provided on the emission sidedustproof substrate 48 such that a part of the heat receiving section621 provided around the opening section 64 on the first surface 62A iscoupled to the light emission surface 482. Another part of the heatreceiving section 621 is coupled to the pixel substrate 47 via theclamping member 51 in a heat transferable manner.

In the liquid crystal panel 9E, the main body section 81E of theincident side cooling member 8E is provided on the incident sidedustproof substrate 45 such that a part of the heat receiving section821 provided around the opening section 84 on the first surface 82A iscoupled to the light incident surface 451. Another part of the heatreceiving section 821 is coupled to the counter substrate 44 via theholding housing 50 in a heat transferable manner.

The heat receiving section 621 may not be coupled to the clamping member51 in a heat transferable manner. The heat receiving section 821 may notbe coupled to the holding housing 50 in a heat transferable manner.

Such a liquid crystal panel 9E achieves the same effects as the effectsof the liquid crystal panels 4E, 7E and 9D.

Sixth Modification of the Seventh Embodiment

FIG. 31 is a diagram schematically showing a cross section along a YZplane of a liquid crystal panel 9F, which is a modification of theliquid crystal panel 9A.

For example, the liquid crystal panel 9F shown in FIG. 31 may be adoptedinstead of the liquid crystal panel 9A.

The liquid crystal panel 9F has a configuration in which the liquidcrystal panel 4F explained in the third modification of the secondembodiment and the liquid crystal panel 7F explained in the thirdmodification of the fifth embodiment are combined.

That is, the liquid crystal panel 9F includes the panel main body 41,the wire 49, the holding housing 50, the clamping member 51, theemission side cooling member 6F, and the incident side cooling member8F.

In the liquid crystal panel 9F, the emission side dustproof substrate 48is disposed in the first opening section 64C1 of the emission sidecooling member 6F. The inner circumferential surface of the firstopening section 64C1 is coupled to the side surface 483 of the emissionside dustproof substrate 48 in a heat transferable manner. The couplingsection 64C3 is coupled to a part of the light emission surface 482 ofthe emission side dustproof substrate 48. The heat receiving section 621is coupled to the pixel substrate 47.

The heat receiving section 621 may not always be coupled to the pixelsubstrate 47.

In the liquid crystal panel 9F, the incident side dustproof substrate 45is disposed in the first opening section 84C1 of the incident sidecooling member 8F. The inner circumferential surface of the firstopening section 84C1 is coupled to the side surface 453 of the incidentside dustproof substrate 45 in a heat transferable manner. The couplingsection 84C3 is coupled to a part of the light incident surface 451 ofthe incident side dustproof substrate 45. The heat receiving section 821is coupled to the counter substrate 44 via the holding housing 50 in aheat transferable manner.

The heat receiving section 621 may not be coupled to the clamping member51 in a heat transferable manner. The heat receiving section 821 may notbe coupled to the holding housing 50 in a heat transferable manner.

Such a liquid crystal panel 9F achieves the same effects as the effectsof the liquid crystal panels 4F, 7F, and 9D.

Seventh Modification of the Seventh Embodiment

FIG. 32 is a diagram schematically showing a cross section along a YZplane of a liquid crystal panel 9G, which is a modification of theliquid crystal panel 9A.

For example, the liquid crystal panel 9G shown in FIG. 32 may be adoptedinstead of the liquid crystal panel 9A.

The liquid crystal panel 9G has a configuration in which the liquidcrystal panel 4G explained in the third embodiment and the liquidcrystal panel 7G explained in the sixth embodiment are combined.

That is, the liquid crystal panel 9G includes the panel main body 41,the wire 49, the holding housing 50, the clamping member 51, theemission side cooling member 6G, and the incident side cooling member8G.

In the liquid crystal panel 9G, the heat receiving section 621 of theemission side cooling member 6G is coupled to the light emission surface472 of the pixel substrate 47 in a heat transferable manner. Theemission side dustproof substrate 48 is disposed on the inner side ofthe opening section 64 of the emission side cooling member 6G. The sidesurface 483 is coupled to the inner circumferential surface of theopening section 64 via a thermally conductive adhesive or the like in aheat transferable manner. The main body section 61G of the emission sidecooling member 6G may be provided on the pixel substrate 47 or may beprovided on the emission side dustproof substrate 48.

In the liquid crystal panel 9G, the heat receiving section 821 of theincident side cooling member 8G is coupled to the light incident surface441 of the counter substrate 44 in a heat transferable manner. Theincident side dustproof substrate 45 is disposed on the inner side ofthe opening section 84 of the incident side cooling member 8G. The sidesurface 453 is coupled to the inner circumferential surface of theopening section 84 via a thermally conductive adhesive or the like in aheat transferable manner. The main body section 81G of the incident sidecooling member 8G may be provided on the counter substrate 44 or may beprovided on the incident side dustproof substrate 45.

A cooling gas flows from a fan of a cooling device to such a liquidcrystal panel 9G along the +Y direction in the same manner as thecooling gas flows to the liquid crystal panels 4A to 4I and 7A to 7Iexplained above.

The cooling gas flowing in a space on the light incident side withrespect to the liquid crystal panel 9G flows in the +Y direction andcools the second heat radiating member 89, the incident side dustproofsubstrate 45, and the first heat radiating member 88 in order.

The cooling gas flowing in a space on the light emission side withrespect to the liquid crystal panel 9G flows in the +Y direction andcools the second heat radiating member 69, the emission side dustproofsubstrate 48, and the first heat radiating member 68 in order.

In this way, in the liquid crystal panel 9G, the heat of the liquidcrystal layer 42 is radiated to the outside of the liquid crystal panel9G by the incident side dustproof substrate 45, the emission sidedustproof substrate 48, the emission side cooling member 6G, and theincident side cooling member 8G, the liquid crystal layer 42 is cooled,and the driver circuit 491 is cooled.

Such a liquid crystal panel 9G achieves the same effects as the effectsof the liquid crystal panels 4G, 7G, and 9A.

Eighth Modification of the Seventh Embodiment

FIG. 33 is a diagram schematically showing a cross section along a YZplane of a liquid crystal panel 9H, which is a modification of theliquid crystal panel 9A.

For example, the liquid crystal panel 9H shown in FIG. 33 may be adoptedinstead of the liquid crystal panel 9A.

The liquid crystal panel 9H has a configuration in which the liquidcrystal panel 4H explained in the second modification of the thirdembodiment and the liquid crystal panel 7H explained in the secondmodification of the sixth embodiment are combined.

That is, the liquid crystal panel 9H includes the panel main body 41,the wire 49, the holding housing 50, the clamping member 51, theemission side cooling member 6H, and the incident side cooling member8H.

In the liquid crystal panel 9H, the main body section 61H of theemission side cooling member 6H is provided on the emission sidedustproof substrate 48. The heat receiving section 621 provided aroundthe opening section 64 on the first surface 62A is coupled to the lightemission surface 482 of the emission side dustproof substrate 48.Another part of the heat receiving section 621 is coupled to the pixelsubstrate 47 via the clamping member 51 in a heat transferable manner.

In the liquid crystal panel 9H, the main body section 81H of theincident side cooling member 8E is provided on the incident sidedustproof substrate 45. The heat receiving section 821 provided aroundthe opening section 84 on the first surface 82A is coupled to the lightincident surface 451 of the incident side dustproof substrate 45.Another part of the heat receiving section 821 is coupled to the countersubstrate 44 via the holding housing 50 in a heat transferable manner.

The heat receiving section 621 may not be coupled to the clamping member51 in a heat transferable manner. The heat receiving section 821 may notbe coupled to the holding housing 50 in a heat transferable manner.

Such a liquid crystal panel 9H achieves the same effects as the effectsof the liquid crystal panels 4H, 7H, and 9G.

Ninth Modification of the Seventh Embodiment

FIG. 34 is a diagram schematically showing a cross section along a YZplane of a liquid crystal panel 9I, which is a modification of theliquid crystal panel 9A.

For example, the liquid crystal panel 9I shown in FIG. 34 may be adoptedinstead of the liquid crystal panel 9A.

The liquid crystal panel 9I has a configuration in which the liquidcrystal panel 4I explained in the third modification of the thirdembodiment and the liquid crystal panel 7I explained in the thirdmodification of the sixth embodiment are combined.

That is, the liquid crystal panel 9I includes the panel main body 41,the wire 49, the holding housing 50, the clamping member 51, theemission side cooling member 6I, and the incident side cooling member8I.

In the liquid crystal panel 9I, the emission side dustproof substrate 48is disposed in the first opening section 64C1 of the emission sidecooling member 6I. The inner circumferential surface of the firstopening section 64C1 is coupled to the side surface 483 of the emissionside dustproof substrate 48. The coupling section 64C3 is coupled to apart of the light emission surface 482 of the emission side dustproofsubstrate 48. The inner circumferential surface of the first openingsection 64C1 and the coupling section 64C3 are parts of the heatreceiving section 621. The heat receiving section 621 is coupled to thepixel substrate 47.

In the liquid crystal panel 9I, the incident side dustproof substrate 45is disposed in the first opening section 84C1 of the incident sidecooling member 8I. The inner circumferential surface of the firstopening section 84C1 is coupled to the side surface 453 of the incidentside dustproof substrate 45. The coupling section 84C3 is coupled to apart of the light incident surface 451 of the incident side dustproofsubstrate 45. The inner circumferential surface of the first openingsection 84C1 and the coupling section 84C3 are parts of the heatreceiving section 821. The heat receiving section 821 is coupled to thecounter substrate 44 and the pixel substrate 47 via the holding housing50 in a heat transferable manner.

The heat receiving section 621 may not be coupled to the clamping member51 in a heat transferable manner. The heat receiving section 821 may notbe coupled to the holding housing 50 in a heat transferable manner.

Such a liquid crystal panel 9I achieves the same effects as the effectsof the liquid crystal panels 4I, 7I, and 9G.

Tenth Modification of the Seventh Embodiment

In the liquid crystal panel 9A, the main body section 81A functioning asthe first vapor chamber among the components of the incident sidecooling member 8A and the main body section 61A functioning as thesecond vapor chamber among the components of the emission side coolingmember 6A are opposed to each other in the traveling direction of thelight made incident on the liquid crystal layer 42.

However, not only this, but the main body section 81A and the main bodysection 61A may not be opposed to each other in the traveling directionof the light made incident on the liquid crystal layer 42. The sameapplies in a liquid crystal panel including one emission side coolingmember among the emission side cooling members 6A to 61 and one incidentside cooling member among the incident side cooling members 8A to 8I.

FIG. 35 is a schematic diagram of a liquid crystal panel 9J, which is amodification of the liquid crystal panel 9G, viewed from the lightincident side with respect to the liquid crystal layer 42. In otherwords, FIG. 35 is a diagram showing disposition of the main body section61G of the emission side cooling member 6G and the main body section 81Gof the incident side cooling member 8G in the liquid crystal panel 9J.

For example, the liquid crystal panel 9J shown in FIG. 35 may be adoptedinstead of the liquid crystal panel 9A.

Like the liquid crystal panel 9G, the liquid crystal panel 9J includesthe panel main body 41, the wire 49, the holding housing 50 not shown inFIG. 35 , the emission side cooling member 6G, and the incident sidecooling member 8G.

In the liquid crystal panel 9J, the main body section 61G configuringthe emission side cooling member 6G is inclined with respect to each ofthe +Y direction and the +X direction to be located further in the +Xdirection toward the +Y direction from the end portion in the −Ydirection in the main body section 61G. Accordingly, in an example shownin FIG. 35 , the first heat radiating member 68 of the emission sidecooling member 6G is disposed in a position in the +X direction and the+Y direction with respect to the pixel region 41A and the second heatradiating member 69 is disposed in a position in the −X direction andthe −Y direction with respect to the pixel region 41A.

The first heat radiating member 68 and the second heat radiating member69 are provided to correspond to the first heat radiating section 631and the second heat radiating section 632 such that a channel providedin each of the first heat radiating member 68 and the second heatradiating member 69 extends along the +Y direction.

In the liquid crystal panel 9J, the main body section 81G configuringthe incident side cooling member 8G is inclined with respect to each ofthe +Y direction and the +X direction to be located further in the −Xdirection toward the +Y direction from the end portion in the −Ydirection in the main body section 81G. Accordingly, in the exampleshown in FIG. 35 , the first heat radiating member 88 of the incidentside cooling member 8G is disposed in a position in the −X direction andthe +Y direction with respect to the pixel region 41A and the secondheat radiating member 89 is disposed in a position in the +X directionand the −Y direction with respect to the pixel region 41A.

The first heat radiating member 88 and the second heat radiating member89 are provided to correspond to the first heat radiating section 831and the second heat radiating section 832 such that a channel providedin each of the first heat radiating member 88 and the second heatradiating member 89 extends along the +Y direction.

In this way, in the liquid crystal panel 9J, the emission side coolingmember 6G and the incident side cooling member 8G are provided to crossin the pixel region 41A when viewed from the light incident side withrespect to the liquid crystal panel 9J.

Consequently, it is possible to allow a cooling gas flowing along the +Ydirection to easily flow to each of the heat radiating members 68, 69,88, and 89, the incident side dustproof substrate 45, and the emissionside dustproof substrate 48. Therefore, it is possible to improve thecooling efficiency of the liquid crystal layer 42.

The main body section 61G may be inclined to be located further in the-X direction toward the +Y direction from the end portion in the −Ydirection in the main body section 61G. The main body section 81G may beinclined to be located further in the +X direction toward the +Ydirection from the end portion in the −Y direction in the main bodysection 81G.

Cooling members disposed as explained above are not limited to theemission side cooling member 6G and the incident side cooling member 8Gand may be one of the emission side cooling members 6A to 6I or may beone of the incident side cooling members 8A to 8I. For example, evenwhen a liquid crystal panel includes one cooling member of an emissionside cooling member and an incident side cooling member, the one coolingmember may be inclined with respect to the +X direction and the +Ydirection.

Modifications of the Embodiments

The present disclosure is not limited to the embodiments including themodifications. Modifications, improvements, and the like in a range inwhich the object of the present disclosure can be attained are includedin the present disclosure.

In the emission side cooling members according to the second and seventhembodiments, the first heat radiating member 68 provided to correspondto the first heat radiating section 631 on the second surface 63A of thesecond member 63 is disposed on the light emission side with respect tothe first member 62.

However, not only this, but the first heat radiating member 68 may beprovided on the light incident side with respect to the first member 62.

In the emission side cooling members according to the third and seventhembodiments, the second heat radiating member 69 provided to correspondto the second heat radiating section 632 on the second surface 63A ofthe second member 63 is disposed on the light emission side with respectto the first member 62.

However, not only this, but the second heat radiating member 69 may beprovided on the light incident side with respect to the first member 62.

In these cases, for example, the first heat radiating section 631 andthe first heat radiating member 68 only have to be coupled by a heattransfer member in a heat transferable manner. For example, the secondheat radiating section 632 and the second heat radiating member 69 onlyhave to be coupled by a heat transfer member in a heat transferablemanner.

The heat transfer member may include a function of supporting the firstheat radiating member 68 and the second heat radiating member 69.

In the incident side cooling members according to the fourth and seventhembodiments, the first heat radiating member 88 provided to correspondto the first heat radiating section 831 on the second surface 83A of thesecond member 83 is disposed on the light incident side with respect tothe first member 82.

However, not only this, but the first heat radiating member 88 may beprovided on the light emission side with respect to the first member 82.

In the incident side cooling members according to the fifth and seventhembodiments, the second heat radiating member 89 provided to correspondto the second heat radiating section 832 on the second surface 83A ofthe second member 83 is disposed on the light incident side with respectto the first member 82.

However, not only this, but the second heat radiating member 89 may beprovided on the light emission side with respect to the first member 82.

In these cases, for example, the first heat radiating section 831 andthe first heat radiating member 88 only have to be coupled by a heattransfer member in a heat transferable manner. For example, the secondheat radiating section 832 and the second heat radiating member 89 onlyhave to be coupled by a heat transfer member in a heat transferablemanner.

The heat transfer member may include a function of supporting the firstheat radiating member 88 or the second heat radiating member 89.

FIG. 36 is a diagram schematically showing a cross section along a YZplane of a liquid crystal panel 9K, which is a modification of theliquid crystal panel 9D.

For example, the liquid crystal panel 9K shown in FIG. 36 may be adoptedinstead of the liquid crystal panel 9D.

The liquid crystal panel 9K includes the same components and the samefunctions as the components and the functions of the liquid crystalpanel 9D except that the liquid crystal panel 9K includes an emissionside cooling member 6K and an incident side cooling member 8K instead ofthe emission side cooling member 6D and the incident side cooling member8D.

That is, the liquid crystal panel 9K includes the panel main body 41,the wire 49, the holding housing 50, the clamping member 51, theemission side cooling member 6K, and the incident side cooling member8K.

Like the emission side cooling member 6D, the emission side coolingmember 6K vaporizes the coolant in the liquid phase into the coolant inthe gas phase with heat transferred from the pixel substrate 47 and theemission side dustproof substrate 48 and radiates heat received from thecoolant in the gas phase to the outside. The emission side coolingmember 6K includes the same components and the same functions as thecomponents and the functions of the emission side cooling member 6Dexcept that the emission side cooling member 6K includes a heat transfermember 67 and disposition of the first heat radiating member 68 isdifferent.

That is, the emission side cooling member 6K includes the main bodysection 61D, the heat transfer member 67, and the first heat radiatingmember 68.

In the emission side cooling member 6K, the first heat radiating member68 is disposed on the light incident side with respect to the firstmember 62. That is, the first heat radiating member 68 is disposed onthe opposite side of the second member 63 with respect to the firstmember 62.

When the plurality of fins 681 are provided as the plurality of finsincluded in the first heat radiating member 68, the channels provided inthe fins 681 may be inclined with respect to the +Y direction to belocated further in the +X direction or the −X direction toward the +Ydirection.

The heat transfer member 67 couples the first heat radiating section 631on the second surface 63A and the first heat radiating member 68 in aheat transferable manner and transfers, to the first heat radiatingmember 68, the heat of the coolant in the gas phase transferred from thefirst condensing section to the first heat radiating section 631. Theheat transfer member 67 may be formed by, for example, a metal sheet ormay be formed by a metal member capable of supporting the first heatradiating member 68.

Like the incident side cooling member 8D, the incident side coolingmember 8K vaporizes the coolant in the liquid phase into the coolant inthe gas phase with heat transferred from the counter substrate 44 andthe incident side dustproof substrate 45 and radiates heat received fromthe coolant in the gas phase to the outside. The incident side coolingmember 8K includes the same components and the same functions as thecomponents and the functions of the incident side cooling member 8Dexcept that the incident side cooling member 8K includes the a heattransfer member 87 and disposition of the first heat radiating member 88is different.

That is, the incident side cooling member 8K includes the main bodysection 81D, the heat transfer member 87, and the first heat radiatingmember 88.

In the incident side cooling member 8K, the first heat radiating member88 is disposed on the light emission side with respect to the firstmember 82. That is, the first heat radiating member 88 is disposed onthe opposite side of the second member 83 with respect to the firstmember 82.

When the plurality of fins 681 are provided as the plurality of finsincluded in the first heat radiating member 88, the channels provided inthe fins 681 may be inclined with respect to the +Y direction to belocated further in the +X direction or the −X direction toward the +Ydirection.

The heat transfer member 87 couples the first heat radiating section 831on the second surface 83A and the first heat radiating member 88 in aheat transferable manner and transfers, to the first heat radiatingmember 88, the heat of the coolant in the gas phase transferred from thefirst condensing section to the first heat radiating section 831. Theheat transfer member 87 may be formed by, for example, a metal sheet ormay be formed by a metal member capable of supporting the first heatradiating member 88.

The cooling gas circulated by the fan of the cooling device disposed inthe exterior housing 2 flows in the +Y direction with respect to theliquid crystal panel 9K.

The cooling gas flowing in the space on the light incident side withrespect to the liquid crystal panel 9K flows in the +Y direction andcools the incident side dustproof substrate 45 and, thereafter, coolsthe holding housing 50.

The cooling gas flowing in the space on the light emission side withrespect to the liquid crystal panel 9K flows in the +Y direction andcools the emission side dustproof substrate 48 and, thereafter, coolsthe clamping member 51.

The cooling gas flowing between the main body section 61D of theemission side cooling member 6K and the main body section 81D of theincident side cooling member 8K flows in the +Y direction and cools thefirst heat radiating members 68 and 88 and, thereafter, flows in the +Xdirection or the −X direction and flows in a direction away from theliquid crystal panel 9K.

Such a liquid crystal panel 9K achieves the following effects besidesachieving the same effects as the effects of the liquid crystal panel9D.

It is possible to prevent the cooling gas having flowed in the firstheat radiating member 68 from flowing to the emission side dustproofsubstrate 48. It is possible to prevent the cooling gas having flowed inthe first heat radiating member 88 from flowing to the incident sidedustproof substrate 45.

Accordingly, it is possible to individually circulate the cooling gashaving relatively low temperature to each of the emission side dustproofsubstrate 48 and the first heat radiating member 68 disposed in the −Ydirection with respect to the emission side dustproof substrate 48.

Similarly, it is possible to individually circulate the cooling gashaving relatively low temperature to each of the incident side dustproofsubstrate 45 and the first heat radiating member 88 disposed in the −Ydirection with respect to the incident side dustproof substrate 45.

Therefore, it is possible to efficiently cool the incident sidedustproof substrate 45, the emission side dustproof substrate 48, andthe first heat radiating members 68 and 88 and efficiently cool theliquid crystal layer 42.

In a liquid crystal panel including one emission side cooling memberamong the emission side cooling members 6D to 61, the first heatradiating member 68 or the second heat radiating member 69 disposed inthe −Y direction with respect to the opening sections 64 and 64C may bedisposed on the opposite side of the second member 63 with respect tothe first member 62. The second surface 63A and the first heat radiatingmember 68 or the second heat radiating member 69 may be coupled by theheat transfer member 67 in a heat transferable manner.

Similarly, in a liquid crystal panel including one incident side coolingmember among the incident side cooling members 8D to 8I, the first heatradiating member 88 or the second heat radiating member 89 disposed inthe −Y direction with respect to the opening sections 84 and 84C may bedisposed on the opposite side of the second member 83 with respect tothe first member 82. The second surface 63A and the first heat radiatingmember 88 or the second heat radiating member 89 may be coupled by theheat transfer member 87 in a heat transferable manner.

When the cooling gas flowing from the fan of the cooling device flows inthe −Y direction with respect to the liquid crystal panel, the firstheat radiating member 68 disposed in the +Y direction with respect tothe opening sections 64 and 64C in the emission side cooling members 6Ato 6C and 6G to 6I may be disposed in the opposite direction of thesecond member 63 with respect to the first member 62. The second surface63A and the first heat radiating member 68 may be coupled via the heattransfer member 67 in a heat transferable manner.

Similarly, when the cooling gas flowing from the cooling device flows inthe −Y direction with respect to the liquid crystal panel, the firstheat radiating member 88 disposed in the +Y direction with respect tothe opening sections 84 and 84C in the incident side cooling members 8Ato 8C and 8G to 8I may be disposed in the opposite direction of thesecond member 83 with respect to the first member 82. The second surface83A and the first heat radiating member 88 may be coupled via the heattransfer member 87 in a heat transferable manner.

One heat radiating member of the incident side heat radiating memberincluded in the incident side cooling member and the emission side heatradiating member included in the emission side cooling member may beprovided on the second member 83 side with respect to the first member82 and the other heat radiating member may be provided on the oppositeside of the second member 83 with respect to the first member 82.

In the embodiments explained above, the incident section 43 includes theincident side dustproof substrate 45 and the emission section 46includes the emission side dustproof substrate 48.

However, not only this, but the liquid crystal panel according to thepresent disclosure may not include at least one dustproof substrate ofthe incident side dustproof substrate 45 and the emission side dustproofsubstrate 48.

In the embodiments explained above, the emission side cooling members 6Ato 6I include at least one heat radiating member of the first heatradiating member 68 and the second heat radiating member 69 and theincident side cooling members 8A to 8I include at least one heatradiating member of the first heat radiating member 88 and the secondheat radiating member 89.

However, not only this, but at least one of the incident side coolingmember and the emission side cooling member may not include the heatradiating member.

That is, the heat radiating member may not be provided in the vaporchamber in the present disclosure.

In the embodiments explained above, the incident side electrodesubstrate disposed on the light incident side with respect to the liquidcrystal layer 42 is the counter substrate 44 and the emission sideelectrode substrate disposed on the light emission side with respect tothe liquid crystal layer 42 is the pixel substrate 47. However, not onlythis, but the incident side electrode substrate may be the pixelsubstrate 47 and the emission side electrode substrate may be thecounter substrate 44.

In the embodiments explained above, the projector is explained as thedevice on which the liquid crystal panels 4A to 4I, 7A to 7I, and 9A to9K are mounted. However, not only this, but the liquid crystal panelaccording to the present disclosure may be applied to, for example, astationary liquid crystal display device or may be applied to, forexample, a mobile liquid crystal display device.

Overview of the Present Disclosure

An overview of the present disclosure is noted below.

A transmissive liquid crystal panel according to a first aspect of thepresent disclosure includes: a pixel region where a plurality of pixelsare arrayed; a liquid crystal layer configured to modulate light foreach of the plurality of pixels; an incident section configured to makethe light incident on the liquid crystal layer; an emission sectionconfigured to emit, as image light, the light modulated by the liquidcrystal layer; and a vapor chamber including an opening sectioncorresponding to the pixel region, a heat receiving section providedaround the opening section, and a heat radiating section configured toradiate heat received by the heat receiving section, the vapor chambervaporizing, with the heat received by the heat receiving section, acoolant in a liquid phase encapsulated on an inside of the vapor chamberand radiating, with the heat radiating section, heat of the coolant in agas phase to thereby condense the coolant in the gas phase into thecoolant in the liquid phase.

In the vapor chamber, a pipe for circulating the coolant and a wire forsupplying driving power are unnecessary. With the configurationexplained above, compared with when a cooling device in which thecoolant flows is provided and when a thermoelectric conversion elementsuch as a Peltier element for moving heat with electric power isprovided, it is possible to simplify the configuration of thetransmissive liquid crystal panel.

Therefore, it is possible to achieve a reduction in the size of a deviceon which the transmissive liquid crystal panel is mounted.

Since it is possible to attach and detach the transmissive liquidcrystal panel to and from the device without attaching and detaching thepipe and the wire, it is possible to easily carry out replacement of thetransmissive liquid crystal panel.

Further, since the heat receiving section provided around the openingsection corresponding to the pixel region receives heat, it is possibleto improve uniformity of the temperature in the pixel region.

In the first aspect, the emission section may include a lighttransmissive emission side substrate that is coupled to the liquidcrystal layer in a heat transferable manner and through which the imagelight passes. An area of the emission side substrate may be larger thanan area of the pixel region when viewed from an emitting direction ofthe image light. The vapor chamber may be provided on the emission sidesubstrate in a heat transferable manner.

With such a configuration, since the emission side substrate is coupledto the liquid crystal layer in a heat transferable manner, the heat ofthe liquid crystal layer is transferred to the emission side substrate.

When the vapor chamber is provided on such an emission side substrate ina heat transferable manner, the heat receiving section easily receivesthe heat of the liquid crystal layer.

Therefore, it is possible to make it easy to cool the liquid crystallayer.

In the first aspect, the emission section may include a lighttransmissive emission side electrode substrate that includes an emissionside electrode electrically coupled to the liquid crystal layer and isdisposed on a light emission side with respect to the liquid crystallayer. The emission side substrate may be the emission side electrodesubstrate.

With such a configuration, the emission side electrode substrate is alight transmissive substrate directly coupled to the liquid crystallayer susceptible to heat. Since the vapor chamber is provided on suchan emission side electrode substrate, it is possible to efficientlytransfer heat generated by the liquid crystal layer to the heatreceiving section.

Therefore, it is possible to improve cooling efficiency of the liquidcrystal layer.

In the first aspect, the emission section may include an emission sidedustproof substrate provided on a surface on a light emission side inthe emission side electrode substrate. The emission side dustproofsubstrate may include a side surface that couples a surface on a lightincident side in the emission side dustproof substrate and the surfaceon the light emission side in the emission side dustproof substrate. Theheat receiving section may receive heat from the surface on the lightemission side in the emission side electrode substrate and the sidesurface in the emission side dustproof substrate.

With such a configuration, since the heat receiving section receives theheat from each of the emission side electrode substrate and the emissionside dustproof substrate, it is possible to transfer the heat of theliquid crystal layer to the heat receiving section via each of theemission side electrode substrate and the emission side dustproofsubstrate.

Therefore, since the heat of the liquid crystal layer can be efficientlytransferred to the heat receiving section, it is possible to improve thecooling efficiency of the liquid crystal layer.

In the first aspect, the emission section may include: a lighttransmissive emission side electrode substrate that includes an emissionside electrode electrically coupled to the liquid crystal layer and isdisposed on a light emission side with respect to the liquid crystallayer; and an emission side dustproof substrate provided on a surface onthe light emission side in the emission side electrode substrate. Theemission side substrate may be the emission side dustproof substrate.

With such a configuration, the vapor chamber is provided, in a heattransferable manner, on the emission side dustproof substrate providedfurther on the light emission side than the emission side electrodesubstrate.

Accordingly, compared with when the vapor chamber is provided on theemission side electrode substrate to avoid the emission side dustproofsubstrate, it is possible to easily couple the vapor chamber to theemission section.

Since the heat generated by the liquid crystal layer is transferred tothe emission side dustproof substrate via the emission side electrodesubstrate, the heat of the liquid crystal layer diffuses.

In contrast, since the vapor chamber is provided on the surface on thelight emission side in the emission side dustproof substrate, it ispossible to make it easy to transfer the heat of the liquid crystallayer to the heat receiving section.

In the first aspect, the vapor chamber may be provided on a surface onthe light emission side of the emission side dustproof substrate.

With such a configuration, for example, compared with when the emissionside dustproof substrate is disposed in the opening sectioncorresponding to the pixel region, even when tolerance occurs in thevapor chamber, it is possible to easily attach the vapor chamber to theemission section.

In the first aspect, the emission side dustproof substrate may include aside surface that couples a surface on a light incident side in theemission side dustproof substrate and a surface on the light emissionside in the emission side dustproof substrate. An inner circumferentialsurface of the opening section may be coupled to at least a part of theside surface in the emission side dustproof substrate in a heattransferable manner.

With such a configuration, the heat of the liquid crystal layertransferred to the emission side dustproof substrate can be received bythe inner circumferential surface of the opening section.

Accordingly, compared with when the vapor chamber is provided such thatthe heat receiving section is coupled to the surface on the lightemission side in the emission side dustproof substrate, it is possibleto prevent the dimension of the transmissive liquid crystal panel in alight passing direction from increasing.

In the first aspect, the heat receiving section may be coupled to theemission side electrode substrate in a heat transferable manner.

With such a configuration, not only heat is transferred to the heatreceiving section from the side surface of the emission side dustproofsubstrate but also heat is transferred to the heat receiving sectionfrom the emission side electrode substrate.

Accordingly, since it is possible to make it easy to transfer the heatof the liquid crystal layer to the heat receiving section, it ispossible to improve the cooling efficiency of the liquid crystal layer.

In the first aspect, the emission side electrode substrate may be apixel substrate that includes, as the emission side electrode, aplurality of pixel electrodes provided to respectively correspond to theplurality of pixels and is disposed on the light emission side withrespect to the liquid crystal layer.

In a general transmissive liquid crystal panel, a counter substrate isdisposed on a light incident side with respect to a liquid crystal layerand a pixel substrate is disposed on a light emission side with respectto the liquid crystal layer.

Accordingly, since the emission side electrode substrate is the pixelsubstrate, the transmissive liquid crystal panel according to thepresent disclosure can be configured by providing the vapor chamberhaving the configuration explained above in the general transmissiveliquid crystal panel.

Therefore, it is possible to easily configure the transmissive liquidcrystal panel according to the present disclosure.

In the first aspect, the incident section may include a lighttransmissive incident side substrate that is coupled to the liquidcrystal layer in a heat transferable manner and through which the lightmade incident on the liquid crystal layer passes. An area of theincident side substrate may be larger than an area of the pixel regionwhen viewed from an opposite direction of a traveling direction of thelight made incident on the liquid crystal layer. The vapor chamber maybe provided on the incident side substrate in a heat transferablemanner.

With such a configuration, since the incident side substrate is coupledto the liquid crystal layer in a heat transferable manner, the heat ofthe liquid crystal layer is transferred to the incident side substrate.Since the vapor chamber is provided on such an incident side substratein a heat transferable manner, the heat receiving section easilyreceives the heat of the liquid crystal layer.

Therefore, it is possible to make it easy to cool the liquid crystallayer.

In the first aspect, the incident section may include a lighttransmissive incident side electrode substrate that includes an incidentside electrode electrically coupled to the liquid crystal layer and isdisposed on a light incident side with respect to the liquid crystallayer. The incident side substrate may be the incident side electrodesubstrate.

With such a configuration, the incident side electrode substrate is alight transmissive substrate directly coupled to the liquid crystallayer susceptible to heat. Since the vapor chamber is provided on suchan emission side electrode substrate, it is possible to efficientlytransfer heat generated by the liquid crystal layer to the heatreceiving section.

Therefore, it is possible to improve the cooling efficiency of theliquid crystal layer.

In the first aspect, the incident section may include an incident sidedustproof substrate provided on a surface on the light incident side inthe incident side electrode substrate. The incident side dustproofsubstrate may include a side surface that couples a surface on the lightincident side in the incident side dustproof substrate and a surface ona light emission side in the incident side dustproof substrate. The heatreceiving section may receive heat from the surface on the lightincident side in the incident side electrode substrate and the sidesurface in the incident side dustproof substrate.

With such a configuration, since the heat receiving section receivesheat from each of the incident side electrode substrate and the incidentside dustproof substrate, the heat of the liquid crystal layer can betransferred to the heat receiving section via each of the incident sideelectrode substrate and the incident side dustproof substrate.

Therefore, since the heat of the liquid crystal layer can be efficientlytransferred to the heat receiving section, it is possible to improve thecooling efficiency of the liquid crystal layer.

In the first aspect, the incident section may include: a lighttransmissive incident side electrode substrate that includes an incidentside electrode electrically coupled to the liquid crystal layer and isdisposed on a light incident side with respect to the liquid crystallayer; and an incident side dustproof substrate provided on a surface onthe light incident side in the incident side electrode substrate. Theincident side substrate may be the incident side dustproof substrate.

With such a configuration, the vapor chamber is provided, in a heattransferable manner, on the incident side dustproof substrate providedfurther on the light incident side than the incident side electrodesubstrate.

Accordingly, compared with when the vapor chamber is provided on theincident side electrode substrate to avoid the incident side dustproofsubstrate, it is possible to easily couple the vapor chamber to theincident section.

Since heat generated by the liquid crystal layer is transferred to theemission side dustproof substrate via the incident side electrodesubstrate, the heat of the liquid crystal layer diffuses.

In contrast, since the vapor chamber is provided on the surface on thelight incident side in the incident side dustproof substrate, it ispossible to make it easy to transfer the heat of the liquid crystallayer to the heat receiving section.

In the first aspect, the vapor chamber may be provided on a surface onthe light incident side of the incident side dustproof substrate.

With such a configuration, for example, compared with when the incidentside dustproof substrate is disposed in the opening sectioncorresponding to the pixel region, even when tolerance occurs in thevapor chamber, it is possible to easily attach the vapor chamber to theincident section.

In the first aspect, the incident side dustproof substrate may include aside surface that couples a surface on the light incident side in theincident side dustproof substrate and a surface on a light emission sidein the incident side dustproof substrate. An inner circumferentialsurface of the opening section may be in contact with at least a part ofthe side surface in the incident side dustproof substrate in a heattransferable manner.

With such a configuration, the heat of the liquid crystal layertransferred to the incident side dustproof substrate can be received bythe inner edge of the opening section.

Accordingly, compared with when the vapor chamber is provided such thatthe heat receiving section is coupled to the surface on the lightincident side in the incident side dustproof substrate, it is possibleto prevent the dimension of the transmissive liquid crystal panel in thelight passing direction from increasing.

In the first aspect, the heat receiving section may be coupled to theincident side electrode substrate in a heat transferable manner.

With such a configuration, not only heat is transferred to the heatreceiving section from the side surface of the incident side dustproofsubstrate but also heat is transferred to the heat receiving sectionfrom the incident side electrode substrate.

Accordingly, since it is possible to make it easy to transfer the heatof the liquid crystal layer to the heat receiving section, it ispossible to improve the cooling efficiency of the liquid crystal layer.

In the first aspect, the incident side electrode substrate may be acounter substrate including, as the incident side electrode, a commonelectrode provided to correspond to the pixel region.

As explained above, in the general transmissive liquid crystal panel,the counter substrate is disposed on the light incident side withrespect to the liquid crystal layer and the pixel substrate is disposedon the light emission side with respect to the liquid crystal layer.

Accordingly, since the incident side electrode substrate is the countersubstrate, the transmissive liquid crystal panel according to thepresent disclosure can be configured by providing the vapor chamberhaving the configuration explained above in the general transmissiveliquid crystal panel.

Therefore, it is possible to easily configure the transmissive liquidcrystal panel according to the present disclosure.

In the first aspect, the transmissive liquid crystal panel may furtherinclude a wire configured to supply an image signal for driving theliquid crystal layer, and the vapor chamber may extend from the openingsection in an extending direction of the wire from the liquid crystallayer.

With such a configuration, for example, compared with when the vaporchamber extends in the opposite direction of the extending direction ofthe wire from the opening section, it is possible to prevent an increasein the size of the transmissive liquid crystal panel.

In the first aspect, the transmissive liquid crystal panel may furtherinclude a wire configured to supply an image signal for driving theliquid crystal layer, and the vapor chamber may extend from the openingsection in an opposite direction of an extending direction of the wirefrom the liquid crystal layer.

With such a configuration, since it is possible to prevent the wire andthe vapor chamber from interfering with each other, it is possible toprevent heat radiation by the vapor chamber from being hindered by thewire.

In the first aspect, the transmissive liquid crystal panel may furtherinclude a wire configured to supply an image signal for driving theliquid crystal layer, and the vapor chamber may extend from the openingsection in each of an extending direction of the wire from the liquidcrystal layer and an opposite direction of the extending direction.

With such a configuration, since it is possible to increase a heatradiation area of heat received from the coolant in the gas phase in thevapor chamber, it is possible to make it easy to condense the coolant inthe gas phase into the coolant in the liquid phase.

Therefore, it is possible to circulate the coolant in the liquid phaseto the heat receiving section without delay. It is possible toaccelerate the vaporization of the coolant in the liquid phase by theheat of the liquid crystal layer.

When the transmissive liquid crystal panel is disposed such that one ofthe extending direction of the wire and the opposite direction of theextending direction of the wire is the vertical direction upper side,the condensed coolant in the liquid phase can be transported to, by notonly the capillarity but also the gravity, a portion that vaporizes thecoolant in the liquid phase.

Consequently, the change from the coolant in the liquid phase to thecoolant in the gas phase by the heat received by the heat receivingsection can be accelerated.

Therefore, it is possible to improve heat radiation efficiency of theheat of the liquid crystal layer and the cooling efficiency of theliquid crystal layer.

In the first aspect, the transmissive liquid crystal panel may furtherinclude a heat radiating member provided in the vapor chamber andconfigured to radiate the heat transferred from the heat radiatingsection. The heat radiating member may be provided, with respect to theopening section, in a direction in which the vapor chamber extends fromthe opening section.

With such a configuration, it is possible to separate a heat generatingbody coupled to the heat receiving section and the heat radiatingmember.

Consequently, it is possible to prevent the heat transferred to the heatradiating member from affecting the heat generating body.

A transmissive liquid crystal panel according to a second aspect of thepresent disclosure includes: a pixel region where a plurality of pixelsare arrayed; a liquid crystal layer configured to modulate light foreach of the plurality of pixels; a counter substrate including a commonelectrode provided to correspond to the pixel region; a pixel substrateincluding a plurality of pixel electrodes provided to respectivelycorrespond to the plurality of pixels, the pixel substrate carrying theliquid crystal layer between the pixel substrate and the countersubstrate; a first dustproof substrate provided on a surface on anopposite side of the pixel substrate in the counter substrate; and asecond dustproof substrate provided on a surface on an opposite side ofthe counter substrate in the pixel substrate.

The transmissive liquid crystal panel further includes a first vaporchamber including a first opening section corresponding to the pixelregion, a first heat receiving section provided around the first openingsection and coupled to at least one of the counter substrate and thefirst dustproof substrate in a heat transferable manner, and a firstheat radiating section configured to radiate heat received by the firstheat receiving section, the first vapor chamber vaporizing, with theheat received by the first heat receiving section, a first coolant in aliquid phase encapsulated on an inside of the first vapor chamber andradiating, with the first heat radiating section, heat of the firstcoolant in a gas phase to thereby condense the first coolant in the gasphase into the first coolant in the liquid phase.

The transmissive liquid crystal panel further includes a second vaporchamber including a second opening section corresponding to the pixelregion, a second heat receiving section provided around the secondopening section and coupled to at least one of the pixel substrate andthe second dustproof substrate in a heat transferable manner, and asecond heat radiating section configured to radiate heat received by thesecond heat receiving section, the second vapor chamber vaporizing, withthe heat received by the second heat receiving section, a second coolantin the liquid phase encapsulated on an inside of the second vaporchamber and radiating, with the second heat radiating section, heat ofthe second coolant in the gas phase to thereby condense the secondcoolant in the gas phase into the second coolant in the liquid phase.

With such a configuration, it is possible to achieve the same effects asthe effects of the transmissive liquid crystal panel according to thefirst aspect.

Since the transmissive liquid crystal panel includes the first vaporchamber coupled to at least one of the counter substrate and the firstdustproof substrate in a heat transferable manner and the second vaporchamber coupled to at least one of the pixel substrate and the seconddustproof substrate in a heat transferable manner, it is possible tofurther improve the cooling efficiency of the liquid crystal layer.

In the second aspect, the first vapor chamber may extend further to anouter side than the counter substrate and the first dustproof substratewhen viewed from an incident side of light made incident on the liquidcrystal layer. The second vapor chamber may extend further to the outerside than the pixel substrate and the second dustproof substrate whenviewed from an emission side of light emitted from the liquid crystallayer. The first vapor chamber and the second vapor chamber may beopposed to each other in a light incident direction with respect to theliquid crystal layer.

With such a configuration, compared with when the first vapor chamberand the second vapor chamber are not opposed to each other, it ispossible to prevent an increase in the size of the transmissive liquidcrystal panel.

What is claimed is:
 1. A transmissive liquid crystal panel comprising: apixel region where a plurality of pixels are arrayed; a liquid crystallayer configured to modulate light for each of the plurality of pixels;an incident section configured to make the light incident on the liquidcrystal layer; an emission section configured to emit, as image light,the light modulated by the liquid crystal layer; and a vapor chamberincluding an opening section corresponding to the pixel region, a heatreceiving section provided around the opening section, and a heatradiating section configured to radiate heat received by the heatreceiving section, the vapor chamber vaporizing, with the heat receivedby the heat receiving section, a coolant in a liquid phase encapsulatedon an inside of the vapor chamber and radiating, with the heat radiatingsection, heat of the coolant in a gas phase to thereby condense thecoolant in the gas phase into the coolant in the liquid phase.
 2. Thetransmissive liquid crystal panel according to claim 1, wherein theemission section includes a light transmissive emission side substratethat is coupled to the liquid crystal layer in a heat transferablemanner and through which the image light passes, an area of the emissionside substrate is larger than an area of the pixel region when viewedfrom an emitting direction of the image light, and the vapor chamber isprovided on the emission side substrate in a heat transferable manner.3. The transmissive liquid crystal panel according to claim 2, whereinthe emission section includes a light transmissive emission sideelectrode substrate that includes an emission side electrodeelectrically coupled to the liquid crystal layer and is disposed on alight emission side with respect to the liquid crystal layer, and theemission side substrate is the emission side electrode substrate.
 4. Thetransmissive liquid crystal panel according to claim 2, wherein theemission section includes: a light transmissive emission side electrodesubstrate that includes an emission side electrode electrically coupledto the liquid crystal layer and is disposed on a light emission sidewith respect to the liquid crystal layer; and an emission side dustproofsubstrate provided on a surface on the light emission side in theemission side electrode substrate, and the emission side substrate isthe emission side dustproof substrate.
 5. The transmissive liquidcrystal panel according to claim 4, wherein the vapor chamber isprovided on a surface on the light emission side of the emission sidedustproof substrate.
 6. The transmissive liquid crystal panel accordingto claim 4, wherein the emission side dustproof substrate includes aside surface that couples a surface on a light incident side in theemission side dustproof substrate and a surface on the light emissionside in the emission side dustproof substrate, and an innercircumferential surface of the opening section is coupled to at least apart of the side surface in the emission side dustproof substrate in aheat transferable manner.
 7. The transmissive liquid crystal panelaccording to claim 6, wherein the heat receiving section is coupled tothe emission side electrode substrate in a heat transferable manner. 8.The transmissive liquid crystal panel according to claim 3, wherein theemission side electrode substrate is a pixel substrate that includes, asthe emission side electrode, a plurality of pixel electrodes provided torespectively correspond to the plurality of pixels and is disposed onthe light emission side with respect to the liquid crystal layer.
 9. Thetransmissive liquid crystal panel according to claim 1, wherein theincident section includes a light transmissive incident side substratethat is coupled to the liquid crystal layer in a heat transferablemanner and through which the light made incident on the liquid crystallayer passes, an area of the incident side substrate is larger than anarea of the pixel region when viewed from an opposite direction of atraveling direction of the light made incident on the liquid crystallayer, and the vapor chamber is provided on the incident side substratein a heat transferable manner.
 10. The transmissive liquid crystal panelaccording to claim 9, wherein the incident section includes a lighttransmissive incident side electrode substrate that includes an incidentside electrode electrically coupled to the liquid crystal layer and isdisposed on a light incident side with respect to the liquid crystallayer, and the incident side substrate is the incident side electrodesubstrate.
 11. The transmissive liquid crystal panel according to claim10, wherein the incident section includes an incident side dustproofsubstrate provided on a surface on the light incident side in theincident side electrode substrate, the incident side dustproof substrateincludes a side surface that couples a surface on the light incidentside in the incident side dustproof substrate and a surface on a lightemission side in the incident side dustproof substrate, and the heatreceiving section receives heat from the surface on the light incidentside in the incident side electrode substrate and the side surface inthe incident side dustproof substrate.
 12. The transmissive liquidcrystal panel according to claim 9, wherein the incident sectionincludes: a light transmissive incident side electrode substrate thatincludes an incident side electrode electrically coupled to the liquidcrystal layer and is disposed on a light incident side with respect tothe liquid crystal layer; and an incident side dustproof substrateprovided on a surface on the light incident side in the incident sideelectrode substrate, and the incident side substrate is the incidentside dustproof substrate.
 13. The transmissive liquid crystal panelaccording to claim 12, wherein the vapor chamber is provided on asurface on the light incident side of the incident side dustproofsubstrate.
 14. The transmissive liquid crystal panel according to claim12, wherein the incident side dustproof substrate includes a sidesurface that couples a surface on the light incident side in theincident side dustproof substrate and a surface on a light emission sidein the incident side dustproof substrate, and an inner circumferentialsurface of the opening section is in contact with at least a part of theside surface in the incident side dustproof substrate in a heattransferable manner.
 15. The transmissive liquid crystal panel accordingto claim 14, wherein the heat receiving section is coupled to theincident side electrode substrate in a heat transferable manner.
 16. Thetransmissive liquid crystal panel according to claim 10, wherein theincident side electrode substrate is a counter substrate including, asthe incident side electrode, a common electrode provided to correspondto the pixel region.
 17. A transmissive liquid crystal panel comprising:a pixel region where a plurality of pixels are arrayed; a liquid crystallayer configured to modulate light for each of the plurality of pixels;a counter substrate including a common electrode provided to correspondto the pixel region; a pixel substrate including a plurality of pixelelectrodes provided to respectively correspond to the plurality ofpixels, the pixel substrate carrying the liquid crystal layer betweenthe pixel substrate and the counter substrate; a first dustproofsubstrate provided on a surface on an opposite side of the pixelsubstrate in the counter substrate; a second dustproof substrateprovided on a surface on an opposite side of the counter substrate inthe pixel substrate; a first vapor chamber including a first openingsection corresponding to the pixel region, a first heat receivingsection provided around the first opening section and coupled to atleast one of the counter substrate and the first dustproof substrate ina heat transferable manner, and a first heat radiating sectionconfigured to radiate heat received by the first heat receiving section,the first vapor chamber vaporizing, with the heat received by the firstheat receiving section, a first coolant in a liquid phase encapsulatedon an inside of the first vapor chamber and radiating, with the firstheat radiating section, heat of the first coolant in a gas phase tothereby condense the first coolant in the gas phase into the firstcoolant in the liquid phase; and a second vapor chamber including asecond opening section corresponding to the pixel region, a second heatreceiving section provided around the second opening section and coupledto at least one of the pixel substrate and the second dustproofsubstrate in a heat transferable manner, and a second heat radiatingsection configured to radiate heat received by the second heat receivingsection, the second vapor chamber vaporizing, with the heat received bythe second heat receiving section, a second coolant in the liquid phaseencapsulated on an inside of the second vapor chamber and radiating,with the second heat radiating section, heat of the second coolant inthe gas phase to thereby condense the second coolant in the gas phaseinto the second coolant in the liquid phase.
 18. The transmissive liquidcrystal panel according to claim 17, wherein the first vapor chamberextends further to an outer side than the counter substrate and thefirst dustproof substrate when viewed from an incident side of lightmade incident on the liquid crystal layer, the second vapor chamberextends further to the outer side than the pixel substrate and thesecond dustproof substrate when viewed from an emission side of lightemitted from the liquid crystal layer, and the first vapor chamber andthe second vapor chamber are opposed to each other in a light incidentdirection with respect to the liquid crystal layer.